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71. 发明授权

US5893794A Polishing apparatus having robotic transport apparatus 失效
标题翻译：具有机器人输送装置的抛光装置
公开(公告)号：US5893794A
公开(公告)日：1999-04-13
申请号：US808690
申请日：1997-02-28
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
IPC分类号： B65G49/07 , H01L21/677 , H01L21/687 , B24B7/06
CPC分类号： H01L21/67766 , H01L21/68707 , Y10S451/914
摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.
摘要翻译：机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

72. 发明授权

US09308621B2 Method and apparatus for polishing a substrate 有权
标题翻译：抛光基板的方法和装置
公开(公告)号：US09308621B2
公开(公告)日：2016-04-12
申请号：US13057605
申请日：2009-08-07
申请人： Makoto Fukushima , Tetsuji Togawa , Shingo Saito , Tomoshi Inoue
发明人： Makoto Fukushima , Tetsuji Togawa , Shingo Saito , Tomoshi Inoue
IPC分类号： B24B49/10 , B24B49/16 , B24B37/005 , B24B37/32 , B24B37/04 , B24B49/12
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/32 , B24B49/10 , B24B49/12
摘要： A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
摘要翻译：抛光方法用于将半导体晶片等基板研磨成平面镜面。通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构沿垂直方向移动顶环（1）。在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

73. 发明授权

US08641480B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08641480B2
公开(公告)日：2014-02-04
申请号：US13036114
申请日：2011-02-28
申请人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
发明人： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota , Takeshi Nishioka
IPC分类号： B24B1/00
CPC分类号： B24B1/00 , B24B55/00
摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.
摘要翻译：抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

74. 发明授权

US08292694B2 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method 有权
标题翻译：基板保持机构，基板研磨装置和基板研磨方法
公开(公告)号：US08292694B2
公开(公告)日：2012-10-23
申请号：US12618033
申请日：2009-11-13
申请人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
发明人： Tetsuji Togawa , Toshio Watanabe , Hiroyuki Yano , Gen Toyota , Kenji Iwade , Yoshikuni Tateyama
IPC分类号： B24B49/00
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和抛光尘埃附着在基板保持部的外周部并干燥。基板保持机构具有安装凸缘，支撑构件6和保持环。待研磨的基板被保持在由保持环包围的支撑构件的下侧，并且基板被压靠在抛光台的抛光表面上。安装凸缘设置有至少与保持环相邻的流动通道。通过流路供给温度控制气体以冷却安装凸缘，支撑构件和保持环。保持环设置有与流路连通的多个通孔，以将流过流道的气体喷射到抛光台的抛光表面上。

75. 发明授权

US08100739B2 Substrate holding apparatus, polishing apparatus, and polishing method 有权
公开(公告)号：US08100739B2
公开(公告)日：2012-01-24
申请号：US12222908
申请日：2008-08-19
申请人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
发明人： Hozumi Yasuda , Tetsuji Togawa , Osamu Nabeya , Kenichiro Saito , Makoto Fukushima , Tomoshi Inoue
IPC分类号： B24B49/00
CPC分类号： B24B37/32
摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

76. 发明授权

US08083571B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08083571B2
公开(公告)日：2011-12-27
申请号：US11665648
申请日：2005-10-31
申请人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima
IPC分类号： B24B49/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
摘要翻译：抛光装置具有抛光垫，用于保持半导体晶片的顶环和可操作以沿垂直方向移动顶环的垂直移动机构。抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光基于由距离测量传感器检测到的位置的半导体晶片。垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

77. 发明授权

US08070560B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US08070560B2
公开(公告)日：2011-12-06
申请号：US12292677
申请日：2008-11-24
申请人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
发明人： Hozumi Yasuda , Makoto Fukushima , Tetsuji Togawa
IPC分类号： B24B5/00
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a polishing head having at least one elastic membrane configured to form a plurality of pressure chambers for being supplied with a pressurized fluid, and a controller configured to control supply of the pressurized fluid to the pressure chambers. The controller controls supply of the pressurized fluid so that the pressurized fluid is supplied first to the pressure chamber located at a central portion of the substrate when the substrate is brought into contact with the polishing surface, and then the pressurized fluid is supplied to the pressure chamber located at a radially outer side of the pressure chamber located at the central portion of the substrate.
摘要翻译：抛光装置用于将半导体晶片等基板研磨成平面镜面。抛光装置包括具有抛光表面的抛光台，具有至少一个弹性膜的抛光头，所述弹性膜被构造成形成用于供应加压流体的多个压力室，以及控制器，其构造成控制加压流体供应到压力室。控制器控制加压流体的供给，使得当基板与抛光表面接触时，加压流体首先被供应到位于基板的中心部分处的压力室，然后将加压流体供应到压力位于位于基板中心部分处的压力室的径向外侧的腔室。

78. 发明授权

US07867063B2 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US07867063B2
公开(公告)日：2011-01-11
申请号：US12453598
申请日：2009-05-15
申请人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
发明人： Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

79. 发明授权

US07670206B2 Substrate polishing apparatus and substrate polishing method 有权
公开(公告)号：US07670206B2
公开(公告)日：2010-03-02
申请号：US10559135
申请日：2004-06-17
申请人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
发明人： Tetsuji Togawa , Koichi Fukaya , Mitsuo Tada , Taro Takahashi , Yasunari Suto
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

80. 发明授权

US07632173B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07632173B2
公开(公告)日：2009-12-15
申请号：US11987978
申请日：2007-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

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