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1. 发明申请

US20040061234A1 High reliability multlayer circuit substrates and methods for their formation 有权
标题翻译：高可靠性多层电路基板及其形成方法
公开(公告)号：US20040061234A1
公开(公告)日：2004-04-01
申请号：US10671996
申请日：2003-09-26
申请人： MEDTRONIC MINIMED, INC.
发明人： Rajiv Shah , Shaun Pendo
IPC分类号： H01L023/48
CPC分类号： H05K3/467 , H01L21/4857 , H01L21/4867 , H01L2924/0002 , H01L2924/19107 , H05K1/162 , H05K3/048 , H05K3/4053 , H05K3/4061 , H05K3/4664 , H05K2201/0179 , H05K2203/0278 , H05K2203/085 , H05K2203/1476 , H05K2203/308 , H01L2924/00
摘要： A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
摘要翻译：用于多芯片模块或混合电路的多层电路衬底包括介质基底，形成在基底衬底上的导体和形成在导体和基底衬底上的真空沉积的电介质薄膜。使用由荫罩技术形成的牺牲结构对真空沉积的电介质薄膜进行图案化。以这种方式形成的基板能够显着增加互连密度并显着降低总体衬底厚度。

2. 发明申请

US20040061232A1 Multilayer substrate 审中-公开
标题翻译：多层基板
公开(公告)号：US20040061232A1
公开(公告)日：2004-04-01
申请号：US10331186
申请日：2002-12-26
申请人： MEDTRONIC MINIMED, INC.
发明人： Rajiv Shah , Shaun Pendo , Edward G. Babiracki
IPC分类号： H01L021/4763
CPC分类号： H01L21/4857 , H01L2924/0002 , H05K1/092 , H05K3/4061 , H05K3/4647 , H05K3/4667 , H05K3/467 , H05K2201/0179 , H05K2203/0278 , H01L2924/00
摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.
摘要翻译：由基底基板和交替的金属化层和电介质层形成的多层衬底器件。每层形成而不烧制。通孔可以延伸穿过介电层之一，使得围绕电介质层的两个金属化层彼此接触。可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。可以施加真空以除去油墨中的空气。然后可以通过压力板将压力施加到印刷纸上。当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

3. 发明申请

US20040223875A1 Sensor substrate and method of fabricating same 有权
标题翻译：传感器基板及其制造方法
公开(公告)号：US20040223875A1
公开(公告)日：2004-11-11
申请号：US10861976
申请日：2004-06-04
申请人： Medtronic MiniMed, Inc.
发明人： Shaun Pendo , Rajiv Shah , Edward Chernoff
IPC分类号： G01N021/00
CPC分类号： H05K3/28 , A61B5/0006 , H05K1/0306 , H05K3/4061 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/09472 , H05K2203/082 , H05K2203/085 , H05K2203/1147 , H05K2203/1476 , H05K2203/1572 , H05K2203/308
摘要： A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
摘要翻译：具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。通孔可以填充有导电材料，例如无油墨。由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

4. 发明申请

US20040212076A1 Multilayer substrate 有权
标题翻译：多层基板
公开(公告)号：US20040212076A1
公开(公告)日：2004-10-28
申请号：US10845002
申请日：2004-05-12
申请人： Medtronic MiniMed, Inc.
发明人： Rajiv Shah , Shaun Pendo , Edward G. Babiracki
IPC分类号： H01L023/48
CPC分类号： H01L21/4857 , H01L2924/0002 , H05K1/092 , H05K3/4061 , H05K3/4647 , H05K3/4667 , H05K3/467 , H05K2201/0179 , H05K2203/0278 , H01L2924/00
摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make. contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.
摘要翻译：由基底基板和交替的金属化层和电介质层形成的多层衬底器件。每层形成而不烧制。通孔可以延伸穿过介电层之一，使得包围电介质层的两个金属化层形成。互相接触。可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。可以施加真空以除去油墨中的空气。然后可以通过压力板将压力施加到印刷纸上。当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

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