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1. 发明专利

JPS6188926A Production of tape guide cylinder 失效
标题翻译：制作胶带导轨
公开(公告)号：JPS6188926A
公开(公告)日：1986-05-07
申请号：JP21178484
申请日：1984-10-09
申请人： Koji Kondo , Masamitsu Tanaka
发明人： KONDO KOJI , TANAKA MASAMITSU
IPC分类号： B21D22/26 , B21D22/20 , B21D22/28 , B21D35/00
CPC分类号： B21D35/00
摘要： PURPOSE:To enable the through production of the tape guide cylinder of light weight and high accuracy by performing the hammering work of both ends after executing a flange push work to the bottomed cylindrical metallic body obtd. by re-drawing work and executing a bottom punching and the trimming work of a flange. CONSTITUTION:A slender bottomed cylindrical plank B is formed with executing a re-drawing work on the plate stock of stainless steel, etc., also the flanging work forming a flange on the opening end thereof is executed. The slender cylindrical body 1 having a chambering part 1A is then obtd. with the bottom punching work of the bottom B2 of the plank B, further with the trimming work of the flange and finally with the execution of hammering work of both ends. The through production of the tape guide cylinder having excellent durability and wear resistance and of light weight and of high accuracy is thus enabled.
摘要翻译：目的：通过在有底圆筒形金属体上执行法兰推动工作后，通过执行两端的锤击作业，能够实现重量轻，精度高的带导向筒的生产。通过重新绘制工作和执行底部冲压和法兰的修剪工作。构成：通过在不锈钢板等上进行再拉拔加工而形成细长的有底圆筒状的板坯B，同时进行在开口端形成凸缘的凸缘加工。然后可以看到具有腔室部分1A的细长圆筒体1。通过底板B的底部B的底部冲压加工，进一步与凸缘的修整工作，最后进行两端的锤击工作。因此能够实现具有优异的耐久性和耐磨性，轻质量和高精度的带导向筒的通过生产。

2. 发明专利

JP2008165670A Acceleration/braking input device for transporting equipment 审中-公开
标题翻译：用于运输设备的加速/制动输入装置
公开(公告)号：JP2008165670A
公开(公告)日：2008-07-17
申请号：JP2006357569
申请日：2006-12-28
申请人： Koji Kondo , 浩二近藤
发明人： KONDO KOJI
IPC分类号： G05G1/36 , B60K26/02 , B60T7/04 , G05G1/30 , G05G1/46
摘要： PROBLEM TO BE SOLVED: To propose an acceleration/braking input device which has a function of shortening the braking distance at sudden braking of transport equipment and a function of preventing sudden starts. SOLUTION: Operation actions are differentiated by differentiating the acceleration input direction and the braking input direction of the acceleration/braking input device, and making the acceleration input device and braking input device closer. As a result, braking distance is shortened, by shortening operation switching period from acceleration traveling time to the braking time and an effect of preventing sudden starts occurring due to misoperations can be obtained. This effect can be acquired, irrespective of a right-handed person or a left-handed person, since the structure can be constituted to have bilateral symmetry. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提出一种具有缩短运输设备突然制动时的制动距离的功能的加速/制动输入装置以及防止突然起动的功能。
解决方案：通过区分加速/制动输入装置的加速度输入方向和制动输入方向，使加速输入装置和制动输入装置更接近，区分操作动作。结果，通过缩短从加速行驶时间到制动时间的操作切换期间，缩短了制动距离，并且可以获得防止由于误操作引起的突然起动的效果。由于该结构可以构成为具有双向对称性，所以可以获得这种效果，而不管右撇子或左撇子。版权所有（C）2008，JPO＆INPIT

3. 发明授权

US08182729B2 Wiring board and method of making the same 有权
标题翻译：接线板及其制作方法
公开(公告)号：US08182729B2
公开(公告)日：2012-05-22
申请号：US12382138
申请日：2009-03-10
申请人： Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
发明人： Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
IPC分类号： B29C65/02
CPC分类号： H05K1/0366 , B29C43/003 , B29C43/18 , B29C43/203 , B29C2043/025 , B32B37/185 , B32B2309/025 , B32B2457/08 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2203/065 , H05K2203/1178
摘要： In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.
摘要翻译：在制造具有基板和形成在基板中的布线图案的多层布线板的方法中，基膜沿预定方向堆叠以形成层叠膜结构。每个基膜包括热塑性树脂。压力和热量从层叠方向的两侧施加到层叠膜结构体上，使得基膜结合在一起形成基板。基膜中的至少一个是包括纤维片的组合膜。纤维片的两侧用热塑性树脂覆盖，使纤维片中残留有空气。

4. 发明授权

US07876006B2 Alternator for vehicle 有权
标题翻译：交通工具车
公开(公告)号：US07876006B2
公开(公告)日：2011-01-25
申请号：US11822675
申请日：2007-07-09
申请人： Koji Kondo
发明人： Koji Kondo
IPC分类号： H02K19/36 , H02K11/00
CPC分类号： H02K11/046 , H01L24/01 , H02K19/36
摘要： An alternator has a rectifier converting an alternating current to a direct current. The rectifier has a heat sink and rectifying elements. The sink has front and rear surfaces opposite to each other along a depth direction. The sink has holes each extending along the depth direction. Each element has a disk disposed in one hole and a semiconductor pellet attached to the disk. Each disk has upper and bottom surfaces opposite to each other along the depth direction. Each pellet is disposed on the upper surface. A contact surface of each disk is in contact with the sink. A position of the upper surface of each disk is placed between the first and second surfaces of the heat sink. A range of the contact surface of each disk is within a range between the upper and bottom surfaces of the disk.
摘要翻译：交流发电机具有将交流电转换为直流电的整流器。整流器具有散热器和整流元件。水槽具有沿着深度方向彼此相对的前表面和后表面。水槽有沿着深度方向延伸的孔。每个元件具有设置在一个孔中的盘和附接到盘的半导体芯片。每个盘具有沿着深度方向彼此相对的上表面和底表面。每个颗粒设置在上表面上。每个盘的接触表面与水槽接触。每个盘的上表面的位置被放置在散热器的第一和第二表面之间。每个盘的接触表面的范围在盘的上表面和底表面之间的范围内。

5. 发明申请

US20080316786A1 Cooling-fin mounted rectifier for vehicular AC generators 有权
标题翻译：用于车辆交流发电机的散热片安装的整流器
公开(公告)号：US20080316786A1
公开(公告)日：2008-12-25
申请号：US12213517
申请日：2008-06-20
申请人： Harumi Murakami , Koji Kondo
发明人： Harumi Murakami , Koji Kondo
IPC分类号： H05K7/20 , H02K11/04 , H02K9/00
CPC分类号： H02K11/046
摘要： A rectifier for an alternating current generator is provided. The rectifier comprise a plurality of high-side rectifying elements and a plurality of low-side rectifying elements. The high-side rectifying elements are held by a plurality of high-side cooling fins, while the high-side rectifying elements are held by a plurality of low-side cooling fins. By way of example, the plurality of high-side cooling fins are disposed to be apart from each other by a predetermined distance and the plurality of low-side cooling fins are disposed to be apart from each other by a predetermined distance.
摘要翻译：提供了一种用于交流发电机的整流器。整流器包括多个高侧整流元件和多个低侧整流元件。高侧整流元件由多个高侧冷却片保持，高侧整流元件由多个低侧散热片保持。作为示例，多个高侧冷却片被布置成彼此隔开预定距离，并且多个低侧冷却片被布置成彼此分开预定距离。

6. 发明授权

US07378745B2 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns 有权
标题翻译：用于具有热塑性树脂层和导电图案的半导体器件的封装衬底
公开(公告)号：US07378745B2
公开(公告)日：2008-05-27
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/053 , H01L23/12 , H01L23/29
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译：具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。

7. 发明授权

US07286367B2 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board 有权
标题翻译：具有内置无源器件的印刷电路板，印刷电路板的制造方法和用于印刷电路板的元件板
公开(公告)号：US07286367B2
公开(公告)日：2007-10-23
申请号：US10339655
申请日：2003-01-10
申请人： Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
发明人： Toshihiro Miyake , Satoshi Takeuchi , Koji Kondo , Toshikazu Harada , Masayuki Aoyama , Yoshitaro Yazaki , Kazuo Tada , Yoshihiko Shiraishi , Yosuke Ozaki , Katsumi Yamazaki , Seiji Konishi , Seiichi Shindou
IPC分类号： H05K1/16
CPC分类号： H05K3/4632 , H01L2924/0002 , H05K1/162 , H05K1/167 , H05K3/4069 , H05K3/4617 , H05K3/4688 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09672 , H05K2203/0361 , H01L2924/00
摘要： A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.
摘要翻译：具有内置电容器的多层印刷电路板包括多个树脂膜，每个树脂膜由热塑性树脂制成，并且在预定位置具有多个通孔，多个导电图案位于树脂上膜和多个导电图案互连构件，它们位于通孔中，以电连接由树脂膜电分离的导电图案。两个导电图案分别位于一个树脂膜上彼此相对的两个表面上，同时重叠。导电图案中的两个和树脂膜中的一个构成电容器。

8. 发明授权

US07240429B2 Manufacturing method for a printed circuit board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US07240429B2
公开(公告)日：2007-07-10
申请号：US10909434
申请日：2004-08-03
申请人： Yoshihiko Shiraishi , Koji Kondo
发明人： Yoshihiko Shiraishi , Koji Kondo
IPC分类号： H01K3/10
CPC分类号： H05K3/4632 , H01L21/4857 , H01L23/49822 , H01L23/49894 , H01L2224/16225 , H01L2924/00014 , H01L2924/09701 , H05K1/0306 , H05K1/095 , H05K1/167 , H05K3/4069 , H05K3/4605 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165 , Y10T29/49211 , H01L2224/0401
摘要： A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.
摘要翻译：在由热塑性树脂制成的树脂膜上形成导体图案。每个单面导体图案膜具有填充有导电浆料的通孔。印刷导体图案和印刷电阻器形成在陶瓷基板上。单面导体图案膜层叠在陶瓷基板上。然后，将多层组件从其两侧加热并压制，得到印刷电路板。在热压处理期间，在导体图案之间以及在导体图案和印刷导体图案之间获得层间连接的情况下，各自的单面导体图案膜和陶瓷基板结合在一起。

9. 发明授权

US07165321B2 Method for manufacturing printed wiring board with embedded electric device 有权
标题翻译：具有嵌入式电气装置的印刷电路板的制造方法
公开(公告)号：US07165321B2
公开(公告)日：2007-01-23
申请号：US10701441
申请日：2003-11-06
申请人： Koji Kondo , Tomohiro Yokochi , Toshihiro Miyake , Satoshi Takeuchi
发明人： Koji Kondo , Tomohiro Yokochi , Toshihiro Miyake , Satoshi Takeuchi
IPC分类号： H05K3/30
CPC分类号： H05K1/186 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H05K1/056 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0394 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49147 , Y10T29/49165 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2224/05624
摘要： A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
摘要翻译：具有嵌入式电气装置的印刷电路板的制造方法如下。具有开口部的第一树脂膜或具有凹部的片状部件与多个第二树脂膜一起堆积，形成有多个导电层。第一和第二树脂膜和片状构件包括热塑性树脂。电气装置插入开口或凹槽中。然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。当堆叠体被按压和加热时，电气装置的电极与导电层电连接，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。

10. 发明授权

US06680441B2 Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device 有权
标题翻译：具有嵌入式电气装置的印刷电路板及具有嵌入式电气装置的印刷电路板的制造方法
公开(公告)号：US06680441B2
公开(公告)日：2004-01-20
申请号：US10166731
申请日：2002-06-12
申请人： Koji Kondo , Tomohiro Yokochi , Toshihiro Miyake , Satoshi Takeuchi
发明人： Koji Kondo , Tomohiro Yokochi , Toshihiro Miyake , Satoshi Takeuchi
IPC分类号： H05K116
CPC分类号： H05K1/186 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H05K1/056 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0394 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49147 , Y10T29/49165 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2224/05624
摘要： A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
摘要翻译：具有嵌入式电气装置的印刷电路板如下制造。具有开口的第一树脂膜或具有凹部的片状构件与多个第二树脂膜一起堆叠，其上形成有多个导电层。第一和第二树脂膜和片状构件包括热塑性树脂。电气装置插入开口或凹槽中。然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。当堆叠体被按压和加热时，电气装置的多个电极电连接到导电层，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。

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