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    • 78. 发明授权
    • Substrate transfer shuttle having a magnetic drive
    • 具有磁力驱动的基板转移梭
    • US06471459B2
    • 2002-10-29
    • US09447930
    • 1999-11-23
    • Wendell T. BloniganJohn M. White
    • Wendell T. BloniganJohn M. White
    • B65G4907
    • H01L21/67742H01L21/67709H01L21/6776Y10S414/139
    • A magnetic drive system for moving a substrate transfer shuttle along a linear path between chambers in a semiconductor fabrication apparatus. A rack with rack magnets is secured to the shuttle, and a rotatable pinion with pinion magnets is positioned adjacent the rack so that the pinion magnets can magnetically engage the rack magnets. Thus, rotation of the pinion will cause the shuttle to move along the linear path. The magnets may be oriented with a helix angle between their primary axis and the axis of rotation of the pinion. One rack and one pinion are located on each side of the shuttle. A set of lower guide rollers supports the shuttle, and a set of upper guide rollers prevents the shuttle from lifting off the lower guide rollers.
    • 一种磁性驱动系统,用于在半导体制造装置中沿着室之间的线性路径移动基板传送梭。 具有齿条磁体的机架固定到梭子上,并且具有小齿轮磁体的可旋转小齿轮定位成邻近齿条,使得小齿轮磁体可以磁性地接合齿条磁体。 因此,小齿轮的旋转将使梭子沿线性路径移动。 磁体可以在其主轴线和小齿轮的旋转轴线之间具有螺旋角度定向。 一个机架和一个小齿轮位于梭子的每一侧。 一组下导辊支撑梭子,一组上导辊防止梭子从下导辊上脱落。
    • 79. 发明授权
    • Apparatus and method for chemical mechanical planarization
    • 化学机械平面化的装置和方法
    • US06435941B1
    • 2002-08-20
    • US09570591
    • 2000-05-12
    • John M. White
    • John M. White
    • B24B4900
    • H01L21/67161B23Q7/04B24B37/345B24B51/00H01L21/67219H01L21/68707
    • Generally, a semiconductor wafer processing system and more specifically, a semiconductor wafer planarization system for polishing a workpiece, such as a semiconductor substrate or wafer. The system generally includes a first polishing module that has a polishing head for retaining a workpiece, a staging module and a set of load cups for transferring the workpiece to and from the polishing head. A primary robot that has a workpiece gripper transfers the workpiece between the first set of load cups and the staging module. The staging module and the load cups comprise transfer locations where processed and unprocessed workpieces may be set within the reach of processing modules and transfer devices so that the dwell time associated with handling polished and unpolished workpieces is reduced. Additionally, a method for transferring wafers about the polishing system is also disclosed.
    • 通常,半导体晶片处理系统,更具体地,用于抛光诸如半导体衬底或晶片的工件的半导体晶片平面化系统。 该系统通常包括第一抛光模块,其具有用于保持工件的抛光头,分级模块和用于将工件传送到抛光头和从抛光头传送工件的一组装载杯。 具有工件夹持器的主要机器人在第一组装载杯和分级模块之间传送工件。 分级模块和装载杯包括转移位置,其中处理和未加工的工件可以设置在处理模块和转移装置的范围内,使得与处理抛光和未抛光的工件相关联的停留时间减少。 此外,还公开了一种用于在抛光系统周围传送晶片的方法。