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1. 发明授权

US5961380A Robotic transport apparatus 失效
标题翻译：机器人运输设备
公开(公告)号：US5961380A
公开(公告)日：1999-10-05
申请号：US12826
申请日：1998-01-23
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
IPC分类号： B65G49/07 , H01L21/677 , H01L21/687 , B24B47/02
CPC分类号： H01L21/67766 , H01L21/68707 , Y10S451/914
摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.
摘要翻译：机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。在工件保持部和机器人体之间设置用于机器人主体防水的盘构件，并且具有不小于工件保持部的面积。

2. 发明授权

US5893794A Polishing apparatus having robotic transport apparatus 失效
标题翻译：具有机器人输送装置的抛光装置
公开(公告)号：US5893794A
公开(公告)日：1999-04-13
申请号：US808690
申请日：1997-02-28
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
IPC分类号： B65G49/07 , H01L21/677 , H01L21/687 , B24B7/06
CPC分类号： H01L21/67766 , H01L21/68707 , Y10S451/914
摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.
摘要翻译：机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

3. 发明授权

US06227954B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06227954B1
公开(公告)日：2001-05-08
申请号：US08845423
申请日：1997-04-25
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai , Hiromi Yajima
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： A polishing apparatus includes a top ring for holding a workpiece to be polished on a lower surface thereof, a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring, and a dressing tool for dressing the polishing surface of the turntable. The top ring is movable to a first maintenance position therefor, and the dressing tool is movable to a second maintenance position therefor. The top ring, the turntable, and the dressing tool are housed in a single chamber having a plurality of side faces. The polishing surface, the first maintenance position, and the second maintenance position are positioned closely to one of the side faces of the chamber. Such one side face serves as a maintenance face for approaching the polishing surface, the first maintenance position, and the second maintenance position for maintenance of the polishing surface, the top ring and the dressing tool.
摘要翻译：抛光装置包括：用于在其下表面上保持要抛光的工件的顶环，具有用于抛光由顶环保持的工件的表面的抛光表面的转台和用于修整由所述顶环的抛光表面修整的修整工具转盘顶环可移动到其第一维护位置，并且修整工具可移动到第二维护位置。顶环，转盘和修整工具容纳在具有多个侧面的单个室中。抛光表面，第一维护位置和第二维护位置紧密地定位在腔室的一个侧面上。这样的一个侧面用作接近抛光表面，第一维护位置和第二维护位置的维护面，用于维护抛光表面，顶环和修整工具。

4. 发明申请

US20060234609A1 Substrate holding apparatus 有权
公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B29/00 , B24B47/02
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

5. 发明申请

US20060099892A1 Substrate holding apparatus and polishing apparatus 有权
公开(公告)号：US20060099892A1
公开(公告)日：2006-05-11
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B47/00 , B24B29/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

6. 发明授权

US06953390B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06953390B2
公开(公告)日：2005-10-11
申请号：US10342253
申请日：2003-01-15
申请人： Kunihiko Sakurai , Hiroshi Yoshida , Tetsuji Togawa
发明人： Kunihiko Sakurai , Hiroshi Yoshida , Tetsuji Togawa
IPC分类号： B08B3/10 , B08B3/12 , B24B53/007 , B24B53/013 , B24B53/017 , B24B53/02 , H01L21/304 , B24B1/00
CPC分类号： B24B53/017 , B08B1/007 , B08B3/102 , B08B3/12 , B24B53/013 , B24B53/02
摘要： A polishing surface is conditioned by pressing a diamond dresser against the polishing surface to thinly shave a surface of the polishing surface. Foreign matter clogging concavities formed in the polishing surface is scraped by pressing a brush dresser against the polishing surface in a state such that a polishing liquid is not supplied to the polishing table. A liquid composed of a mixture of a liquid or inert gas with pure water or a chemical liquid is ejected onto the polishing surface to clean the polishing surface.
摘要翻译：通过将金刚石修整器压靠在抛光表面上以对剃磨表面的表面进行稀薄剃刮来调节抛光表面。在不将研磨液供给到研磨台的状态下，通过将刷式修整器压靠在研磨面上来刮去在研磨面上形成的异物堵塞凹部。将由液体或惰性气体与纯水或化学液体的混合物组成的液体喷射到抛光表面上以清洁抛光表面。

7. 发明授权

US07850509B2 Substrate holding apparatus 有权
标题翻译：基板保持装置
公开(公告)号：US07850509B2
公开(公告)日：2010-12-14
申请号：US12285936
申请日：2008-10-16
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译：本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。接触构件具有用于接触弹性垫的弹性膜。第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

8. 发明授权

US07491117B2 Substrate holding apparatus 有权
公开(公告)号：US07491117B2
公开(公告)日：2009-02-17
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

9. 发明授权

US07311585B2 Substrate holding apparatus and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：US07311585B2
公开(公告)日：2007-12-25
申请号：US11312571
申请日：2005-12-21
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
摘要翻译：本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。具有弹性膜的邻接构件附接到可垂直移动构件的下表面。邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到垂直活动件。连接部由具有高于邻接部的材料的柔软性的材料制成。

10. 发明授权

US06942541B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06942541B2
公开(公告)日：2005-09-13
申请号：US09922776
申请日：2001-08-07
申请人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
发明人： Tetsuji Togawa , Kunihiko Sakurai , Ritsuo Kikuta
IPC分类号： H01L21/304 , B24B37/04 , B24B51/00 , B24B53/007 , B24B7/22
CPC分类号： B24B37/345 , B24B37/04 , B24B51/00 , B24B53/017
摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.
摘要翻译：抛光装置将诸如半导体晶片的工件抛光成平面镜面。抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

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