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    • 71. 发明授权
    • Gas injection slit nozzle for a plasma process reactor
    • 用于等离子体处理反应器的气体注入狭缝喷嘴
    • US5746875A
    • 1998-05-05
    • US551881
    • 1995-10-16
    • Dan MaydanSteve S. Y. MakDonald OlgadoGerald Zheyao YinTimothy D. DriscollJames S. PapanuAvi Tepman
    • Dan MaydanSteve S. Y. MakDonald OlgadoGerald Zheyao YinTimothy D. DriscollJames S. PapanuAvi Tepman
    • H05H1/46C23C16/44C23C16/455C23F4/00H01J37/32H01L21/302H01L21/3065H05H1/42H05H1/00
    • C23C16/45574C23C16/45576C23C16/45587H01J37/3244H01J37/32449
    • The invention is embodied in a gas injection apparatus for injecting gases into a plasma reactor vacuum chamber having a chamber housing, a pedestal holding a workpiece to be processed, a device for applying RF energy into the chamber, the gas injection apparatus having a gas supply containing an etchant species in a gas, an opening in the chamber housing, a gas distribution apparatus disposed within the opening in the chamber housing which has at least one slotted aperture facing the interior of the chamber and a device for controlling the flow rate of gas from the one or more slotted apertures, and a gas feed line from the supply to the gas distribution apparatus. In a preferred embodiment, the gas distribution apparatus includes a center member surrounded by at least one annular member with a gap therebetween comprising the slotted aperture. Preferably, each of the members of the gas distribution apparatus comprises a material at least nearly impervious to attack from the etchant species. In one example, each of the members of the gas distribution apparatus comprises one of a ceramic, fused quartz, polymeric or anodized aluminum material and the gas feed line comprises stainless steel. Preferably, each of the members has its surface polished prior to assembly of the gas distribution apparatus.
    • 本发明体现在一种用于将气体注入等离子体反应器真空室中的气体注入装置,其具有腔室壳体,保持要加工的工件的基座,用于将RF能量施加到腔室中的装置,该气体注入装置具有气体供应 在气体中含有蚀刻剂物质,在腔室中的开口,设置在腔室中的开口内的气体分配装置,其具有面向腔室内部的至少一个开口孔,以及用于控制气体流速的装置 从一个或多个开槽孔,以及从供给到气体分配装置的气体供给管线。 在优选实施例中,气体分配装置包括由至少一个环形构件包围的中心构件,其间具有间隙,包括开槽孔。 优选地,气体分配装置的每个构件包括至少几乎不受蚀刻剂物质侵蚀的材料。 在一个示例中,气体分配装置的每个构件包括陶瓷,熔融石英,聚合物或阳极氧化铝材料中的一种,气体供给管线包括不锈钢。 优选地,每个构件在气体分配装置的组装之前具有其表面抛光。
    • 75. 发明授权
    • Magnetic field-enhanced plasma etch reactor
    • 磁场增强等离子体蚀刻反应器
    • US5215619A
    • 1993-06-01
    • US760848
    • 1991-09-17
    • David ChengDan MaydanSasson SomekhKenneth R. StalderDana L. AndrewsMei ChangJohn M. WhiteJerry Y. K. WongVladimir J. ZeitlinDavid N. Wang
    • David ChengDan MaydanSasson SomekhKenneth R. StalderDana L. AndrewsMei ChangJohn M. WhiteJerry Y. K. WongVladimir J. ZeitlinDavid N. Wang
    • H01J37/32H01L21/00
    • H01L21/67069H01J37/32477H01J37/32623H01J37/32743H01J37/32862
    • A magnetic field enhanced single wafer plasma etch reactor is disclosed. The features of the reactor include an electrically-controlled stepped magnetic field for providing high rate uniform etching at high pressures; temperature controlled reactor surfaces including heated anode surfaces (walls and gas manifold) and a cooled wafer supporting cathode; and a unitary wafer exchange mechanism comprising wafer lift pins which extend through the pedestal and a wafer clamp ring. The lift pins and clamp ring are moved vertically by a one-axis lift mechanism to accept the wafer from a cooperating external robot blade, clamp the wafer to the pedestal and return the wafer to the blade. The electrode cooling combines water cooling for the body of the electrode and a thermal conductivity-enhancing gas parallel-bowed interface between the wafer and electrode for keeping the wafer surface cooled despite the high power densities applied to the electrode. A gas feed-through device applies the cooling gas to the RF powered electrode without breakdown of the gas. Protective coatings/layers of materials such as quartz are provided for surfaces such as the clamp ring and gas manifold. The combination of these features provides a wide pressure regime, high etch rate, high throughput single wafer etcher which provides uniformity, directionality and selectivity at high gas pressures, operates cleanly and incorporates in-situ self-cleaning capability.
    • 公开了一种磁场增强型单晶片等离子体蚀刻反应器。 反应器的特征包括用于在高压下提供高速均匀蚀刻的电控步进磁场; 温度控制的反应器表面包括加热的阳极表面(壁和气体歧管)和冷却的晶片支撑阴极; 以及包括延伸穿过基座的晶片提升销和晶片夹紧环的整体晶片交换机构。 提升销和夹紧环通过单轴提升机构垂直移动,以从协作的外部机器人刀片接收晶片,将晶片夹紧到基座并将晶片返回到刀片。 电极冷却结合了用于电极体的水冷却和晶片和电极之间的热导率增强气体平行弓形界面,用于保持晶片表面冷却,尽管施加到电极的高功率密度。 气体馈通装置将冷却气体施加到RF供电的电极,而不会破坏气体。 为诸如夹紧环和气体歧管的表面提供保护涂层/诸如石英的材料层。 这些特征的组合提供了广泛的压力方案,高蚀刻速率,高通量单晶硅蚀刻器,其在高气体压力下提供均匀性,方向性和选择性,干净地操作并且并入现场自清洁能力。
    • 80. 发明授权
    • Optical ready substrates
    • 光学就绪基板
    • US07072534B2
    • 2006-07-04
    • US10280505
    • 2002-10-25
    • Claes BjörkmanLawrence C. WestDan MaydanSamuel Broydo
    • Claes BjörkmanLawrence C. WestDan MaydanSamuel Broydo
    • G02B6/12
    • G02B6/12004G02B6/12G02B6/30G02B6/4214G02B6/4245G02B6/4257G02B6/4274G02B6/4283G02B6/43
    • An article of manufacture comprising an optical ready substrate made of a first semiconductor layer, an insulating layer on top of the first semiconductor layer, and a second semiconductor layer on top of the insulating layer, wherein the second semiconductor layer has a top surface and is laterally divided into two regions including a first region and a second region, the top surface of the first region being of a quality that is sufficient to permit microelectronic circuitry to be formed therein and the second region including an optical signal distribution circuit formed therein, the optical signal distribution circuit made up of interconnected semiconductor photonic elements and designed to provide signals to the microelectronic circuit to be fabricated in the first region of the second semiconductor layer.
    • 一种制品,包括由第一半导体层制成的光学就绪衬底,在第一半导体层的顶部上的绝缘层和在绝缘层的顶部上的第二半导体层,其中第二半导体层具有顶表面,并且是 横向分为包括第一区域和第二区域的两个区域,第一区域的顶表面的质量足以允许在其中形成微电子电路,并且第二区域包括其中形成的光信号分配电路, 光信号分配电路由互连的半导体光子元件组成,并被设计为向要在第二半导体层的第一区域中制造的微电子电路提供信号。