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81. 发明专利

JPS63204634A SURFACE PACKAGING TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63204634A
公开(公告)日：1988-08-24
申请号：JP3552387
申请日：1987-02-20
申请人： HITACHI LTD
发明人： HOSHI AKIRO , ENOMOTO USUKE
IPC分类号： H01L23/48 , H01L23/50 , H05K1/18 , H05K3/34
摘要： PURPOSE:To improve a solder packaging property by a method wherein the title semiconductor device is constituted in such a way that surfaces, on which sags generated by punching out a lead frame exist, are used as the sides of the packaging surfaces of the semiconductor device and surfaces, on which burrs exist, become the upper surface sides to become reverse to the packaging surfaces of the semiconductor device. CONSTITUTION:Packaging surfaces 13 of fixing parts 12 become surfaces, on which sags 2 generated by punching out a lead frame exist, and surfaces, on which burrs 4 are generated, become the upper surfaces to become reverse to the packaging surfaces 13. In case a molded minitransistor 10 is packaged, the packaging surfaces 13, on which the sags 2 exist, of the leads 1 are superposed on a solder cream 7 provided in a wiring layer 6 of a wiring board 5. After that, the solder cream 7 is fused by reflowing, is turned into a solder 9, the solder 9 mixes with solders 3 adhered on the leads 1 and the fused solder 9 in the lower direction is reliably sucked up to the leads 1 by the surface tension of the solders 3, in particular by the surface tension of the solders 3 including even the solders 3 on the sides of the flashes 4 of the leads 1. Thereby, the solder 9 (the solders 3) creeps over the whole periphery of each lead 1 and a good solder packaging can be conducted.

82. 发明专利

JPS6316629A RESIN MOLDING METHOD AND MOLDED MATERIAL 失效
公开(公告)号：JPS6316629A
公开(公告)日：1988-01-23
申请号：JP15960686
申请日：1986-07-09
申请人： HITACHI LTD
发明人： KUBO HIROSHI , HOSHI AKIRO
IPC分类号： H01L23/48 , H01L21/56 , H01L23/50
摘要： PURPOSE:To enable a high-reliability semiconductor device to be obtained with good yield, by disposing air vents on a plurality of sides of cavities so that voids can be prevented from being formed inside a molded resin, together with avoiding short filling of resin. CONSTITUTION:A melting resin 10 is injected as shown by arrows of full lines in process of resin molding. Air existing in cavities of a molding metallic mold is exhausted from air vents of the molding iron mold as shown in two-dot chain lines and besides from air vents 9 formed on respective dams 5 of a lead frame 1. Because the air is thus exhausted from three sides of these air vents of the cavities shaped in rectangles, the air is effectively drawn out with out remaining in the cavities. Resultantly voids are hardly generated inside a package 8, and the recessed parts or the like are prevented from being generat ed on the surface of the package 8 due to the remaining foams. Thus, short filling of resin also hardly occurs.

83. 发明专利

JPS62219628A ELECTRONIC DEVICE AND ITS MANUFACTURING APPARATUS 失效
公开(公告)号：JPS62219628A
公开(公告)日：1987-09-26
申请号：JP6052286
申请日：1986-03-20
申请人： HITACHI LTD
发明人： ISHII SHIGERU , SHIMIZU KAZUO , HOSHI AKIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To avoid a corrosion due to a moisture by coating a bonding wire and its bonding parts with antioxidant films. CONSTITUTION:One end of bonding wires 10 consisting of copper at a pellet 8 is bonded respectively on each electrode pad 9 consisting of aluminium and respective other ends of the bonding wires 10 are also bonded on respective parts which are subjected to bonding at respective inner leads 5. Further, faces of bonding parts in a copper wire 10 and its both ends are coated with antioxidant films 3 using wire bonding apparatus.

84. 发明专利

JPS62195152A ELECTRONIC DEVICE 失效
公开(公告)号：JPS62195152A
公开(公告)日：1987-08-27
申请号：JP3511586
申请日：1986-02-21
申请人： HITACHI LTD
发明人： YAMADA TOMIO , HOSHI AKIRO
IPC分类号： H01L23/02 , H01L23/10
摘要： PURPOSE:To augment sealing force and to improve the seal in its quality and reliability by a method wherein sealing margins are made locally larger in an package sealed airtight. CONSTITUTION:Onto a base 3, a cap 11, processed by baking and roughly similar to the base 3 geometrically but smaller than the base 3 by a tolerance L, is attached by means of a low-melting fritted-glass seal 12 solidified after melting. The cap 11 ensures that a cavity 4 created between the base 3 and cap 11 is hermetically sealed. Sealing margin S is quite large at bonding surface augmentation sections 10 locally provided on the base 3. At the bonding surface augmentation sections 10, the bonding force will be strong enough even in the event of a blowhole, which ensures an augmented sealing effect for the entirety of a package.

85. 发明专利

JPS61168947A MANUFACTURE OF SEMICONDUCTOR DEVICE AND LEADFRAME USED IN SAID DEVICE 失效
公开(公告)号：JPS61168947A
公开(公告)日：1986-07-30
申请号：JP901085
申请日：1985-01-23
申请人： HITACHI LTD
发明人： YAMADA TOMIO , SHOJI SENJI , HOSHI AKIRO , OWAKI SEISHIRO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To prevent deformation of the inner end parts of leads, by performing patterning of parts other than the inner end regions of the leads and a chip arranging area at first, and performing the patterning of the inner end regions of the leads and the chip arranging region immediately before chip bonding. CONSTITUTION:The unit lead pattern of a leadframe 1 becomes a conveying pattern 2 by the first lead-pattern forming process. A bonding pattern 3 is obtained by the second lead-pattern forming process. A tab 4 and leads 5 are linked to the conveying pattern 2. The central part of the leadframe 1 is hard to be deformed in handling such as conveying. In the second lead-pattern forming process, precision press molding of the central part of the leadframe is carried out and the tab 4 and the inner end parts of the leads 5 are molded. Thus, the bonding pattern 3 is formed.

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