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81. 发明授权

US06713687B2 Printed wiring board and method for manufacturing printed wiring board 有权
标题翻译：印刷电路板及制造印刷线路板的方法
公开(公告)号：US06713687B2
公开(公告)日：2004-03-30
申请号：US10022222
申请日：2001-12-20
申请人： Yoshitarou Yazaki , Tomohiro Yokochi , Koji Kondo , Toshikazu Harada , Yoshihiko Shiraishi
发明人： Yoshitarou Yazaki , Tomohiro Yokochi , Koji Kondo , Toshikazu Harada , Yoshihiko Shiraishi
IPC分类号： H05K111
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T428/24917
摘要： Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.
摘要翻译：含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。同时，通孔周围的树脂膜突出到通孔中。因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。因此，可以防止由于板的变形引起的应力集中。

82. 发明授权

US06641898B2 Printed wiring board and method of manufacturing a printed wiring board 有权
公开(公告)号：US06641898B2
公开(公告)日：2003-11-04
申请号：US10024470
申请日：2001-12-21
申请人： Yoshitaro Yazaki , Yoshihiko Shiraishi , Koji Kondo , Toshikazu Harada , Tomohiro Yokochi
发明人： Yoshitaro Yazaki , Yoshihiko Shiraishi , Koji Kondo , Toshikazu Harada , Tomohiro Yokochi
IPC分类号： B32B300
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T428/24917
摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

83. 发明授权

US06330166B1 Electronic-component mounting structure 有权
标题翻译：电子部件安装结构
公开(公告)号：US06330166B1
公开(公告)日：2001-12-11
申请号：US09399166
申请日：1999-09-20
申请人： Masayuki Aoyama , Yasuaki Matsunaga , Tomoyuki Hiramatsu , Naoyuki Akita , Koji Kondo
发明人： Masayuki Aoyama , Yasuaki Matsunaga , Tomoyuki Hiramatsu , Naoyuki Akita , Koji Kondo
IPC分类号： H05K702
CPC分类号： H05K3/3436 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H05K3/3452 , H05K2201/0394 , H05K2201/09427 , H05K2201/09472 , H05K2201/099 , H05K2203/0465 , Y02P70/613 , Y10T29/49144 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively. An outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) extends outward of an outer edge (Y1) of a corresponding first outermost electrode (1b) with respect to the first and second arrays. A distance between an outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) and an outer edge (Y1) of a corresponding first outermost electrode (1b) is greater than a distance between an inner edge (X2, Z2) of the second outermost electrode (3b, 3c) and an inner edge (Y2) of the corresponding first outermost electrode (1b) with respect to the first and second arrays.
摘要翻译：在电子部件安装结构中，电子部件（2）具有表面。设置在电子部件（2）的表面上的第一电极（1）以第一阵列布置。设置在基板（4）上的第二电极（3）以对应于第一阵列的第二阵列布置。第二电极（3）分别对应于第一电极（1）。焊接凸块（9）分别连接第一电极（1）和第二电极（3）。第一电极（1）包括位于第一阵列的外部区域中的第一最外电极（1b）。第二电极（3）包括位于第二阵列的外部区域中的第二最外电极（3b，3c）。第二最外电极（3b，3c）分别对应于第一最外电极（1b）。每个第二最外电极（3b，3c）的外边缘（X1，Z1）相对于第一和第二阵列延伸到对应的第一最外电极（1b）的外边缘（Y1）的外侧。每个第二最外电极（3b，3c）的外边缘（X1，Z1）与对应的第一最外电极（1b）的外边缘（Y1）之间的距离大于内边缘（X2 ，Z2）和相应的第一最外电极（1b）的内边缘（Y2）相对于第一和第二阵列。

84. 发明授权

US06303878B1 Mounting structure of electronic component on substrate board 失效
标题翻译：电子元件在基板上的安装结构
公开(公告)号：US06303878B1
公开(公告)日：2001-10-16
申请号：US09121303
申请日：1998-07-23
申请人： Kenji Kondo , Masayuki Aoyama , Koji Kondo , Masanori Takemoto , Hidehiro Mikura , Tetuhiro Nakano
发明人： Kenji Kondo , Masayuki Aoyama , Koji Kondo , Masanori Takemoto , Hidehiro Mikura , Tetuhiro Nakano
IPC分类号： H05K109
CPC分类号： H05K3/244 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K1/112 , H05K2201/09227 , H05K2201/10734 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.
摘要翻译： BGA封装安装在具有通过多个焊料凸块以矩阵形式布置的多个电极的多层印刷布线板上。在最外部定位的电极中，形成引线，其从位于通过连接相邻的最外部定位的电极的每个中心形成的多边形内部的最外部定位的电极的一部分延伸。因此，由于由外部冲击引起的应力的最外部位置的电极的一部分被集中地施加，所以防止了焊料凸块脱离最外部定位的电极，位于多边形的外侧。因此，防止了BGA封装和多层印刷电路板之间的接触故障。

85. 发明授权

US06280329B1 Video game apparatus outputting image and music and storage medium used therefor 有权
标题翻译：输出图像和音乐的视频游戏装置以及用于其的存储介质
公开(公告)号：US06280329B1
公开(公告)日：2001-08-28
申请号：US09318619
申请日：1999-05-26
申请人： Koji Kondo , Yoji Inagaki , Hideaki Shimizu
发明人： Koji Kondo , Yoji Inagaki , Hideaki Shimizu
IPC分类号： A63F924
CPC分类号： A63F13/54 , A63F13/10 , A63F13/822 , A63F2300/6063 , A63F2300/807
摘要： A video game apparatus includes an external ROM. This external ROM has a sound memory area memorized with sound sequence data. The sound sequence data includes a plurality of block sequences for each of three status of “move”, “fight” and “stop” of a player object. A CPU detects a status of the player object according to a mode flag, and read to a RAM a block sequence in compliance with the status detected. It is possible to output a series of game melodies in a manner matched to the status of the player object by the repetition of using the plurality of block sequences.
摘要翻译：视频游戏装置包括外部ROM。该外部ROM具有记录有声音序列数据的声音存储区域。声音序列数据包括用于玩家对象的“移动”，“起搏”和“停止”的三种状态中的每一种的多个块序列。 CPU根据模式标志检测播放器对象的状态，并根据检测到的状态读取到RAM的块序列。可以通过重复使用多个块序列，以与播放器对象的状态相匹配的方式输出一系列游戏旋律。

86. 发明授权

US5965211A Electroless copper plating solution and process for formation of copper film 失效
标题翻译：化学镀铜溶液及铜膜形成工艺
公开(公告)号：US5965211A
公开(公告)日：1999-10-12
申请号：US725767
申请日：1991-07-02
申请人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
发明人： Koji Kondo , Seiji Amakusa , Katuhiko Murakawa , Katsuaki Kojima , Nobumasa Ishida , Junji Ishikawa , Futoshi Ishikawa
IPC分类号： C23C18/40 , B05D3/04 , B05D1/18 , B05D3/10
CPC分类号： C23C18/405
摘要： Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, napththalene, 1,8-naphthyridine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.
摘要翻译：公开了包含铜离子，铜离子络合剂，还原剂和pH调节剂的无电镀铜溶液，所述镀溶液包含三烷醇单胺或其盐作为络合剂和促进剂，其量为当三烷醇单胺或其盐以足以使铜离子复合但不足以起促进剂的量存在时获得的铜沉积速度高的铜沉积速度，以及1.2×10 -4至1.2×10 -3摩尔/升的作为反应引发剂的铁离子化合物和/或1.92×10 -4至1.92×10 -3摩尔/升的选自哒嗪，甲基哌啶，1,2-二（2-吡啶基）乙烯的至少一种化合物，1,2-二（吡啶基）乙烯，2,2'-二吡啶基胺，2,2'-联吡啶基，2,2'-联嘧啶，6,6'-二甲基-2,2'-联吡啶，二-2 - 吡啶酮，N，N，N'，N'-四乙基乙二胺，萘，1,8-萘啶，1,6-萘啶，四硫糠醛，α， ha，α-三联吡啶，邻苯二甲酸，间苯二甲酸和2,2'-二苯甲酸作为改善电镀膜的物理性能的试剂，以及使用该化学镀铜溶液形成无电解铜沉积膜的方法。

87. 发明授权

US5914132A Pharmaceutical dosage form with multiple enteric polymer coatings for colonic delivery 失效
标题翻译：用于结肠输送的多种肠溶性聚合物涂层的药物剂型
公开(公告)号：US5914132A
公开(公告)日：1999-06-22
申请号：US728946
申请日：1996-10-11
申请人： Gary Robert Kelm , Koji Kondo , Akio Nakajima
发明人： Gary Robert Kelm , Koji Kondo , Akio Nakajima
IPC分类号： A61K31/197 , A61K9/14 , A61K9/28 , A61K9/30 , A61K9/32 , A61K9/48 , A61K9/50 , A61K31/138 , A61K31/44 , A61K31/4402 , A61K31/573 , A61K47/48 , A61K9/44 , A61K9/40
CPC分类号： B82Y5/00 , A61K31/44 , A61K31/4402 , A61K47/48969 , A61K9/145 , A61K9/146 , A61K9/2846 , A61K9/2886 , A61K9/4808 , A61K9/4891 , A61K9/5078
摘要： The present invention relates to a pharmaceutical composition in a unit dosage form for peroral administration in a human or lower animal, having a gastrointestinal tract comprising a small intestine and a colon with a lumen therethrough having an inlet to the colon from the small intestine, comprising:a. a safe and effective amount of a therapeutically active agent incorporated into a compressed, bi-convex tablet, with a maximum diameter of about 4 mm to about 10 mm;b. a non-pH dependent smoothing coat applied to the tablet to provide a smooth tablet surface free from edges or sharp curves; andc. an enteric polymer coating material comprising at least one inner coating layer and only one outer coating layer;wherein the therapeutically active agent is released at a point near the inlet to, or within the colon; each of the inner coating layer(s) is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 5 to about 6.3; and the outer coating layer is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 6.8 to about 7.2.
摘要翻译：本发明涉及一种用于人或低等动物口服给药的单位剂量形式的药物组合物，其具有胃肠道，该胃肠道包含小肠和结肠与其中具有从小肠到结肠入口的结肠，包括：一个。安全有效量的加入到压缩的双凸片剂中的治疗活性剂，最大直径为约4mm至约10mm; b。施加到片剂上以提供没有边缘或锋利曲线的光滑片剂表面的非pH依赖性平滑涂层; 和c。肠溶性聚合物涂层材料，其包含至少一个内涂层和仅一个外涂层; 其中所述治疗活性剂在靠近所述入口处或结肠内的点释放; 每个内部涂层是在pH约5至约6.3之间开始溶解于水性介质中的肠溶性聚合物; 并且外涂层是在约6.8至约7.2之间的pH下开始溶解于水性介质中的肠溶性聚合物。

88. 发明授权

US5405656A Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor 失效
标题翻译：用于催化处理的溶液，将催化剂施加到基材的方法和形成电导体的方法
公开(公告)号：US5405656A
公开(公告)日：1995-04-11
申请号：US161063
申请日：1993-12-03
申请人： Futoshi Ishikawa , Koji Kondo , Masahiro Irie
发明人： Futoshi Ishikawa , Koji Kondo , Masahiro Irie
IPC分类号： B01J23/44 , B01J37/02 , B01J37/08 , B01J37/34 , B05D1/20 , C23C18/16 , C23C18/30 , H05K3/18 , B05D1/18 , B05D3/06
CPC分类号： B82Y30/00 , B01J23/44 , B01J37/0203 , B01J37/086 , B01J37/344 , B01J37/348 , B01J37/349 , B05D1/202 , B05D1/208 , B82Y40/00 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1831 , C23C18/1868 , C23C18/1879 , C23C18/204 , C23C18/30 , H05K3/185
摘要： The present invention relates to a solution for catalytic treatment, which is effective for applying a catalyst-metal onto the surface of a substrate, which can provide a film having excellent properties such as adhesion, precision and selectivity through electroless plating or the like, and which does not cause a premature and undesirable decomposition in a bath. The solution for catalytic treatment comprises a catalyst-metal in the form of ions, which permits the deposition of the metal serving as a catalyst on a substrate by applying the solution onto the surface of the substrate and then irradiating the substrate with light rays. The present invention also relates to a method of applying a catalyst onto a substrate and a method of forming an electrical conductor in which such a solution for catalytic treatment is employed.
摘要翻译：本发明涉及一种用于催化处理的溶液，其有效地将催化剂金属施加到基材表面上，其可以通过无电镀等提供具有优异性能如粘合性，精度和选择性的膜，以及这不会在浴中引起过早和不期望的分解。用于催化处理的溶液包括离子形式的催化剂金属，其允许通过将溶液施加到基材的表面上然后用光线照射基板，将用作催化剂的金属沉积在基材上。本发明还涉及将催化剂施加到基材上的方法以及形成其中使用这种催化处理溶液的电导体的方法。

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