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1. 发明授权

US06517303B1 Substrate transfer shuttle 失效
公开(公告)号：US06517303B1
公开(公告)日：2003-02-11
申请号：US09082484
申请日：1998-05-20
申请人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
发明人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
IPC分类号： B65G133
CPC分类号： H01L21/67748 , C03B25/08 , C03B29/08 , C03B35/142 , C03B35/202 , C03B2225/02 , C03C17/002 , F27D3/00 , F27D5/00 , H01L21/67173 , H01L21/67236 , Y02P40/57 , Y10S414/135 , Y10S414/139
摘要： The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

2. 发明授权

US06746198B2 Substrate transfer shuttle 失效
标题翻译：基材转运班车
公开(公告)号：US06746198B2
公开(公告)日：2004-06-08
申请号：US09881009
申请日：2001-06-13
申请人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
发明人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
IPC分类号： B65G4907
CPC分类号： H01L21/67748 , C03B25/08 , C03B29/08 , C03B35/142 , C03B35/202 , C03B2225/02 , C03C17/002 , F27D3/00 , F27D5/00 , H01L21/67173 , H01L21/67236 , Y02P40/57 , Y10S414/135 , Y10S414/139
摘要： The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.
摘要翻译：本发明提供了一种用于基板输送的装置和方法。在根据本发明的系统中，提供至少第一和第二腔室。第一室可以是装载锁，第二室是处理室。提供基板传送梭，并且可沿着由第一室中的一个位置和第二室中的另一位置之间的导辊限定的线性路径移动。以这种方式，可以在第一室和第二室之间沿正向和反向的方向转移衬底。衬底传送穿梭被构造成使得可以通过将其中一个室中的支撑件从降低位置移动到中间位置而从其中移除基板，之后可以从室移除基板传送梭。

3. 发明授权

US08648977B2 Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors 有权
标题翻译：用于提供具有用于室门的隔离密封表面的浮动密封件的方法和装置
公开(公告)号：US08648977B2
公开(公告)日：2014-02-11
申请号：US11194503
申请日：2005-08-01
申请人： Billy C. Leung , David E. Berkstresser , Shinichi Kurita
发明人： Billy C. Leung , David E. Berkstresser , Shinichi Kurita
IPC分类号： G02F1/1333
CPC分类号： E06B7/232 , B65D53/00 , H01L21/67772
摘要： A method is provided that includes isolating a sealing surface from a chamber wall of a chamber and sealing the chamber between the sealing surface and the chamber wall. An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.
摘要翻译：提供了一种方法，其包括将密封表面与室的室壁隔离并且密封所述室在所述密封表面和所述室壁之间。提供了一种装置，其包括易于偏转的室壁部分，提供密封表面的固定部分和附接到室壁部分和固定部分的柔性波纹管。还提供了一种系统，其包括：腔室，其包括具有开口的腔室壁，设置成密封开口的门，邻近开口并与腔壁隔离的密封表面，以及密封表面和腔壁之间的密封。提供了许多其他方面。

4. 发明授权

US5611865A Alignment of a shadow frame and large flat substrates on a heated support 失效
标题翻译：阴影框架和大型平面基板在加热支架上的对准
公开(公告)号：US5611865A
公开(公告)日：1997-03-18
申请号：US605581
申请日：1996-02-14
申请人： John M. White , David E. Berkstresser , Carl T. Petersen
发明人： John M. White , David E. Berkstresser , Carl T. Petersen
IPC分类号： B65G49/06 , C23C16/00 , C23C16/04 , C23C16/44 , C23C16/458 , H01L21/68
CPC分类号： C23C16/042 , C23C16/4585
摘要： Centering pins mounted to a susceptor in a vacuum chamber align a glass substrate with respect to the susceptor on which it is supported, and with respect to a shadow frame which overlies the periphery of the substrate and protects the edge and underside of the substrate from undesired processing.Shaped pins loosely mounted in openings in the susceptor so that the pins extend above the upper surface of the susceptor support the centered glass substrate during the transporting stages, but recess into the heated susceptor during processing.
摘要翻译：安装到真空室中的基座的定心销相对于其所支撑的基座对准玻璃基板，并且相对于覆盖在基板的周边的阴影框架对准，并且保护基板的边缘和下侧不受不利影响处理。形状的销松散地安装在基座中的开口中，使得销在延伸到基座的上表面之上延伸，在输送阶段期间支撑中心的玻璃基板，但在加工期间凹入加热的基座。

5. 发明授权

US5352294A Alignment of a shadow frame and large flat substrates on a support 失效
标题翻译：阴影框架和支撑上的大平面基板的对准
公开(公告)号：US5352294A
公开(公告)日：1994-10-04
申请号：US10892
申请日：1993-01-28
申请人： John M. White , David E. Berkstresser , Carl T. Petersen
发明人： John M. White , David E. Berkstresser , Carl T. Petersen
IPC分类号： B65G49/06 , C23C16/00 , C23C16/04 , C23C16/44 , C23C16/458 , H01L21/68
CPC分类号： C23C16/042 , C23C16/4585
摘要： Centering pins mounted to a susceptor in a vacuum chamber align a glass substrate with respect to the susceptor on which it is supported, and with respect to a shadow frame which overlies the periphery of the substrate and protects the edge and underside of the substrate from undesired processing.Shaped pins loosely mounted in openings in the susceptor so that the pins extend above the upper surface of the susceptor support the centered glass substrate during the transporting stages, but recess into the susceptor during processing.
摘要翻译：安装到真空室中的基座的定心销相对于其所支撑的基座对准玻璃基板，并且相对于覆盖在基板的周边的阴影框架对准，并且保护基板的边缘和下侧不受不利影响处理。形状的销松散地安装在基座中的开口中，使得销在基座的上表面上方延伸，在输送阶段期间支撑中心的玻璃基板，但在处理期间凹入基座。

6. 发明授权

US5595337A Sputtering device and target with cover to hold cooling fluid 失效
标题翻译：溅射装置和带盖的目标，以保持冷却液
公开(公告)号：US5595337A
公开(公告)日：1997-01-21
申请号：US460954
申请日：1995-06-05
申请人： Richard E. Demaray , Manuel Herrera , David E. Berkstresser
发明人： Richard E. Demaray , Manuel Herrera , David E. Berkstresser
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , F28F3/12 , H01J37/32 , H01J37/34 , B23K20/00 , B23K20/22
CPC分类号： H01J37/32458 , C23C14/3407 , C23C14/564 , F28F3/12 , H01J37/3411 , H01J37/3435 , H01J37/3497 , H01J2237/022
摘要： A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.
摘要翻译：目标，目标背板和盖板形成目标板组件。溅射靶组件包括一体的冷却通道。在目标背板或目标背衬冷却盖板中构造一系列凹槽，然后它们彼此牢固地结合。溅射靶可以是具有目标背板的单个整料，或者可以通过任何数量的常规粘合方法之一牢固地附接到目标背板。钽到钛，钛到钛和铝到钛，可以使用扩散接合。

7. 发明申请

US20080051014A1 CONFIGURABLE POLISHING APPARATUS 有权
标题翻译：可配置抛光装置
公开(公告)号：US20080051014A1
公开(公告)日：2008-02-28
申请号：US11762007
申请日：2007-06-12
申请人： In-Kwon Jeong , David E. Berkstresser
发明人： In-Kwon Jeong , David E. Berkstresser
IPC分类号： B24B7/30 , B24B1/00 , B24B7/19
CPC分类号： B24B37/12 , B24B37/345
摘要： A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.
摘要翻译：用于研磨半导体晶片的抛光装置包括主抛光结构，其包括多个抛光台，多个抛光头和多个装载和卸载台，以及附加抛光结构，其包括附加抛光桌子和一个额外的抛光头。附加抛光结构可以附加到主抛光结构以形成具有附加抛光台和附加抛光头的较大抛光结构。

8. 发明申请

US20070207709A1 POLISHING HEAD FOR POLISHING SEMICONDUCTOR WAFERS 失效
标题翻译：抛光半导体抛光头
公开(公告)号：US20070207709A1
公开(公告)日：2007-09-06
申请号：US11680588
申请日：2007-02-28
申请人： David E. Berkstresser , Jerry J. Berkstresser , Jino Park , In-Kwon Jeong
发明人： David E. Berkstresser , Jerry J. Berkstresser , Jino Park , In-Kwon Jeong
IPC分类号： B24B7/30
CPC分类号： B24B37/30
摘要： A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.
摘要翻译：用于处理和抛光半导体晶片的抛光头和方法使用具有至少一个凹陷区域和外部柔性膜的基底结构，所述至少一个凹陷区域和外部柔性膜可以符合至少一个凹部区域以形成至少一个凹陷部，以将半导体晶片保持在外部当对至少一个凹陷施加抽吸时的柔性膜。

9. 发明授权

US5676803A Sputtering device 失效
标题翻译：溅射装置
公开(公告)号：US5676803A
公开(公告)日：1997-10-14
申请号：US786041
申请日：1997-01-21
申请人： Richard Ernest Demaray , Manuel Herrera , David E. Berkstresser
发明人： Richard Ernest Demaray , Manuel Herrera , David E. Berkstresser
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , F28F3/12 , H01J37/32 , H01J37/34
CPC分类号： H01J37/32458 , C23C14/3407 , C23C14/564 , F28F3/12 , H01J37/3411 , H01J37/3435 , H01J37/3497 , H01J2237/022
摘要： A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used. The target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized. Large thin target assemblies, such as large flat plates used for flat panel displays can be sputtered effectively and uniformly without adverse sputtering effects due to target deflection or cooling deficiencies. The energized target assembly is protected from adjacent components by overlapping insulators to prevent accidents and isolate the target assembly from other components. An electrical connection to the target assembly remains unconnected until a vacuum is produced in the top chamber.
摘要翻译：目标，目标背板和盖板形成目标板组件。溅射靶组件包括一体的冷却通道。在目标背板或目标背衬冷却盖板中构造一系列凹槽，然后它们彼此牢固地结合。溅射靶可以是具有目标背板的单个整料，或者可以通过任何数量的常规粘合方法之一牢固地附接到目标背板。钽到钛，钛到钛和铝到钛，可以使用扩散接合。靶板组件完全覆盖并密封溅射处理室的顶部开口。冷却液连接仅从目标组件的周边提供。当顶部真空室密封与压力室相对的一侧时，目标组件两侧的压力几乎相等。用于平板显示器的大型平板的大型薄目标组件可以有效且均匀地溅射，而不会由于目标偏转或冷却缺陷而产生不利的溅射效应。通过重叠的绝缘体将通电的目标组件保护成相邻的部件，以防止事故发生并将目标组件与其他部件隔离。与目标组件的电连接保持不连接，直到在顶部腔室中产生真空。

10. 发明授权

US5603816A Sputtering device and target with cover to hold cooling fluid 失效
标题翻译：溅射装置和带盖的目标，以保持冷却液
公开(公告)号：US5603816A
公开(公告)日：1997-02-18
申请号：US461822
申请日：1995-06-05
申请人： Richard E. Demaray , Manuel Herrera , David E. Berkstresser
发明人： Richard E. Demaray , Manuel Herrera , David E. Berkstresser
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , F28F3/12 , H01J37/32 , H01J37/34
CPC分类号： H01J37/32458 , C23C14/3407 , C23C14/564 , F28F3/12 , H01J37/3411 , H01J37/3435 , H01J37/3497 , H01J2237/022
摘要： A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.The target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized. Large thin target assemblies, such as large flat plates used for flat panel displays can be sputtered effectively and uniformly without adverse sputtering effects due to target deflection or cooling deficiencies.The energized target assembly is protected from adjacent components by overlapping insulators to prevent accidents and isolate the target assembly from other components. An electrical connection to the target assembly remains unconnected until a vacuum is produced in the top chamber.
摘要翻译：目标，目标背板和盖板形成目标板组件。溅射靶组件包括一体的冷却通道。在目标背板或目标背衬冷却盖板中构造一系列凹槽，然后它们彼此牢固地结合。溅射靶可以是具有目标背板的单个整料，或者可以通过任何数量的常规粘合方法之一牢固地附接到目标背板。钽到钛，钛到钛和铝到钛，可以使用扩散接合。靶板组件完全覆盖并密封溅射处理室的顶部开口。冷却液连接仅从目标组件的周边提供。当顶部真空室密封与压力室相对的一侧时，目标组件两侧的压力几乎相等。用于平板显示器的大型平板的大型薄目标组件可以有效且均匀地溅射，而不会由于目标偏转或冷却缺陷而产生不利的溅射效应。通过重叠的绝缘体将通电的目标组件保护成相邻的部件，以防止事故发生并将目标组件与其他部件隔离。与目标组件的电连接保持不连接，直到在顶部腔室中产生真空。

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