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    • 73. 发明授权
    • Semiconductor integrated circuit and testing method thereof
    • 半导体集成电路及其测试方法
    • US07222272B2
    • 2007-05-22
    • US10430319
    • 2003-05-07
    • Yoshio TakazawaToshio YamadaKazumasa YanagisawaTakashi Hayasaka
    • Yoshio TakazawaToshio YamadaKazumasa YanagisawaTakashi Hayasaka
    • G11C29/26G11C29/40
    • G11C29/26G11C2029/1806G11C2029/2602G11C2029/3202
    • There are provided a plurality of bridge circuits which convert the test data information from a common test bus connected to a plurality of memories of different access data widths and address decode logics to the inherent access data widths of each memory and also convert the test address information from the common test bus to the inherent bit format of each memory to supply the result to the corresponding memory. The test address information is supplied in parallel from the common test bus to a plurality of memories to realize the parallel tests. Accordingly, the test data information can be supplied in parallel to a plurality of memories of different data widths and the address scan direction in the respective memories for the test address information can be uniformed to the particular direction depending on the inherent bit format. Thereby, the memory test efficiency by the match pattern for a plurality of on-chip memories can be improved.
    • 提供了多个桥接电路,其将来自连接到不同访问数据宽度的多个存储器的公共测试总线的测试数据信息和地址解码逻辑转换为每个存储器的固有访问数据宽度,并且还将测试地址信息 从公共测试总线到每个存储器的固有位格式,将结果提供给相应的存储器。 测试地址信息从公共测试总线并行提供给多个存储器以实现并行测试。 因此,测试数据信息可以并行地提供给不同数据宽度的多个存储器,并且用于测试地址信息的各个存储器中的地址扫描方向可以根据固有位格式被均匀化到特定方向。 因此,可以提高通过用于多个片上存储器的匹配模式的存储器测试效率。
    • 74. 发明申请
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US20050232053A1
    • 2005-10-20
    • US11109660
    • 2005-04-20
    • Yuri AzumaYoshihiko YasuYasuto IgarashiTakashi KuraishiKazumasa Yanagisawa
    • Yuri AzumaYoshihiko YasuYasuto IgarashiTakashi KuraishiKazumasa Yanagisawa
    • H01L21/822G11C5/00G11C5/14H01L27/04H03K19/00H03K19/0175
    • G11C5/147
    • A semiconductor integrated circuit device enhanced in design efficiency while achieving multi-functionalization and power saving is to be provided. The semiconductor integrated circuit device has a first through third circuit blocks, and is placed in a first power supply state in which the operation of internal circuits in the first circuit block is guaranteed in accordance with an instruction from the third circuit block or a second power supply state in which the operation of the internal circuits is not guaranteed, wherein the second circuit block has an input unit which receives signals supplied from the first circuit block, and the input unit of the second circuit block has an input circuit which, in accordance with the control signal which was responded to when the second power supply state was instructed by the third circuit block to the first circuit block, causes a specific signal level to be maintained in compliance with the operating voltage of the second circuit block irrespective of the signal supplied from the first circuit block.
    • 提供一种在实现多功能化和省电的同时提高设计效率的半导体集成电路装置。 半导体集成电路器件具有第一至第三电路块,并且被置于第一电源状态,其中根据来自第三电路块的指令或第二电源确保第一电路块中的内部电路的操作 其中第二电路块具有接收从第一电路块提供的信号的输入单元,并且第二电路块的输入单元具有根据本发明的输入电路,其中内部电路的操作不被保证, 当第三电路块向第一电路块指示第二电源状态时响应的控制信号使得将特定信号电平维持为与第二电路块的工作电压无关,而与信号无关 由第一电路块提供。