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1. 发明授权

CN1174548C 压电装置及其制造方法失效
公开(公告)号：CN1174548C
公开(公告)日：2004-11-03
申请号：CN01132637.9
申请日：2001-09-05
申请人：精工爱普生株式会社
发明人：芹泽聪
IPC分类号： H03H9/10 , H01L023/10
CPC分类号： H03H9/0547 , H01L2224/45144 , H01L2224/48091 , H01L2924/3011 , H03H9/1021 , H01L2924/00014 , H01L2924/00
摘要：提供一种来自外部的冲击和对压电振动片的作用应力强、能使外壳基座的电极一侧和压电振动片良好地导通的结构的压电装置及其制造方法。在具有对设置在外壳基座42上的电极44接合压电振动片的结构的压电装置中，备有设置在上述外壳基座42上、通过导通路径44b传导激励电压，同时装配上述压电振动片的装配电极44、44；以及配置在上述装配电极的表面上，利用与该装配电极的表面紧密接触性能好的材料形成的导电性的固定构件41、41，上述压电振动片11通过硅系列导电粘合剂15、15被接合在该导电性的固定构件上。

2. 发明申请

US20040238945A1 Thermally enhanced semiconductor package and fabrication method thereof 有权
标题翻译：热增强半导体封装及其制造方法
公开(公告)号：US20040238945A1
公开(公告)日：2004-12-02
申请号：US10635168
申请日：2003-08-05
申请人： Silicon Precision Industries Co., Ltd.
发明人： Chien-Ping Huang , Cheng-Hsu Hsiao
IPC分类号： H01L023/10
CPC分类号： H01L24/97 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/32245 , H01L2224/73267 , H01L2224/83385 , H01L2224/92224 , H01L2224/92244 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15159 , H01L2924/15311 , H01L2224/82 , H01L2224/83 , H01L2924/00
摘要： A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.
摘要翻译：提供一种热增强型半导体封装及其制造方法。在芯片的有源表面上的接合焊盘上形成多个导电凸块。散热器附着在芯片的非活性表面上，其表面积大于芯片的表面积。封装体封装散热器，芯片和导电凸块，同时暴露散热片的底部或表面，而不是将散热片和导电凸块的端部外露。多个导电迹线形成在封装主体上并电连接到导电凸块的端部。焊接掩模层施加在导电迹线上并形成有多个用于暴露导电迹线的预定部分的开口。在导电迹线的每个暴露部分上注入焊球。

3. 发明申请

US20040238944A1 Integrated heat spreader lid 失效
标题翻译：集成散热器盖
公开(公告)号：US20040238944A1
公开(公告)日：2004-12-02
申请号：US10449940
申请日：2003-05-30
发明人： Jack Bish , Kevin Hanrahan , Damon Brink
IPC分类号： H01L023/10
CPC分类号： H01L23/3675 , H01L23/10 , H01L2924/01079 , H01L2924/16152 , H01L2924/1616
摘要： A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery region and may comprise a number of slots cut partially or completely through the lid in a pattern surrounding or partially surrounding the center region. The strain isolation regions provide isolation of strain and relief of stress due to thermal expansion of the lid despite constraint at its periphery by the bonded lip, resulting in less thermally-induced warping of the center region, less thermally-induced stress on the bond between the lip and the substrate board, and/or less thermally-induced deflection of the substrate board. The reduced warping, stress, and/or deflection increases the reliability of the system by reducing the propensity for delamination or separation in the interface between the lid and the die, and/or by reducing the chance of structural failure in the bond between the lid and the substrate board.
摘要翻译：散热器盖包括具有用于结合到下面的基板，中心区域和一个或多个应变隔离区域的唇缘的外周区域。应变隔离区域位于中心区域和外周边区域之间，并且可以包括以周围或部分围绕中心区域的图案部分地或完全地通过盖子切割的多个槽。应变隔离区域提供了由于盖子的热膨胀而导致的应力分离和释放应力，尽管在其外围受到粘合的唇缘的约束，导致较少的热诱导的中心区域的翘曲，较少的热诱导的在唇缘和衬底板，和/或较少的热诱导的衬底板的偏转。减小的翘曲，应力和/或挠曲通过降低在盖和模具之间的界面中的分层或分离的倾向和/或通过减少盖子之间的结合的结构故障的机会来增加系统的可靠性和基板。

4. 发明申请

US20040159934A1 Heat pipe thermal management of high potential electronic chip packages 审中-公开
标题翻译：热管热管理高电位电子芯片封装
公开(公告)号：US20040159934A1
公开(公告)日：2004-08-19
申请号：US10780322
申请日：2004-02-17
发明人： Mark T. North , Nelson J. Gernert , Donald M. Ernst
IPC分类号： H01L023/10
CPC分类号： H01L23/3735 , H01L23/427 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： An improved electronic chip package is disclosed, which may include an electrical insulator, top and bottom metallization layers associated with said insulator, an integrated circuit (IC) device, and a heat pipe placed between the electrical insulator and the IC device, and soldered to the IC device, wherein the wall of the heat pipe may be constructed so that thermal stresses in the IC device are reduced.
摘要翻译：公开了一种改进的电子芯片封装，其可以包括与所述绝缘体相关联的电绝缘体，顶部和底部金属化层，集成电路（IC）装置和放置在电绝缘体和IC器件之间的热管，并焊接到 IC器件，其中热管的壁可以被构造成使得IC器件中的热应力减小。

5. 发明申请

US20040150097A1 OPTIMIZED CONDUCTIVE LID MOUNTING FOR INTEGRATED CIRCUIT CHIP CARRIERS 审中-公开
标题翻译：用于集成电路芯片运输的优化导电安装
公开(公告)号：US20040150097A1
公开(公告)日：2004-08-05
申请号：US10707206
申请日：2003-11-26
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Michael A. Gaynes , Stefano Oggioni , Giorgio Viero
IPC分类号： H01L023/12 , H01L023/10
CPC分类号： H01L24/28 , H01L23/16 , H01L23/3128 , H01L23/36 , H01L23/49816 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/19041 , H01L2924/3025 , H01L2924/351 , H01L2924/01028 , H01L2924/00 , H01L2924/3512 , H01L2924/0665 , H01L2224/0401
摘要： An optimized lid mounting for electronic device carriers, using standard manufacturing process steps of semiconductor packaging, optimizing heat dissipation and electromagnetic interference shielding is disclosed. According to the invention, conductive blocks or springs are soldered to ground pads of the chip carrier on their lower side. On the other side, these conductive blocks or springs are electrically connected to the lid with conductive adhesive material such as silicone based material. Furthermore, the lid is thermally connected to the semiconductor chip with electrical insulative adhesive material.
摘要翻译：公开了一种用于电子设备载体的优化的盖安装，使用半导体封装的标准制造工艺步骤，优化散热和电磁干扰屏蔽。根据本发明，导电块或弹簧在其下侧焊接到芯片载体的接地焊盘。另一方面，这些导电块或弹簧与诸如硅酮基材料的导电粘合剂材料电连接到盖上。此外，盖子用电绝缘粘合剂材料热连接到半导体芯片。

6. 发明申请

US20040084764A1 Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board 有权
标题翻译：封装结构，安装有印刷电路板的电子设备具有印刷电路板
公开(公告)号：US20040084764A1
公开(公告)日：2004-05-06
申请号：US10662815
申请日：2003-09-16
发明人： Junichi Ishimine , Tsuyoshi So , Hitoshi Nori , Takashi Urai
IPC分类号： H01L023/10
CPC分类号： H01L23/4006 , H01L2023/4043 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2924/00014 , H01L2924/01087 , H01L2224/0401
摘要： A package structure to be mounted on was external printed circuit board includes a package board that is mounted with an exoergic circuit element, and a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board.
摘要翻译：要安装的封装结构是外部印刷电路板，包括安装有散热电路元件的封装板和从散热电路元件辐射热量的散热器，其中用于将散热器连接到封装板的第一压力与第二压力分离，用于将封装板压靠印刷电路板。

7. 发明申请

US20040061218A1 Integrated circuit heat dissipation system 有权
标题翻译：集成电路散热系统
公开(公告)号：US20040061218A1
公开(公告)日：2004-04-01
申请号：US10292073
申请日：2002-11-12
发明人： Charles L. Tilton , Donald E. Tilton , Jeffrey K. Weiler
IPC分类号： H01L023/10 , H01L023/48 , H01L023/34 , H01L023/52 , H01L029/40
CPC分类号： F28D5/00 , H01L23/4336 , H01L23/4735 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.
摘要翻译：一种集成电路散热系统，用于减少封装集成电路中的接点数量，从而降低热阻抗并增加散热效率。集成电路散热系统包括附接到基板的盖子，围绕盖子附接的盖子，形成散热室，以及通过导热粘合剂附接到盖子的半导体芯片。取决于所使用的衬底，盖子可以或可以不形成围绕半导体芯片的空腔。盖子优选地包括从其限定多个通道或多个槽的多个翅片，从而增加盖子的热通量。

8. 发明申请

US20040051172A1 Radiation type bga package and production method therefor 失效
标题翻译：辐射型bga包装及其生产方法
公开(公告)号：US20040051172A1
公开(公告)日：2004-03-18
申请号：US10297750
申请日：2002-12-09
发明人： Takeshi Miyazaki , Akihiro Hamano , Shigehisa Tomabechi
IPC分类号： H01L023/10 , H01L023/34
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4006 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： (1) A thermal enhanced type of BGA package, in which a metal heat sink is joined to one side of a plastic circuit board which has a cutout space in the central portion, comprised of a clamping member joining the plastic circuit board and the heat sink. A caulking member, a rivet, a screw, an eyelet, or a tubular rivet could be used as the clamping member. It is preferable that a dam member is definitely attached by the clamping member. (2) Another thermal enhanced type of BGA package, in which a circuit pattern is provided in the plastic circuit board and the heat sink and/or the dam member are electrically connected to a part of the circuit pattern through the clamping member. It is preferable to use the clamping member coated by solder.
摘要翻译：（1）一种热增强型BGA封装，其中金属散热器连接到塑料电路板的一侧，该塑料电路板在中心部分具有切口空间，包括接合塑料电路板的夹紧件和热量水槽。可以使用铆接部件，铆钉，螺钉，孔眼或管状铆钉作为夹紧部件。优选地，夹持构件绝对地附着有阻挡构件。（2）另一种热增强型BGA封装，其中在塑料电路板和散热器和/或阻挡构件中设置电路图案通过夹紧构件电连接到电路图案的一部分。优选使用由焊料涂布的夹持构件。

9. 发明申请

US20040026778A1 Low cost power semiconductor module without substate 有权
标题翻译：低成本功率半导体模块无子状态
公开(公告)号：US20040026778A1
公开(公告)日：2004-02-12
申请号：US10635359
申请日：2003-08-06
申请人： International Rectifier Corporation
发明人： William Grant
IPC分类号： H01L023/10
CPC分类号： H01L23/49861 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L25/165 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01047 , H01L2924/01074 , H01L2924/014 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/1433 , H02M7/003 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically, connected via wire bonds.
摘要翻译：公开了一种用于低电压应用的功率模块，其不包括绝缘金属衬底。该模块包括功率外壳和多个引线框架，每个引线框架包括导电焊盘，一个或多个MOSFET可以电连接在该导电焊盘上。 MOSFET通过引线键电连接。

10. 发明申请

US20040026777A1 Semiconductor device 失效
公开(公告)号：US20040026777A1
公开(公告)日：2004-02-12
申请号：US10353950
申请日：2003-01-30
申请人： Mitsubishi Denki Kabushiki Kaisha
发明人： Kazuo Yokoyama , Shigeki Kageyama , Jun Otsuji
IPC分类号： H01L023/10
CPC分类号： H01L23/433 , H01L23/04 , H01L23/552 , H01L25/165 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/1532 , H01L2924/19106 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device which has a preferable construction for downsizing, in which chip part(s) and a cap are not short-circuited, is provided. The semiconductor device includes: a substrate having a first surface with a cavity and a second surface opposite to the first surface; a semiconductor chip arranged in the cavity; a chip part mounted on the second surface of the substrate; a heat sink which is mounted on the second surface of the substrate and transfers heat liberated from the chip; a cap which is fitted to the substrate, covers the second surface of the substrate, and is joined to the heat sink; and an insulator provided between the cap and the chip part. By providing the insulator, short-circuiting of the chip part and the cap is prevented. Consequently, a distance between the cap and chip part can be shortened to downsize the size of semiconductor device.

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