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    • 74. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07399999B2
    • 2008-07-15
    • US10958640
    • 2004-10-06
    • Tetsuya YoshidaTetsuya OkadaHiroaki SaitoShigeyuki MuraiKikuo Okada
    • Tetsuya YoshidaTetsuya OkadaHiroaki SaitoShigeyuki MuraiKikuo Okada
    • H01L29/06
    • H01L29/7397H01L29/0619
    • In a conventional semiconductor device, there was a problem that, in a guard ring region, a shape of a depletion layer is distorted and stable withstand voltage characteristics cannot be obtained. In a semiconductor device of the present invention, a thermal oxide film in an actual operation region and a thermal oxide film in a guard ring region are formed in the same process. Thereafter, the thermal oxide film is once removed and is formed again. Thus, a film thickness of the thermal oxide film on the upper surface of the guard ring region is set to, for example, about 8000 to 10000 Å. Accordingly, a CVD oxide film including moving ions is formed in a position distant from a surface of an epitaxial layer. Consequently, distortion of a depletion layer, which is influenced by the moving ions, is suppressed and desired withstand voltage characteristics can be maintained.
    • 在传统的半导体器件中,存在在保护环区域中耗尽层的形状变形而不能得到稳定的耐电压特性的问题。 在本发明的半导体装置中,以相同的工序形成实际工作区域中的热氧化膜和防护环区域的热氧化膜。 此后,热氧化膜被一次除去并再次形成。 因此,保护​​环区域的上表面上的热氧化膜的膜厚设定为例如约8000〜10000。 因此,包含移动离子的CVD氧化膜形成在远离外延层的表面的位置。 因此,受到移动离子影响的耗尽层的失真被抑制,并且可以保持期望的耐受电压特性。
    • 76. 发明申请
    • Hydrodynamic bearing device, motor, and disk driving apparatus
    • 流体动力轴承装置,电动机和盘驱动装置
    • US20070024136A1
    • 2007-02-01
    • US11443175
    • 2006-05-31
    • Hiroaki SaitoHiroyuki KiriyamaTakao YoshitsuguKoji Hirata
    • Hiroaki SaitoHiroyuki KiriyamaTakao YoshitsuguKoji Hirata
    • H02K5/16F16C32/06
    • F16C17/102F16C17/107F16C33/107H02K7/086
    • To provide a hydrodynamic bearing device with high reliability, with which reductions in size, weight, and thickness can be achieved, as well as a motor and a disk driving apparatus that make use of this hydrodynamic bearing device. The hydrodynamic bearing device pertaining to the present invention comprises a shaft 10, a thrust flange 16, a sleeve 11, a seal plate 21, and a retaining plate 20. A radial dynamic pressure bearing is formed in the radial direction gap between the shaft 10 and the sleeve 11, and a thrust dynamic pressure bearing is formed in the thrust dynamic bearing gap between the sleeve 11 and the thrust flange 16. A communicating hole 11d is formed for communicating between the gap between the sleeve 11 and the seal plate 21 and the thrust direction gap between the sleeve 11 and the thrust flange 116. The radial dynamic pressure bearing and/or the thrust dynamic pressure bearing are formed such that a lubricating oil 9 circulates in the gap between the sleeve 11 and the seal plate 21 from the inner peripheral side of the sleeve 11 toward the outer peripheral side.
    • 提供具有高可靠性的流体动力轴承装置,其可以实现尺寸,重量和厚度的减小,以及利用该流体动力轴承装置的电动机和盘驱动装置。 本发明的流体动力轴承装置包括轴10,推力凸缘16,套筒11,密封板21和保持板20。 径向动压轴承形成在轴10和套筒11之间的径向间隙中,并且推力动压轴承形成在套筒11和推力凸缘16之间的推力动态轴承间隙中。 形成连通孔11d用于在套筒11和密封板21之间的间隙以及套筒11和推力凸缘116之间的推力方向间隙之间连通。 径向动压轴承和/或推力动压轴承形成为使得润滑油9从套筒11的内周侧向外周侧在套筒11和密封板21之间的间隙中循环。
    • 78. 发明授权
    • Schottky barrier diode semiconductor device
    • 肖特基势垒二极管半导体器件
    • US07034376B2
    • 2006-04-25
    • US10953073
    • 2004-09-30
    • Tetsuya OkadaHiroaki Saito
    • Tetsuya OkadaHiroaki Saito
    • H01L31/108
    • H01L29/66143H01L29/861H01L29/872
    • A Schottky barrier diode in which a p+-type semiconductor layer is provided in an n−-type epitaxial layer can realize lowering the forward voltage VF without considering leak current IR. However, when compared with a normal Schottky barrier diode, the forward voltage VF is generally high. When a Schottky metal layer is suitably selected, although the forward voltage VF can be reduced, there is a limit in further reduction. On the other hand, when the resistivity of the n−-type semiconductor layer is reduced, although the forward voltage VF can be realized, there is a problem that breakdown voltage is deteriorated. In a semiconductor device of the invention, a second n−-type semiconductor layer having a low resistivity is laminated on a first n−-type semiconductor layer capable of securing a specified breakdown voltage. P+-type semiconductor regions are made to have depths equal to or slightly deeper than the second n−-type semiconductor layer. By this, in a Schottky barrier diode in which leak current IR can be suppressed by pinch off of a depletion layer, the forward voltage VF can be reduced and the specified breakdown voltage can be secured.
    • 其中p型+型半导体层设置在n +型超导外延层中的肖特基势垒二极管可以在不考虑漏电流IR的情况下实现降低正向电压VF。 然而,当与正常肖特基势垒二极管相比时,正向电压VF通常较高。 当适当地选择肖特基金属层时,尽管可以减小正向电压VF,但是进一步减少是有限制的。 另一方面,当降低n +型半导体层的电阻率时,尽管可以实现正向电压VF,但存在击穿电压恶化的问题。 在本发明的半导体器件中,具有低电阻率的第二n + O - 型半导体层被层叠在第一n + 击穿电压。 使P + + H型半导体区域的深度等于或略深于第二n +型半导体层。 由此,在可以通过耗尽层的夹断来抑制漏电流IR的肖特基势垒二极管中,可以减小正向电压VF,并且可以确保规定的击穿电压。