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    • 81. 发明申请
    • ACCELERATION SENSOR
    • 加速传感器
    • US20090100932A1
    • 2009-04-23
    • US12254113
    • 2008-10-20
    • Roland SCHEUERERHeribert Weber
    • Roland SCHEUERERHeribert Weber
    • G01P15/125
    • G01P15/0802G01P15/125
    • An acceleration sensor having a mass which is movably supported outside its center of gravity, first electrodes on the mass and second electrodes located at a distance therefrom forming a capacitive sensor in order to determine a change in position of the mass as a function of time. At least one spring element which generates a restoring force when the mass is deflected from its neutral position is provided on the side of the mass facing the capacitive sensor. The mass may be obtained by being exposed from a material layer, and the mass is surrounded, at least at its side faces, by this material.
    • 一种加速度传感器,其具有可移动地支撑在其重心外部的质量,质量上的第一电极和距离形成电容传感器的距离之外的第二电极,以便确定作为时间的函数的质量位置的变化。 当质量从其中立位置偏转时产生恢复力的至少一个弹簧元件设置在面向电容传感器的物体侧。 质量可以通过从材料层暴露而获得,并且质量至少在其侧面被该材料包围。
    • 89. 发明授权
    • Hybrid integrated component and method for the manufacture thereof
    • 混合集成组件及其制造方法
    • US08823116B2
    • 2014-09-02
    • US13915249
    • 2013-06-11
    • Heribert Weber
    • Heribert Weber
    • H01L29/84
    • B81B3/0018B81B2201/0257B81C1/00158B81C1/00246B81C2203/0109B81C2203/0735B81C2203/0771H01L2224/11H04R2201/003
    • A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function. The MEMS element is mounted on the ASIC element, so that a gap exists between the micromechanical structure and the back-end stack of the ASIC element. The cap wafer is mounted above the micromechanical structure of the MEMS element. A pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, which diaphragm structure spans a pressure connection in the rear side of the ASIC element.
    • 混合集成部件包括:具有集成电路元件和后端叠层的至少一个ASIC元件; 具有微机械结构的MEMS元件,其在MEMS基板的整个厚度上延伸; 和盖片。 混合集成组件具有额外的微机械功能。 MEMS元件安装在ASIC元件上,使得在微机械结构和ASIC元件的后端堆叠之间存在间隙。 盖晶片安装在MEMS元件的微机械结构上方。 在ASIC元件的后端堆叠中实现具有电容器系统的至少一个可偏转电极的压敏膜结构,该隔膜结构跨越ASIC元件后侧的压力连接。
    • 90. 发明授权
    • Hybrid integrated pressure sensor component
    • 混合集成压力传感器组件
    • US08779536B2
    • 2014-07-15
    • US14044223
    • 2013-10-02
    • Heribert Weber
    • Heribert Weber
    • B81B3/00
    • B81B3/0021B81B2201/0264B81C1/00246B81C2203/0714B81C2203/0771G01L9/0073
    • A pressure sensor component includes a MEMS component having at least one pattern element that is able to be deflected perpendicular to the component plane, which is equipped with at least one electrode of a measuring capacitor device, and an ASIC component having integrated circuit elements and at least one back end stack, at least one counter-electrode of the measuring capacitor device being developed in a metallization plane of the back end stack. The MEMS component is mounted on the back end pile of the ASIC component. The MEMS component includes at least one pressure-sensitive diaphragm pattern and is mounted on the ASIC component in such a way that the pressure-sensitive diaphragm pattern spans a cavity between the MEMS component and the back end stack of the ASIC component.
    • 压力传感器部件包括具有至少一个能够垂直于部件平面偏转的图案元件的MEMS部件,该元件平面配备有测量电容器装置的至少一个电极和具有集成电路元件的ASIC部件 至少一个后端堆叠,所述测量电容器装置的至少一个对电极在后端堆叠的金属化平面中显影。 MEMS组件安装在ASIC组件的后端堆上。 MEMS部件包括至少一个压敏光阑图案,并且以这样的方式安装在ASIC部件上,使得压敏光阑图案跨越MEMS部件和ASIC部件的后端垛之间的空腔。