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    • 81. 发明申请
    • PULL DOWN BED WITH AUTOMATIC LOCKING DEVICE
    • 带自动锁定装置的下拉床
    • US20120060279A1
    • 2012-03-15
    • US13264677
    • 2010-04-21
    • Luigi Colombo
    • Luigi Colombo
    • A47C17/52
    • A47C17/52A47C17/38
    • A pull down bed with automatic locking device has a movable framework, which constitutes a mattress frame, and is hinged to a container body, which constitutes a piece of furniture, so as to define a closed position, in which said mattress frame is substantially inside the piece of furniture, and an open position, for use as a bed, in which the mattress frame is in a horizontal position and rests on the ground by means of two feet. The mattress frame is hinged to the piece of furniture at one end and has its feet at the other end. The pull down bed includes a device for locking said mattress frame in the closed or horizontal position, which is actuated by an actuation device, which includes the feet.
    • 具有自动锁定装置的下拉床具有可移动的框架,其构成床垫框架,并铰接到构成一件家具的容器主体上,以限定关闭位置,其中所述床垫框架基本上在其内 家具和开放位置,用作床,其中床垫框架处于水平位置,并通过两个脚搁置在地面上。 床垫框架在一端铰接到一件家具,另一端有脚。 下拉床包括用于将所述床垫框架锁定在封闭或水平位置的装置,其由包括脚的致动装置致动。
    • 83. 发明申请
    • SYNTHESIZING GRAPHENE FROM METAL-CARBON SOLUTIONS USING ION IMPLANTATION
    • 使用离子植入法合成来自金属碳解决方案的石墨
    • US20100224851A1
    • 2010-09-09
    • US12706116
    • 2010-02-16
    • Luigi ColomboRobert M. WallaceRodney S. Ruoff
    • Luigi ColomboRobert M. WallaceRodney S. Ruoff
    • H01L29/15C04B35/536H01L21/20
    • H01L21/02612H01L21/02527
    • A method and semiconductor device for synthesizing graphene using ion implantation of carbon. Carbon is implanted in a metal using ion implantation. After the carbon is distributed in the metal, the metal is annealed and cooled in order to precipitate the carbon from the metal to form a layer of graphene on the surface of the metal. The metal/graphene surface is then transferred to a dielectric layer in such a manner that the graphene layer is placed on top of the dielectric layer. The metal layer is then removed. Alternatively, recessed regions are patterned and etched in a dielectric layer located on a substrate. Metal is later formed in these recessed regions. Carbon is then implanted into the metal using ion implantation. The metal may then be annealed and cooled in order to precipitate the carbon from the metal to form a layer of graphene on the metal's surface.
    • 一种使用碳的离子注入合成石墨烯的方法和半导体器件。 使用离子注入将碳注入金属中。 在碳分布在金属中之后,对金属进行退火和冷却,以便从金属沉淀碳以在金属表面上形成一层石墨烯。 然后将金属/石墨烯表面转移到电介质层,使得石墨烯层被放置在电介质层的顶部上。 然后去除金属层。 或者,将凹陷区域图案化并蚀刻在位于基底上的电介质层中。 金属后来形成在这些凹陷区域。 然后使用离子注入将碳注入到金属中。 然后可以对金属进行退火和冷却,以便从金属沉淀碳以在金属表面上形成一层石墨烯。
    • 86. 发明申请
    • INTEGRATION METHOD FOR DUAL DOPED POLYSILICON GATE PROFILE AND CD CONTROL
    • 双重多晶硅门型材和CD控制的集成方法
    • US20090104745A1
    • 2009-04-23
    • US11877124
    • 2007-10-23
    • Hyesook HongLuigi ColomboJinhan Choi
    • Hyesook HongLuigi ColomboJinhan Choi
    • H01L21/336
    • H01L21/28123H01L21/823842
    • In accordance with the present teachings, methods of making dual doped polysilicon gates are provided. The method can include providing a semiconductor structure including a plurality of polysilicon gates having a first critical dimension disposed over a dielectric layer and planarizing the plurality of polysilicon gates with a spin-on material to form a plurality of planarized polysilicon gates. The method can further include doping an exposed first region with p-type dopants to form a plurality of p-doped planarized polysilicon gates and doping an exposed second region with n-type dopants to form a plurality of n-doped planarized polysilicon gates. The method can also include removing the spin-on material to form a plurality of p-doped polysilicon gates and a plurality of n-doped polysilicon gates, wherein critical dimension of each of the plurality of n-doped polysilicon gates and the plurality of p-doped polysilicon gates are substantially similar to the first critical dimension.
    • 根据本教导,提供制造双掺杂多晶硅栅极的方法。 该方法可以包括提供包括多个多晶硅栅极的半导体结构,该多晶硅栅极具有设置在电介质层上的第一临界尺寸,并且用旋涂材料平坦化多个多晶硅栅极以形成多个平坦化的多晶硅栅极。 该方法还可以包括用p型掺杂剂掺杂暴露的第一区域以形成多个p掺杂的平坦化多晶硅栅极,并用n型掺杂剂掺杂暴露的第二区域以形成多个n掺杂的平坦化多晶硅栅极。 该方法还可以包括去除旋涂材料以形成多个p掺杂多晶硅栅极和多个n掺杂多晶硅栅极,其中多个n掺杂多晶硅栅极和多个p掺杂多晶硅栅极中的每一个的临界尺寸 掺杂的多晶硅栅极基本上类似于第一临界尺寸。