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1. 发明专利

AU2002301774B2 Charged particle beam irradiation equipment and control method thereof 未知
公开(公告)号：AU2002301774B2
公开(公告)日：2004-10-07
申请号：AU2002301774
申请日：2002-10-31
申请人： HITACHI LTD
发明人： HIRAMOTO KAZUO , KUBO HIROSHI , AKIYAMA HIROSHI
IPC分类号： H05H003/04 , H05H013/04

2. 发明专利

AU5760599A Apparatus for charged-particle beam irradiation, and method of control thereof 未知
公开(公告)号：AU5760599A
公开(公告)日：2001-04-30
申请号：AU5760599
申请日：1999-09-27
申请人： HITACHI LTD
发明人： AKIYAMA HIROSHI , KUBO HIROSHI , HIRAMOTO KAZUO
IPC分类号： A61N5/10 , G01Q10/00 , G01Q60/00 , G01Q60/50 , G09G3/10 , G21K1/08 , G21K1/093 , G21K5/00 , H01J7/28 , H05H7/04 , H05H3/04
摘要： A power supply for applying a voltage to a scanning electromagnet for deflecting a charged particle beam has a first power supply unit having no filter and a second power supply unit having a filter. When an irradiation position of the charged particle beam in an irradiation object is moved, the first power supply unit, namely a power supply unit having no filter, is used to apply the voltage to the scanning electromagnet, so that an exciting current flowing in the scanning electromagnet can be changed in a short time. Further, when the irradiation position of the charged particle beam is maintained, the second power supply is used to apply a voltage whose pulsating component was removed to the scanning electromagnet, so that the exciting current flowing in the scanning electromagnet can be controlled precisely. Consequently, the charged particle beam can be applied uniformly to the irradiation object and an irradiation time of the charged particle beam to the irradiation object can be curtailed.

3. 发明专利

AU755928B2 Apparatus for charged-particle beam irradiation, and method of control thereof 未知
公开(公告)号：AU755928B2
公开(公告)日：2003-01-02
申请号：AU5760599
申请日：1999-09-27
申请人： HITACHI LTD
发明人： AKIYAMA HIROSHI , HIRAMOTO KAZUO , KUBO HIROSHI
IPC分类号： A61N5/10 , G01Q10/00 , G01Q60/00 , G01Q60/50 , G09G3/10 , G21K1/08 , G21K1/093 , G21K5/00 , H01J7/28 , H05H7/04 , H05H3/04 , H05H13/04
摘要： A power supply for applying a voltage to a scanning electromagnet for deflecting a charged particle beam has a first power supply unit having no filter and a second power supply unit having a filter. When an irradiation position of the charged particle beam in an irradiation object is moved, the first power supply unit, namely a power supply unit having no filter, is used to apply the voltage to the scanning electromagnet, so that an exciting current flowing in the scanning electromagnet can be changed in a short time. Further, when the irradiation position of the charged particle beam is maintained, the second power supply is used to apply a voltage whose pulsating component was removed to the scanning electromagnet, so that the exciting current flowing in the scanning electromagnet can be controlled precisely. Consequently, the charged particle beam can be applied uniformly to the irradiation object and an irradiation time of the charged particle beam to the irradiation object can be curtailed.

4. 发明公开

EP1220585A4 APPARATUS FOR CHARGED-PARTICLE BEAM IRRADIATION, AND METHOD OF CONTROL THEREOF 有权
标题翻译：设备与货物的承载梁及其控制方法辐射
公开(公告)号：EP1220585A4
公开(公告)日：2007-10-17
申请号：EP99944837
申请日：1999-09-27
申请人： HITACHI LTD
发明人： AKIYAMA HIROSHI , KUBO HIROSHI , HIRAMOTO KAZUO
IPC分类号： A61N5/10 , G01Q10/00 , G01Q60/00 , G01Q60/50 , G09G3/10 , G21K1/08 , G21K1/093 , G21K5/00 , H01J7/28 , H05H7/04 , H05H7/08
CPC分类号： H05H7/04 , A61N5/10 , A61N5/1043 , A61N2005/1087 , G21K1/093

5. 发明专利

JP2005176532A Digital type dc power supply control device and method 审中-公开
标题翻译：数字型直流电源控制装置及方法
公开(公告)号：JP2005176532A
公开(公告)日：2005-06-30
申请号：JP2003414423
申请日：2003-12-12
申请人： Hitachi Eng Co Ltd , Hitachi Ltd , 日立エンジニアリング株式会社 , 株式会社日立製作所
发明人： MIYAJIMA NORIYUKI , MIYAHARA YOJIRO , KUBO HIROSHI
IPC分类号： H02M3/155
摘要： PROBLEM TO BE SOLVED: To provide a digital type DC power supply control device capable of stably controlling a multiphase and multiplex chopper circuit for heavy current against switching noise due to a PWM pulse.
SOLUTION: The operation timing of an A/D converter 93 is shifted when a PWM command value (modulated wave) 91 is in a predetermined A area in conducting a DC current control system in a digital manner using a multiplex chopper, thus preventing an instable state of control by overlapping noise generation timing accompanied by ON/OFF operations of a semiconductor switch.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种数字型直流电源控制装置，其能够稳定地控制用于大电流的多相和多路斩波电路，以防止由PWM脉冲引起的开关噪声。解决方案：当使用多路复用斩波器以数字方式进行直流电流控制系统的PWM命令值（调制波）91处于预定的A区域时，A / D转换器93的操作定时被移位，因此通过伴随着半导体开关的ON / OFF操作的噪声产生定时重叠来防止不稳定的控制状态。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2000223333A EXCITER 失效
公开(公告)号：JP2000223333A
公开(公告)日：2000-08-11
申请号：JP2346699
申请日：1999-02-01
申请人： HITACHI LTD
发明人： KOSEKI SHOICHIRO , KUBO HIROSHI
IPC分类号： H01F38/14
摘要： PROBLEM TO BE SOLVED: To make the capacity of a power supply small by constructing series resonance circuits in load units, adding AC voltage by inserting transformers in series with inductive circuit elements, and exciting only the AC current components by the resonance circuits. SOLUTION: In an exciter, secondary windings of choke transformers 41, 42 and 43 are inserted in series with electromagnets 11, 12 and 13, and AC voltage is added from the primary side by an AC power source 1, which is connected commonly in parallel to the primary winding of each choke transformer. Although the choke transformers 41, 42 and 43 may be inserted to a choke transformer 22 side, better control is obtained when they are coupled directly to the electromagnet current. When the choke transformers are connected to the choke transformer 22 side, they are inserted by being divided into two, with respect to the resonance circuit 81. The AC power source can be divided into each choke transformer, enabling adjustment of the voltage applied to each resonance circuit. If the resonance circuit 81 for inserting a DC power supply is made plural to result in a plurality of DC power sources, it is possible to reduce the voltage applied to the load.

7. 发明专利

JPH10289799A POWER SUPPLY DEVICE AND ACCELERATOR 失效
公开(公告)号：JPH10289799A
公开(公告)日：1998-10-27
申请号：JP9555797
申请日：1997-04-14
申请人： HITACHI LTD , HITACHI ENG CO LTD
发明人： KANAZAWA TORU , KUBO HIROSHI
IPC分类号： H05H7/04
摘要： PROBLEM TO BE SOLVED: To eliminate external adjustments for a power application start signal, a current-setting value or the like by forming a power supply for operation, in matching with a current setting value via a timing setting unit installed within the power supply itself. SOLUTION: A current-setting value Ir is preliminarily sent from a setting device 7 to a current instruction unit 2. When a power supply start signal (s) is sent from a timing generation device 8, a power supply start signal Sn for a power supply is outputted, and a current-setting value Ir is outputted from the current instruction unit 2 to a power supply control part 4. In addition, the power supply control part 4 sends output current Id to a load 9, according to the current-setting value Ir. An output current Id is detected with a current detector 5, and compared with the current setting value Ir in a deviation detector 6 for the calculation of a deviation ε. The deviation ε is fed back to the power supply control part 4, and control is made so that the output current Id approaches close to the current setting value Ir. Also, a deviation εcorresponding to a delay in the load 9 and the power supply control part 4, relative to the current-setting value Ir, is connected to the timing setting unit 3, thereby converting the deviation ε with time for quickly outputting the power supply start signal Sn for the power supply.

8. 发明专利

JPS6316629A RESIN MOLDING METHOD AND MOLDED MATERIAL 失效
公开(公告)号：JPS6316629A
公开(公告)日：1988-01-23
申请号：JP15960686
申请日：1986-07-09
申请人： HITACHI LTD
发明人： KUBO HIROSHI , HOSHI AKIRO
IPC分类号： H01L23/48 , H01L21/56 , H01L23/50
摘要： PURPOSE:To enable a high-reliability semiconductor device to be obtained with good yield, by disposing air vents on a plurality of sides of cavities so that voids can be prevented from being formed inside a molded resin, together with avoiding short filling of resin. CONSTITUTION:A melting resin 10 is injected as shown by arrows of full lines in process of resin molding. Air existing in cavities of a molding metallic mold is exhausted from air vents of the molding iron mold as shown in two-dot chain lines and besides from air vents 9 formed on respective dams 5 of a lead frame 1. Because the air is thus exhausted from three sides of these air vents of the cavities shaped in rectangles, the air is effectively drawn out with out remaining in the cavities. Resultantly voids are hardly generated inside a package 8, and the recessed parts or the like are prevented from being generat ed on the surface of the package 8 due to the remaining foams. Thus, short filling of resin also hardly occurs.

9. 发明专利

JPS56107740A REACTIVE POWER COMPENSATING DEVICE 失效
公开(公告)号：JPS56107740A
公开(公告)日：1981-08-26
申请号：JP678180
申请日：1980-01-25
申请人： HITACHI LTD
发明人： KUBO HIROSHI , TAMURA KAORU
IPC分类号： G05F1/70 , H02J3/18

10. 发明专利

JPS5678146A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5678146A
公开(公告)日：1981-06-26
申请号：JP14579480
申请日：1980-10-20
申请人： HITACHI LTD
发明人： INOUE FUMIHITO , KUBO HIROSHI
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To obtain a small frame which has an improved thermal conductivity and a reduced thermal expansion efficiency, by a method wherein a lead frame whereon a simiconductor pellet is placed is formed with a composition having a silver layer through a copper layer on the surface of a core material whose main component is iron, such as kovar or iron nickel. CONSTITUTION:The structure of an IC reed frame W, consisting of a plurality of reeds A which have a head unit at their respective ends that turn inward, is formed as follows. A center part in the direction of thickness of the frame W is formed with a core material 1 made of a copal or iron nickel alloy which has an oblong shape and thickness of 200-300mum, and a copper layer 2, which is formed in minimum thickness of 1mum by a plating method or clad method, is adhered to the circumference of the core material. A silver layer 3, which is formed in thickness of 1mum or more by a plating method, is further adhered to the copper layer 2, and a copper layer 4 is adhered to the silver layer 3. The thickness of said layers covering the core material 1 is adjusted so as to be 10-50mum. This causes the frame W to be reduced in an expansion and contraction value produced due to thermal expansion.

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