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    • 77. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US06174822B1
    • 2001-01-16
    • US09175250
    • 1998-10-20
    • Yoshihisa NaganoToshie KutsunaiYuji JudaiYasuhiro UemotoEiji Fujii
    • Yoshihisa NaganoToshie KutsunaiYuji JudaiYasuhiro UemotoEiji Fujii
    • H01L2131
    • H01L27/1085H01L21/76895H01L23/5223H01L28/55H01L2924/0002H01L2924/00
    • A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and an upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect.
    • 半导体器件包括:设置在其上具有集成电路的支撑衬底上并包括下电极,电介质膜和上电极的电容器; 设置为覆盖电容器的第一层间绝缘膜; 选择性地设置在所述第一层间绝缘膜上并通过形成在所述第一层间绝缘膜中的第一接触孔与所述集成电路和所述电容器电连接的第一互连; 由臭氧TEOS形成的第二层间绝缘膜,并设置为覆盖第一互连; 选择性地设置在第二层间绝缘膜上并通过形成在第二层间绝缘膜中的第二接触孔电连接到第一互连的第二互连; 以及设置成覆盖第二互连的钝化层。
    • 78. 发明授权
    • Chemical vapor deposition process for producing oxide thin films
    • 用于生产氧化物薄膜的化学气相沉积工艺
    • US5712001A
    • 1998-01-27
    • US619076
    • 1996-03-20
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • Eiji FujiiAtsushi TomozawaHideo ToriiRyoichi Takayama
    • C30B25/10C23C16/40C23C16/455C23C16/50C23C16/509C30B25/16B05D3/06
    • C23C16/45561C23C16/406C23C16/455C23C16/5096
    • The present invention relates to a process for producing crystallographic oriented oxide thin films having an NaCl-type structure, a spinel structure or a Wurtzite structure used as a buffer layer to obtain a functional oxide thin film such as a superconductive oxide thin film and a ferroelectric thin film, and a chemical vapor deposition apparatus used therefor. A rotatable substrate holder is provided in a reaction chamber. The substrate holder, which holds substrates thereunder, includes a substrate heater. The substrate holder is grounded to provide an electrode. Another electrode, which is connected to a high frequency power source, is located opposing the substrate holder in the reaction chamber. At a side wall of the reaction chamber, an exhaust is arranged. In a plasma electric discharge area formed between the substrate holder and the electrode, a material gas supplier is located, having a predetermined tilt angle .theta. with respect to the substrate holder.
    • 本发明涉及一种制备具有NaCl型结构,尖晶石结构或纤锌矿结构的晶体取向氧化物薄膜的方法,该结构用作缓冲层以获得诸如超导氧化物薄膜和铁电体之类的功能氧化物薄膜 薄膜和用于其的化学气相沉积设备。 可旋转的基板保持器设置在反应室中。 保持基板的基板支架包括基板加热器。 衬底保持器接地以提供电极。 连接到高频电源的另一个电极与反应室中的衬底保持器相对定位。 在反应室的侧壁处布置排气。 在形成在基板支架和电极之间的等离子体放电区域中,相对于基板支架具有预定的倾斜角度θ的材料气体供应器。