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81. 发明申请

US20050217137A1 CONCENTRIC PROXIMITY PROCESSING HEAD 有权
标题翻译：集中接近加工头
公开(公告)号：US20050217137A1
公开(公告)日：2005-10-06
申请号：US10883301
申请日：2004-06-30
申请人： Michael Smith , Michael Ravkin , Robert O'Donnell
发明人： Michael Smith , Michael Ravkin , Robert O'Donnell
IPC分类号： F26B5/04 , F26B7/00 , F26B13/30 , H01L21/00
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67063 , H01L21/67075 , H01L21/6708
摘要： In one of the many embodiments, a method for processing a substrate is disclosed which includes generating a first fluid meniscus and a second fluid meniscus at least partially surrounding the first fluid meniscus wherein the first fluid meniscus and the second fluid meniscus are generated on a surface of the substrate.
摘要翻译：在许多实施例中的一个实施例中，公开了一种用于处理衬底的方法，其包括产生至少部分围绕第一流体弯液面的第一流体弯月面和第二流体弯液面，其中在表面上产生第一流体弯液面和第二流体弯液面的基底。

82. 发明申请

US20060191560A1 Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same 失效
标题翻译：使用兼容化学物质的底物刷洗涤和邻近清洁干燥顺序，以及用于实施相同化学品的方法，装置和系统
公开(公告)号：US20060191560A1
公开(公告)日：2006-08-31
申请号：US11413916
申请日：2006-04-27
申请人： Michael Ravkin , John de Larios
发明人： Michael Ravkin , John de Larios
IPC分类号： B08B3/00
CPC分类号： B08B1/04 , B08B3/04 , H01L21/67046 , Y10S134/902
摘要： In one embodiment, a substrate preparation system is provided. The system includes a brush, a front head, and a back head. The brush is configured to brush scrub a back surface of a substrate using a brush scrubbing chemistry. The front head is defined in close proximity to a front surface of the substrate while the back head is defined in close proximity to the back surface of the substrate. The back head is positioned substantially opposite to the front head. The front head and the back head are applied as a pair to the substrate when the brush is apart from the substrate.
摘要翻译：在一个实施方案中，提供了底物制备系统。该系统包括刷子，前头部和后头部。刷被配置为使用刷洗化学物质刷洗基材的背面。前头被限定在紧邻衬底的前表面的位置，而后头部被限定为紧邻衬底的背面。后头位于与前头大致相对的位置。当刷子离开基板时，前头和后头一对被施加到基底。

83. 发明授权

US06954993B1 Concentric proximity processing head 有权
标题翻译：同心接近加工头
公开(公告)号：US06954993B1
公开(公告)日：2005-10-18
申请号：US10883301
申请日：2004-06-30
申请人： Michael G. R. Smith , Michael Ravkin , Robert J. O'Donnell
发明人： Michael G. R. Smith , Michael Ravkin , Robert J. O'Donnell
IPC分类号： F26B5/04 , F26B7/00 , F26B13/30 , H01L21/00
CPC分类号： H01L21/67051 , H01L21/67017 , H01L21/67023 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67063 , H01L21/67075 , H01L21/6708
摘要： In one of the many embodiments, a method for processing a substrate is disclosed which includes generating a first fluid meniscus and a second fluid meniscus at least partially surrounding the first fluid meniscus wherein the first fluid meniscus and the second fluid meniscus are generated on a surface of the substrate.
摘要翻译：在许多实施例中的一个实施例中，公开了一种用于处理衬底的方法，其包括产生至少部分围绕第一流体弯液面的第一流体弯月面和第二流体弯液面，其中在表面上产生第一流体弯液面和第二流体弯液面的基底。

84. 发明授权

US06439245B1 Method for transferring wafers from a conveyor system to a wafer processing station 有权
标题翻译：将晶片从传送系统传送到晶片处理台的方法
公开(公告)号：US06439245B1
公开(公告)日：2002-08-27
申请号：US09608515
申请日：2000-06-30
申请人： Brian M. Bliven , Michael Ravkin
发明人： Brian M. Bliven , Michael Ravkin
IPC分类号： B08B704
CPC分类号： H01L21/67706 , H01L21/67046 , H01L21/6776 , Y10S134/902
摘要： A wheel for a conveyor system for transporting semiconductor wafers includes a first section for supporting a semiconductor wafer at a first level and a second section for supporting the wafer at a second level, with the first level being higher than the second level. In one embodiment, each of the first and second sections is semicircular. The first level may be substantially the same as a level at which the wafer is subjected to a wafer cleaning operation, and the distance the second level is below the first level may be in a range from about one sixteenth of an inch to about three sixteenths of an inch. A conveyor system for transporting wafers and a method for transferring wafers from a conveyor system to a wafer processing station also are described.
摘要翻译：用于传送半导体晶片的传送系统的轮包括用于将第一级半导体晶片支撑的第一部分和用于将晶片支撑在第二级上的第二部分，其中第一级高于第二级。在一个实施例中，第一和第二部分中的每一个是半圆形的。第一级可以与晶片经历晶片清洁操作的水平基本相同，并且第二级别低于第一级的距离可以在从约十六分之一英寸到约三十六分之一的范围内一英寸还描述了用于传送晶片的传送系统和用于将晶片从传送系统传送到晶片处理台的方法。

85. 发明授权

US06290780B1 Method and apparatus for processing a wafer 有权
标题翻译：用于处理晶片的方法和装置
公开(公告)号：US06290780B1
公开(公告)日：2001-09-18
申请号：US09272874
申请日：1999-03-19
申请人： Michael Ravkin
发明人： Michael Ravkin
IPC分类号： B08B700
CPC分类号： H01L21/67046 , Y10S134/902
摘要： A method and apparatus for processing wafer edges is disclosed. Pressure applied to the wafer at one end of A brush/pad assembly is greater than at the opposite end of the brush/pad assembly. The increased pressure causes wafer rotation to slow or to reverse direction as compared to less pressure applied by the brush/pad assembly. In one embodiment slowed rotation causes a difference in tangential velocity between the roller(s) and the wafer edge/bevel that causes pads in the roller(s) to process the edge/bevel of the wafer. In another embodiment, the opposite direction of rotation causes the wafer to rotate counter to rollers otherwise causing the wafer to rotate. Cleaning surfaces in the rollers clean the edges of the wafer whether rotation is slowed or reversed.
摘要翻译：公开了一种用于处理晶片边缘的方法和装置。在刷/垫组件的一端施加到晶片的压力大于刷/垫组件的相对端。与由刷/垫组件施加的较小压力相比，增加的压力导致晶片旋转减慢或反向。在一个实施例中，减速旋转导致辊和晶片边缘/斜面之间的切向速度的差异导致辊中的垫处理晶片的边缘/斜面。在另一个实施例中，相反的旋转方向导致晶片相对于辊旋转，否则导致晶片旋转。滚筒中的清洁表面清洁晶片的边缘，无论旋转是否减速或反转。

86. 发明授权

US6145148A Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) 失效
标题翻译：使用氢氟酸（HF）清洗半导体衬底的方法和设备
公开(公告)号：US6145148A
公开(公告)日：2000-11-14
申请号：US227499
申请日：1999-01-07
申请人： Diane J. Hymes , Michael Ravkin , Xiuhua Zhang , Wilbur C. Krusell
发明人： Diane J. Hymes , Michael Ravkin , Xiuhua Zhang , Wilbur C. Krusell
IPC分类号： A46B11/06 , B08B1/04 , B08B3/08 , H01L21/00 , H01L21/306 , H01L21/311 , A46B13/04
CPC分类号： H01L21/02052 , A46B11/06 , B08B1/007 , B08B1/04 , B08B3/08 , H01L21/31111 , H01L21/67046 , Y10S134/902
摘要： A cleaning method and apparatus using very dilute hydrofluoric acid (BF) for cleaning silicon wafers and semiconductor substrates. The HF is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the substrate. This delivery system applies the chemical solutions uniformly to the semiconductor substrate and reduces the volumes of chemical solutions used in a scrubbing process. The process of the present invention uses very dilute HF and allows a thin oxide to be etched but not completely removed so as to maintain a hydrophilic surface state. Thus, this invention presents a chemical mechanical cleaning process with in-situ etching with the use of PVA brushes on a brush scrubber. Very accurate control of etch rate is obtained and, therefore, makes this process suitable to multiple cleaning applications of silicon wafers and semiconductor substrates.
摘要翻译：一种使用非常稀的氢氟酸（BF）清洗硅晶片和半导体衬底的清洗方法和设备。将HF输送到刷子的芯部，其中溶液被刷子吸收，然后通过刷子施加到基底上。该递送系统将化学溶液均匀地施加到半导体衬底并减少在洗涤过程中使用的化学溶液的体积。本发明的方法使用非常稀的HF，并允许蚀刻薄氧化物但不能完全去除以保持亲水表面状态。因此，本发明提出了一种利用在刷洗涤器上使用PVA刷的原位蚀刻的化学机械清洁方法。获得非常精确的蚀刻速度控制，因此使该工艺适合于硅片和半导体衬底的多次清洁应用。

87. 发明申请

US20070011905A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 失效
标题翻译：使用动态液体弯月面处理衬底的方法和系统
公开(公告)号：US20070011905A1
公开(公告)日：2007-01-18
申请号：US11525278
申请日：2006-09-21
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

88. 发明申请

US20060150435A1 Methods and systems for processing a substrate using a dynamic liquid meniscus 有权
公开(公告)号：US20060150435A1
公开(公告)日：2006-07-13
申请号：US11318019
申请日：2005-12-22
申请人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
发明人： James Garcia , John de Larios , Michael Ravkin , Fred Redeker , Carl Woods
IPC分类号： F26B7/00 , F26B17/30 , F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

89. 发明授权

US5924154A Brush assembly apparatus 失效
公开(公告)号：US5924154A
公开(公告)日：1999-07-20
申请号：US705161
申请日：1996-08-29
申请人： Thomas R. Gockel , Lorin Olson , Lynn Ryle , Brett A. Whitelaw , Michael Ravkin
发明人： Thomas R. Gockel , Lorin Olson , Lynn Ryle , Brett A. Whitelaw , Michael Ravkin
IPC分类号： H01L21/304 , A46B13/02 , B08B1/04 , B24B29/02 , B24B37/04 , H01L21/00 , B08B11/00 , B08B13/00
CPC分类号： H01L21/67046 , B08B1/04 , B24B29/02 , B24B37/04 , H01L21/67028
摘要： A semiconductor processing system, such as a system for scrubbing both sides of a wafer at the same time, that includes a brush box containment apparatus for use with highly-acidic or other volatile chemical solutions, a roller positioning apparatus and a (brush) placement device.

90. 发明授权

US07040330B2 Method and apparatus for megasonic cleaning of patterned substrates 有权
标题翻译：用于超声波清洗图案化衬底的方法和装置
公开(公告)号：US07040330B2
公开(公告)日：2006-05-09
申请号：US10371603
申请日：2003-02-20
申请人： John M. Boyd , Michael Ravkin , Fred C. Redeker
发明人： John M. Boyd , Michael Ravkin , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/67057 , B08B3/12 , Y10S134/902
摘要： A system for cleaning a semiconductor substrate is provided. The system includes transducers for generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate and an acoustic energy oriented in a substantially parallel direction to the surface of the semiconductor substrate. Each orientation of the acoustic energy may be simultaneously or alternately generated.
摘要翻译：提供了一种用于清洁半导体衬底的系统。该系统包括用于产生在与半导体衬底的表面基本上垂直的方向上定向的声能的换能器和沿着与半导体衬底的表面基本平行的方向定向的声能。声能的每个取向可以同时或交替地产生。

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