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    • 78. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • JPS6488992A
    • 1989-04-03
    • JP24373287
    • 1987-09-30
    • HITACHI LTD
    • KAWAJIRI YOSHIKIHORI RYOICHIKITSUKAWA GOROWATABE TAKAOKAWAHARA TAKAYUKIITO KIYOO
    • G11C11/407G11C11/34
    • PURPOSE:To obtain a timing pulse having a stable phase time by charging and discharging capacity with constant current and delaying a signal in a delay circuit generating the other signal after a fixed time when it receives an inputted signal. CONSTITUTION:A semiconductor integrated circuit is constituted by a constant voltage circuit, a constant current circuit, switches SW1 and SW2, the capacity C and a level detection circuit. When it is operated, the input IN is set at a low level, the inverse input IN is set at a high level, the SW1 is turned on, the SW2 is turned off and constant voltage generated by the constant voltage circuit is charged to the capacity C. At such a time, the level detection circuit is not operated and the output OUT is the low level. Then, when the input IN is changed to the high level and the inverse input IN is changed to the low level, the SW1 is turned OFF and the SW2 is turned on. Besides, electric charge accumulated in the capacity C is discharged in a fixed current (i) through the SW2 by the constant current circuit, the voltage of a node 10 falls in a straight line and the output OUT is raised to the high level by the level detection circuit when the voltage is fixed.
    • 79. 发明专利
    • SEMICONDUCTOR MEMORY
    • JPS62213153A
    • 1987-09-19
    • JP5476986
    • 1986-03-14
    • HITACHI LTD
    • TAKEUCHI MIKITAKEDA EIJIITO KIYOOHORI RYOICHI
    • H01L27/10H01L21/822H01L21/8242H01L27/04H01L27/108
    • PURPOSE:To control currents between electrodes having a wide facing area, and to prevent the interference of signals between memory cells such as solid capacitor cells by specifying the shape of a groove or stipulating the relationship of substrate concentration, a distance between adjacent grooves, etc., in a memory cell using the side wall section of the groove in an Si substrate as an electrode surface for a capacitor. CONSTITUTION:When the conditions of L>W/2 are satisfied in an interval L with a capacitor oppositely faced to a capacitor 1 in (w) width and (d) depth to the capacitor 1, currents between these two capacitors can be controlled by substrate voltage VBB, and currents can be inhibited at an extremely small value by setting VBB within a proper range. Currents between the capacitors can also be reduced exceedingly by the impurity concentration NB of a layer wrapping a groove shaping the capacitor 1 and by setting the interval under predetermined conditions between the capacitor and the adjacent capacitor. Accordingly, informations between the adjacent capacitors do not interfare, thus normally operating a memory cell.
    • 80. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS62185363A
    • 1987-08-13
    • JP2587386
    • 1986-02-10
    • HITACHI LTD
    • TAKEDA EIJIKIMURA KATSUTAKAHORI RYOICHISHIMOHIGASHI KATSUHIROITO KIYOO
    • H01L27/10H01L21/8242H01L27/108
    • PURPOSE:To reduce software errors of a semiconductor device by connecting the gate, source, drain of FETs connected with bit lines in a self-alignment, and forming its diffused layer in an HiC structure or a different conductivity type impurity under the diffused layer. CONSTITUTION:When a dynamic RAM is read out, the floating time of a bit line (data line) until a sense amplifier is positively operated after the bit line is precharged is important for software errors. A memory cell connected with a floating bit line, the source, drain layers of and wiring of an FET of a periphearl circuit are mostly covered with a P type layer 11 in a so-called HiC structure. The source, drain are connected with a gate in a self-alignment, and a diffused layer is contracted to approx. 1/3. In this case, polysilicon, high melting point metal or its silicide 19 is laid in a connecting hole and the periphery of the hole, aluminum wirings 20 are formed and connected with a diffused layer 12. When the layer 12 is N N structure 12-1, a P type layer is formed at the outside, and a density distribution is determined by N P type junction withstanding voltage and the ratio of software reduction.