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71. 发明授权

US07232496B2 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board 失效
标题翻译：多层陶瓷电子部件，电路板以及用于制造这些部件和电路板的陶瓷生片的制造方法
公开(公告)号：US07232496B2
公开(公告)日：2007-06-19
申请号：US11068781
申请日：2005-03-02
申请人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
发明人： Masayuki Yoshida , Shunji Aoki , Junichi Sutoh , Genichi Watanabe
IPC分类号： B32B37/00 , B32B38/00 , H01F41/00 , H01G13/00
CPC分类号： H05K3/4667 , C04B35/6269 , H01G4/30 , H05K1/0306 , H05K3/0023 , H05K2201/09881 , H05K2203/0514
摘要： The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.
摘要翻译：本发明提供一种能够应对小型化，提高多层电子部件的性能和质量的电子部件的制造方法。通过在基板上或在基板上形成具有预定厚度的内部电极的层来形成陶瓷生片，在基板或层和内部电极的表面上形成感光陶瓷浆料使其刚刚曝光之前的厚度将基本上等于或小于从基板或层的表面的内部电极的厚度，用来自基板的上侧的光照射感光陶瓷浆料以进行曝光同时掩蔽内部电极图案，以选择性地硬化感光陶瓷浆料的表面，曝光量被控制为使得感光陶瓷浆料的表面硬化，并且去除不具有感光陶瓷浆料的部分感光陶瓷浆料通过显影处理曝光以暴露内部电极图案的表面。

72. 发明申请

US20070023388A1 Conductor composition for use in LTCC photosensitive tape on substrate applications 审中-公开
标题翻译：用于LTCC感光胶带的导体组合物
公开(公告)号：US20070023388A1
公开(公告)日：2007-02-01
申请号：US11490011
申请日：2006-07-20
申请人： Kumaran Nair , Mark McCombs
发明人： Kumaran Nair , Mark McCombs
IPC分类号： B44C1/22 , H01B13/00 , H05K1/00
CPC分类号： H05K1/092 , H01B1/22 , H01L21/486 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/0023 , H05K3/4667 , H01L2924/00
摘要： The present invention is directed to a thick film conductor composition comprising: (a) 70 to 98 weight percent of one or more electrically functional powders; (b) 0.5 to 10 weight percent glass frit; (c) 0.5 to 6 weight percent inorganic borides; dispersed in (d) organic medium, based on total thick film composition. The composition is useful as a via fill and/or innerlayer conductor composition in PTOS applications.
摘要翻译：本发明涉及一种厚膜导体组合物，其包含：（a）70-98重量％的一种或多种电功能粉末; （b）0.5-10重量％玻璃料; （c）0.5至6重量％的无机硼化物; 基于总厚膜组成分散在（d）有机介质中。该组合物可用作PTOS应用中的通孔填充和/或内层导体组合物。

73. 发明申请

US20060103005A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate 失效
标题翻译：用于电路或模块的金属陶瓷衬底，用于制造一个这种衬底的方法和包括一个这种衬底的模块
公开(公告)号：US20060103005A1
公开(公告)日：2006-05-18
申请号：US10515633
申请日：2003-04-11
申请人： Jurgen Schulz-Harder , Peter Haberl
发明人： Jurgen Schulz-Harder , Peter Haberl
IPC分类号： H01L31/111 , H01L21/50
CPC分类号： H05K3/4667 , H01L23/3735 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/162 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/49 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/1301 , H01L2924/15787 , H01L2924/181 , H05K1/0306 , H05K1/092 , H05K3/28 , H05K2201/0352 , H05K2201/0355 , H05K2201/09972 , H05K2203/1476 , Y10T29/49227 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
摘要翻译：本发明涉及一种用于电路或模块的金属陶瓷衬底，所述衬底包括陶瓷层，该陶瓷层设置有以平面方式施加到所述陶瓷层表面的至少一种第一类金属层。由含玻璃的材料构成的绝缘层被施加到第一类型的金属层的表面的至少一个部分区域，与陶瓷层相对的所述表面，并且将第二类型的金属层施加到绝缘层绝缘层和第二类型的金属层分别比陶瓷层和第一类型的金属层更薄。

74. 发明申请

US20060083906A1 Thick film dielectric compositions for use on aluminum nitride substrates 有权
公开(公告)号：US20060083906A1
公开(公告)日：2006-04-20
申请号：US11291167
申请日：2005-12-01
申请人： Yong Cho , Kenneth Hang
发明人： Yong Cho , Kenneth Hang
IPC分类号： C03C8/16 , C03C3/085 , C03C8/00 , B32B3/00 , B32B18/00 , C04B33/34
CPC分类号： H05K3/4667 , C03C3/062 , C03C3/085 , C03C8/04 , C03C8/14 , C04B41/009 , C04B41/5022 , C04B41/86 , C04B2111/00844 , C04B2111/10 , H05K1/0306 , Y10T428/24917 , Y10T428/24926 , C04B41/4539 , C04B41/5031 , C04B41/5042 , C04B41/5024 , C04B35/581
摘要： The present invention relates to a Cd-free and Pb-free glass composition comprising, based in mol %, 1-10% MO where M is selected from Ba, Sr, Ca and mixtures thereof, 5-30% MgO, 0.3-5% CuO, 0-2.5% P2O5, 0-2.5% ZrO2, 24-45% ZnO, 2-10% Al2O3, 35-50% SiO2 and 0.1-3% A2O where A is selected from the group of alkali elements and mixtures thereof wherein the glass composition is useful in thick paste dielectric materials which are compatible with AlN substrates.

75. 发明申请

US20040061232A1 Multilayer substrate 审中-公开
标题翻译：多层基板
公开(公告)号：US20040061232A1
公开(公告)日：2004-04-01
申请号：US10331186
申请日：2002-12-26
申请人： MEDTRONIC MINIMED, INC.
发明人： Rajiv Shah , Shaun Pendo , Edward G. Babiracki
IPC分类号： H01L021/4763
CPC分类号： H01L21/4857 , H01L2924/0002 , H05K1/092 , H05K3/4061 , H05K3/4647 , H05K3/4667 , H05K3/467 , H05K2201/0179 , H05K2203/0278 , H01L2924/00
摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.
摘要翻译：由基底基板和交替的金属化层和电介质层形成的多层衬底器件。每层形成而不烧制。通孔可以延伸穿过介电层之一，使得围绕电介质层的两个金属化层彼此接触。可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。可以施加真空以除去油墨中的空气。然后可以通过压力板将压力施加到印刷纸上。当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

76. 发明授权

US06602370B1 Method of manufacturing ceramic electronic components 有权
标题翻译：制造陶瓷电子元器件的方法
公开(公告)号：US06602370B1
公开(公告)日：2003-08-05
申请号：US09786729
申请日：2001-05-17
申请人： Hideki Kuramitsu , Atsuo Nagai , Yoshiya Sakaguchi , Yoshiyuki Miura
发明人： Hideki Kuramitsu , Atsuo Nagai , Yoshiya Sakaguchi , Yoshiyuki Miura
IPC分类号： H01G412
CPC分类号： H01G4/308 , H05K1/0306 , H05K3/207 , H05K3/4667 , H05K2203/0156 , H05K2203/061 , Y10T29/49163
摘要： A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.
摘要翻译：一种陶瓷电子部件的制造方法，其特征在于，包括：第一工序，在基膜上设置多个含有陶瓷粉末和聚乙烯并且具有30％以上的孔隙率的陶瓷片，以及含有金属粉末，增塑剂和树脂的导体层 ; 将导体层与基膜一起层压并加压在其中一个陶瓷片上的第二步骤，剥离基膜以形成具有导体层的陶瓷片; 将另一陶瓷片放置在导体层的顶部上的第三步骤; 在另一陶瓷片的顶部上层叠并加压另一个导体层的第四步骤; 重复第三和第四步骤以形成具有所需数量层的层压体的第五步骤; 以及烧结层叠体的第六步骤。

77. 发明申请

US20020149101A1 Wiring board and method of manufacturing same 失效
标题翻译：接线板及其制造方法
公开(公告)号：US20020149101A1
公开(公告)日：2002-10-17
申请号：US10118744
申请日：2002-04-09
申请人： NGK Insulators, Ltd.
发明人： Koji Ikeda , Kazuyoshi Shibata
IPC分类号： H01L023/495 , H01L023/06 , H01L023/10 , H01L023/15
CPC分类号： H05K3/38 , H01L41/047 , H01L41/0471 , H01L41/0477 , H01L41/094 , H01L41/273 , H01L41/29 , H01L41/314 , H01L2924/0002 , H05K1/0306 , H05K1/16 , H05K3/4667 , H05K2201/0175 , H05K2201/09881 , H05K2201/10083 , H01L2924/00
摘要： A first cermet layer to be a first wiring pattern and a second cermet layer to be an insulating layer filling gaps in the first wiring pattern are formed on a ceramic substrate. Thereafter, the first cermet layer and the second cermet layer are fired to produce the first wiring pattern and the insulating layer simultaneously. Then, a PZT paste to be a piezoelectric/electrostrictive layer is formed and thereafter fired to produce the piezoelectric/electrostrictive layer. Thereafter, a third cermet layer to be a second wiring pattern is formed and thereafter fired to produce the second wiring pattern, thereby fabricating a wiring board.
摘要翻译：作为第一布线图案的第一金属陶瓷层和填充第一布线图案中的间隙的绝缘层的第二金属陶瓷层形成在陶瓷基板上。此后，第一金属陶瓷层和第二金属陶瓷层被烧制以同时产生第一布线图案和绝缘层。然后，形成作为压电/电致伸缩层的PZT糊料，然后烧制以产生压电/电致伸缩层。此后，形成作为第二布线图案的第三金属陶瓷层，然后烧制以产生第二布线图案，从而制造布线板。

78. 发明申请

US20010015250A1 Laminated ceramic electronic components and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US20010015250A1
公开(公告)日：2001-08-23
申请号：US09741686
申请日：2000-12-20
发明人： Hiromichi Tokuda , Shingo Okuyama , Tsuyoshi Tatsukawa , Makoto Fukuda
IPC分类号： C03B029/00
CPC分类号： H05K3/4667 , B32B18/00 , C04B2237/02 , C04B2237/04 , H01C17/065 , H01C17/281 , H01F17/0013 , H01F41/043 , H01G4/308 , H05K1/092 , H05K3/207
摘要： A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.
摘要翻译：进行层叠陶瓷电子部件的制造方法，使得内部电极的厚度大大增加，不发生分层，并且可靠性优异。层压陶瓷电子部件的制造方法包括在载体片上设置包括内部电极浆料层和陶瓷膏体层的生片，使得内部电极浆料层从上表面贯穿生片并且重复将生片和载体膜的层压体通过压制粘合，然后将载体膜剥离的工序，得到陶瓷层叠体，将陶瓷层叠体烧制后在厚度方向上压制以获得陶瓷烧结体。

79. 发明申请

US20010014429A1 Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same 有权
标题翻译：感光玻璃浆料及使用其制造多层互连电路板的方法
公开(公告)号：US20010014429A1
公开(公告)日：2001-08-16
申请号：US09757869
申请日：2001-01-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Michiaki Iha
IPC分类号： G03F007/033 , G03F007/027 , G03F007/075 , G03F007/40
CPC分类号： C03C8/22 , C03C8/16 , H05K1/0306 , H05K3/0023 , H05K3/4667
摘要： A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400null C. to 600null C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300null C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.
摘要翻译：提供含有含有玻璃粉末和感光性有机成分的无机成分的感光性玻璃糊剂。玻璃粉末含有约1-30重量％的玻璃软化点在约400℃至600℃范围内的低熔点玻璃粉末和约70至99重量％的高熔点玻璃软化点比低熔点玻璃的玻璃软化点高约300℃以上的玻璃粉末。作为高熔点玻璃，采用抑制Ag等导电性成分的扩散的硼硅酸盐玻璃。感光性玻璃糊中的无机成分的含量在约40〜70重量％的范围内。还提供了使用上述感光玻璃浆料制造多层互连电路板的方法。

80. 发明授权

US5650199A Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink 失效
标题翻译：利用导电通孔形成油墨制造具有层间导体连接的多层电子部件的方法
公开(公告)号：US5650199A
公开(公告)日：1997-07-22
申请号：US562158
申请日：1995-11-22
申请人： Daniel H. Chang , Arthur C. McAdams , Xiangming Li
发明人： Daniel H. Chang , Arthur C. McAdams , Xiangming Li
IPC分类号： C04B41/52 , C04B41/89 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B05D3/04 , B05D5/12
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , H01L21/486 , H01L23/49827 , H01L23/5384 , H05K3/4647 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K2203/0783 , H05K3/4061 , H05K3/4667
摘要： A multilayered electronic component created by a wet process, wherein a ceramic base is imprinted with an electrode and an interlayer via is formed on top of it by introducing a via pattern printed in ink that is incompatible with a layer of wet ceramic slurry coating placed on top of the electrode and the via pattern. The incompatibility leads to a physical-chemical reaction that removes ceramic material away from the top of the via pattern by diffusing ceramic materials contained in a colloidal suspension forming a via-through hole. After the wet ceramic slurry is dried, it surrounds the via-through hole and the imprinted via pattern. Then a new electrode layer is imprinted on top of the dried ceramic coating. The new electrode layer completes an electrically conductive path formed from the bottom-most electrode layer, to the via pattern, and then terminating at the new electrode layer on top.
摘要翻译：通过湿法制造的多层电子部件，其中陶瓷基底印有电极，并且在其顶部形成中间通孔，通过引入印刷在油墨中的通孔图案，所述通孔图案与涂覆在其上的湿陶瓷浆料涂层不相容电极顶部和通孔图案。不相容性导致物理化学反应，其通过扩散形成通孔的胶体悬浮液中包含的陶瓷材料来移除陶瓷材料远离通孔图案的顶部。在湿陶瓷浆料干燥之后，其包围通孔和印迹通孔图案。然后将新的电极层印在干燥的陶瓷涂层的顶部上。新的电极层完成由最底部电极层，通孔图案形成的导电路径，然后在顶部的新电极层处终止。

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