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    • 74. 发明授权
    • Method of and apparatus for removing an organic film
    • 除去有机膜的方法和装置
    • US5503708A
    • 1996-04-02
    • US155858
    • 1993-11-23
    • Kootaroo KoizumiSukeyoshi TsunekawaKenichi KawasumiTakeshi KimuraKeisuke Funatsu
    • Kootaroo KoizumiSukeyoshi TsunekawaKenichi KawasumiTakeshi KimuraKeisuke Funatsu
    • H01L21/306G03F7/42H01L21/311H01L21/00
    • G03F7/42H01L21/31138
    • An organic film removing method uses an organic film removing apparatus comprising a processing vessel defining a processing chamber, a wafer support for supporting a semiconductor wafer within the processing chamber, and a mixed gas supplier for supplying a mixed gas consisting of an alcohol or alcohols, and ozone gas or an ozone-containing gas into the processing chamber so that the mixed gas acts on an organic film pattern on the surface of the supported semiconductor wafer. The apparatus continuously supplies the mixed gas into the processing chamber at least in a period between a time immediately before mounting the semiconductor wafer on the wafer support and a time when the organic film is removed completely; conveys the semiconductor wafer into the processing chamber; supports the semiconductor wafer within the processing chamber; and heats the patterned organic film on the surface of the supported semiconductor wafer at a temperature in a range below a temperature at which substantial defects will be formed in the elements of a semiconductor device to be formed on the semiconductor wafer. This method is capable of ashing the organic film at an ashing rate equal to or higher than an ashing rate at which a known organic film removing method employing a steam-containing ozone gas ashes the organic film, and of reducing water marks as compared with the known method employing the steam-containing ozone gas.
    • 有机膜去除方法使用有机膜去除装置,其包括限定处理室的处理容器,用于在处理室内支撑半导体晶片的晶片支撑件和用于供应由醇或醇组成的混合气体的混合气体供应器, 和臭氧气体或含臭氧气体进入处理室,使得混合气体作用在被支撑的半导体晶片的表面上的有机膜图案上。 至少在将半导体晶片安装在晶片载体上之前的时间和完全去除有机薄膜的时间之间的时间内,该装置将混合气体连续地供给到处理室中; 将半导体晶片传送到处理室中; 支撑处理室内的半导体晶片; 并且在半导体晶片的要形成的半导体器件的元件中将在形成缺陷的温度以下的温度范围内的温度下对被加热的半导体晶片的表面上的图案化有机膜进行加热。 该方法能够以等于或高于使用含有蒸汽的臭氧气体的有机薄膜去除方法灰化有机薄膜并且与其相比减少水痕的灰化速率灰化的有机薄膜灰化 已知的使用含蒸汽的臭氧气体的方法。
    • 76. 发明授权
    • Differential code transmission system
    • 差分码传输系统
    • US5228059A
    • 1993-07-13
    • US832587
    • 1992-02-07
    • Toshiyuki TakegaharaSatoru KoizumiYoshiharu HoshinoHideki SuganamiKozo KamedaTakeshi KimuraYoshimichi Otsuka
    • Toshiyuki TakegaharaSatoru KoizumiYoshiharu HoshinoHideki SuganamiKozo KamedaTakeshi KimuraYoshimichi Otsuka
    • H03M3/04H04L25/34
    • H03M7/3044H04B14/066
    • As to a differential code (DPCM) transmission system for an input signal as such as an audio signal, in case higher frequency components thereof are dominant, every another samples of the input signal are alternately into two groups, in each of which differential coding effected, so as to maintain a dynamic range in higher frequency range; in case no frequency components exceeding one fourth of the sampling frequency are contained in the input signal, successive 3 MSB's having a pattern "1, 0, 1" or "0, 1, 0" are corrected into "1, 1, 1" or "0, 0, 0" respectively; and in case 2 symbols of a tertiary code converted from 3 bits of a binary code are transmitted and restored, peripheral bit arrangement of a matrix having rows consisting of the first symbols of the converted tertiary codes and columns consisting of the second symbols thereof are allotted such as Gray codes are obtained, while an inner 2.times.2 matrix of a 4.times.4 matrix formed by inserting a new threshold level between two threshold levels provided for detecting the tertiary code is allotted with bits relating to bits arranged at adjacent positions, so as to reduce the bit error rate of the restored binary code.
    • 对于用于诸如音频信号的输入信号的差分码(DPCM)传输系统,如果其较高频率分量占优势,则输入信号的每隔一个样本交替地分成两组,每一个采样差分编码 ,以保持较高频率范围内的动态范围; 在输入信号中不包含超过采样频率四分之一的频率分量的情况下,具有模式“1,0”或“0,1,0”的连续3个MSB被校正为“1,1,1” 或“0,0,0” 并且在发送和恢复从二进制码的3位转换的三级代码的2个符号的情况下,分配具有由转换的第三代码的第一符号组成的行的矩阵的周边比特排列以及由其第二个符号组成的列 例如格雷码,而通过在提供用于检测第三代码的两个阈值电平之间插入新的阈值电平形成的4×4矩阵的内部2×2矩阵被分配有与布置在相邻位置的位有关的位,以便减少 恢复的二进制码的误码率。
    • 78. 发明授权
    • Pattern fabricating method
    • 图案制作方法
    • US4981771A
    • 1991-01-01
    • US309026
    • 1989-02-07
    • Kozo MochijiYasunari SodaTakeshi Kimura
    • Kozo MochijiYasunari SodaTakeshi Kimura
    • G03F1/22G03F7/20
    • G03F1/22G03F7/2061Y10S430/168
    • When a pattern is to be fabricated by a lithography using radiation on a heavy metal layer formed on a substrate, secondary electrons are generated in a diverging form from the heavy metal layer by irradiation with a radioactive ray to expose the resist. As a result, the accuracy of the pattern to be formed on the resist is reduced. In order to prevent this, a layer to be transferred, a substrate to be worked, a mask and so on are formed with a film capable of absorbing the secondary electrons so that secondary electrons generated from the heavy metal layer may not reach the resist film. Although a pattern having a thickness of 2 microns or less could not be fabricated according to the prior art, a pattern as thin as 1.5 microns can be fabricated by the method of the present invention.
    • 当通过使用在衬底上形成的重金属层上的辐射进行光刻来制造图案时,通过用放射线照射而从重金属层以分散的形式产生二次电子以暴露抗蚀剂。 结果,降低了在抗蚀剂上形成的图案的精度。 为了防止这种情况,可以用能够吸收二次电子的膜形成待转移层,待加工基板,掩模等,使得从重金属层产生的二次电子可能不到达抗蚀剂膜 。 虽然根据现有技术不能制造2微米或更小的厚度的图案,但是可以通过本发明的方法制造薄至1.5微米的图案。
    • 79. 发明授权
    • Combustor of gas turbine
    • 燃气轮机燃烧器
    • US4695247A
    • 1987-09-22
    • US833268
    • 1986-02-26
    • Yoshiki EnzakiKazuki KitaharaSatoru TerasakaKenji MoriTakeshi Kimura
    • Yoshiki EnzakiKazuki KitaharaSatoru TerasakaKenji MoriTakeshi Kimura
    • F23R3/06F23R3/00F23D14/02
    • F23R3/002F05B2260/201F05B2260/202F05B2260/2241
    • A combustor of a gas turbine having a double wall construction in one part of the combustor, wherein an outer plate is formed with a multiplicity of cooling air inlet apertures and an inner plate is formed with a multiplicity of cooling air outlet apertures. The inner and outer plates are connected together by a multiplicity of connectors formed of heat conductive material and define therebetween a space. The cooling air inlet apertures are greater in diameter but smaller in total area than the cooling air outlet apertures which are inclined at an angle of 30 degrees. Cooling air introduced into the space through the cooling air inlet apertures impinge on the inner surface of the inner plate and performs impinge cooling while the connectors perform pin fin cooling. The cooling air also performs film cooling as it flows along the outer surface of the inner plate after cooling the walls of the cooling air outlet apertures while being released.
    • 一种燃气轮机的燃烧器,其具有在燃烧器的一部分中的双壁结构,其中外板形成有多个冷却空气入口孔,并且内板形成有多个冷却空气出口孔。 内板和外板通过由导热材料形成的多个连接件连接在一起,并在其间限定空间。 冷却空气入口孔的直径更大,总面积小于以30度倾斜的冷却空气出口孔。 通过冷却空气入口孔引入空间的冷却空气撞击内板的内表面,并且在连接器执行销散热冷却时进行冲击冷却。 当冷却空气在释放时冷却冷却空气出口孔的壁之后,冷却空气也会沿着内板的外表面流动。