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    • 4. 发明授权
    • Electronic device of ceramic
    • 陶瓷电子器件
    • US06780267B1
    • 2004-08-24
    • US09830493
    • 2001-09-04
    • Hideki KuramitsuAtsuo NagaiYoshiya Sakaguchi
    • Hideki KuramitsuAtsuo NagaiYoshiya Sakaguchi
    • B32B3126
    • H01L21/4857H01G4/206H01G4/30H01L21/481H05K1/0306H05K3/0011H05K3/1283H05K3/4629H05K2203/0143H05K2203/0278
    • A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.
    • 制造陶瓷的方法包括:压缩含有陶瓷粉末和有机物的陶瓷片(10a)以降低孔隙率的第一步骤,在陶瓷片(10b)上形成金属膏的导体层(2)的第二步骤,第三步骤 将多个陶瓷片(10b)堆叠成层叠体,使得每个陶瓷片(10b)夹在导体层(2)之间的步骤,以及烧结层压体的第四步骤。 由于导电体层(2)形成在其孔隙率降低的陶瓷片(10b)上,金属成分被阻碍进入陶瓷片(10b)。 可以通过转印到陶瓷片上来抑制导体层的金属成分的扩散而形成导体层。 这种方法可以减少陶瓷器件的短路并提高产量。
    • 5. 发明授权
    • Method of manufacturing ceramic electronic components
    • 制造陶瓷电子元器件的方法
    • US06602370B1
    • 2003-08-05
    • US09786729
    • 2001-05-17
    • Hideki KuramitsuAtsuo NagaiYoshiya SakaguchiYoshiyuki Miura
    • Hideki KuramitsuAtsuo NagaiYoshiya SakaguchiYoshiyuki Miura
    • H01G412
    • H01G4/308H05K1/0306H05K3/207H05K3/4667H05K2203/0156H05K2203/061Y10T29/49163
    • A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.
    • 一种陶瓷电子部件的制造方法,其特征在于,包括:第一工序,在基膜上设置多个含有陶瓷粉末和聚乙烯并且具有30%以上的孔隙率的陶瓷片,以及含有金属粉末,增塑剂和树脂的导体层 ; 将导体层与基膜一起层压并加压在其中一个陶瓷片上的第二步骤,剥离基膜以形成具有导体层的陶瓷片; 将另一陶瓷片放置在导体层的顶部上的第三步骤; 在另一陶瓷片的顶部上层叠并加压另一个导体层的第四步骤; 重复第三和第四步骤以形成具有所需数量层的层压体的第五步骤; 以及烧结层叠体的第六步骤。