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    • 81. 发明申请
    • Apparatus for Measuring a Mechanical Quantity
    • 机械量测量装置
    • US20090007686A1
    • 2009-01-08
    • US12210261
    • 2008-09-15
    • Takashi SUMIGAWAHiroyuki Ohta
    • Takashi SUMIGAWAHiroyuki Ohta
    • G01B7/16
    • G01B7/18G01B7/16G01B7/20G01L1/2206G01L1/2262G01L5/0047
    • An apparatus structure and measurement method are provided to retain high precision and high reliability of a semiconductor mechanical quantity measuring apparatus which senses a mechanical quantity and transmits measured information wirelessly. As to a silicon substrate of the semiconductor mechanical quantity measuring apparatus, for example, a ratio of a substrate thickness to a substrate length along a measurement direction is set small, and a ratio of a substrate thickness to a substrate length along a direction perpendicular to the measurement direction is set small. The apparatus upper surface is covered with a protective member. It is possible to measure a strain along a particular direction and realize mechanical quantity measurement with less error and high precision. An impact resistance and environment resistance of the apparatus itself can be improved.
    • 提供了一种装置结构和测量方法,以保持半导体机械量测量装置的高精度和高可靠性,该装置检测机械量并无线传送测量信息。 对于半导体机械量测量装置的硅衬底,例如,沿着测量方向将衬底厚度与衬底长度的比率设置得较小,并且沿着垂直于半导体机械量测量装置的方向的衬底厚度与衬底长度的比率 测量方向设定得很小。 设备上表面被保护构件覆盖。 可以测量特定方向的应变,实现误差小,精度更高的机械量测量。 可以提高装置本身的耐冲击性和耐环境性。
    • 83. 发明授权
    • Apparatus for measuring a mechanical quantity
    • 用于测量机械量的装置
    • US07430920B2
    • 2008-10-07
    • US11303730
    • 2005-12-16
    • Takashi SumigawaHiroyuki Ohta
    • Takashi SumigawaHiroyuki Ohta
    • G01B7/16
    • G01B7/18G01B7/16G01B7/20G01L1/2206G01L1/2262G01L5/0047
    • An apparatus structure and measurement method are provided to retain high precision and high reliability of a semiconductor mechanical quantity measuring apparatus which senses a mechanical quantity and transmits measured information wirelessly. As to a silicon substrate of the semiconductor mechanical quantity measuring apparatus, for example, a ratio of a substrate thickness to a substrate length along a measurement direction is set small, and a ratio of a substrate thickness to a substrate length along a direction perpendicular to the measurement direction is set small. The apparatus upper surface is covered with a protective member. It is possible to measure a strain along a particular direction and realize mechanical quantity measurement with less error and high precision. An impact resistance and environment resistance of the apparatus itself can be improved.
    • 提供了一种装置结构和测量方法,以保持半导体机械量测量装置的高精度和高可靠性,该装置检测机械量并无线传送测量信息。 对于半导体机械量测量装置的硅衬底,例如,沿着测量方向将衬底厚度与衬底长度的比率设置得较小,并且沿着垂直于半导体机械量测量装置的方向的衬底厚度与衬底长度的比率 测量方向设定得很小。 设备上表面被保护构件覆盖。 可以测量特定方向的应变,实现误差小,精度更高的机械量测量。 可以提高装置本身的耐冲击性和耐环境性。