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    • 73. 发明授权
    • Thin film magnetic heads and substrates therefore
    • 因此,薄膜磁头和基板
    • US4660114A
    • 1987-04-21
    • US699396
    • 1985-02-07
    • Akira YamakawaYoshinobu TakedaEiji Kamijo
    • Akira YamakawaYoshinobu TakedaEiji Kamijo
    • C04B35/48G11B5/31H01F10/26H01F10/28G11B5/22G11B5/14
    • G11B5/31
    • A novel thin film magnetic head is provided characterized by the use of a new substrate material excellent in mechanical property as well as machinability. This substrate is composed of a ceramic compact comprising 4 to 45% by volume of Component A, 55 to 96% by volume of Component B and at most 3% by volume of unavoidable impurities:Component A: at least one member selected from the group consisting of carbides, nitrides, carbonitrides, carboxides, oxynitrides and carboxynitrides of Group IVa, Va and VIa elements of Periodic Table and mixtures or solid solutions thereof.Component B: ZrO.sub.2 consisting of at least 70% by weight of tetragonal and/or cubic system and the balance of monoclinic system, in which at least one member selected from the group consisting of oxides of Group IIIa elements of Periodic Table, CaO and MgO, and mixtures thereof is dissolved to form a solid solution.
    • 提供了一种新颖的薄膜磁头,其特征在于使用机械性能和切削性优异的新型基材。 该基材由包含4至45体积%的组分A,55至96体积%的组分B和至多3体积%的不可避免的杂质的陶瓷压块组成:组分A:选自组中的至少一种 由元素周期表IVa族,Ⅴa和Ⅵa族元素的碳化物,氮化物,碳氮化物,羧基,氮氧化物和羧基氮化物组成,以及它们的混合物或固体溶液。 组分B:由至少70重量%的四方晶系和/或立方体系组成的ZrO 2,余量为单斜晶系,其中选自元素周期表Ⅲa族元素的氧化物,CaO和MgO中的至少一种 ,及其混合物溶解形成固溶体。
    • 75. 发明授权
    • Process for molding ceramics
    • 陶瓷成型工艺
    • US06458298B1
    • 2002-10-01
    • US08505069
    • 1995-07-21
    • Tomoyuki AwazuYasushi TsuzukiAkira Yamakawa
    • Tomoyuki AwazuYasushi TsuzukiAkira Yamakawa
    • B28B126
    • B28B1/262B28B1/265B29C2043/3628B29L2023/00
    • A wet molding method in which a ceramic slurry is charged into a cavity and uniaxially pressed by a punch to remove excess liquid from a portion of the slurry facing the punch to effect molding, the method being improved by maintaining at least one of the following conditions; (a) the pressing of the slurry is stopped at a time between T and 1.5 T, T being defined as the pressing time necessary to remove sufficient excess liquid from the slurry in the mold to produce a molded mass; or (b) the punch displacement position at a time at which sufficient excess liquid is removed from the slurry in the mold to produce a molded mass is less than 17% of the total mold length.
    • 一种湿法成型方法,其中将陶瓷浆料装入空腔中并通过冲头单轴挤压以从面向冲头的浆料的一部分中除去多余的液体以实现模塑,该方法通过保持以下条件中的至少一种而得到改善 (a)在T和1.5T之间停止浆料的压制,T定义为从模具中的浆料中除去足够多的液体以产生模制物料所需的挤压时间; 或(b)在模具中从浆料中除去足够多的液体以产生模制物料的时间处的冲头位移位置小于总模具长度的17%。
    • 78. 发明授权
    • Silicon nitride ceramic and process for forming the same
    • 氮化硅陶瓷及其形成方法
    • US5767026A
    • 1998-06-16
    • US633797
    • 1996-04-10
    • Naoki KondohFumihiro WakaiYoshihiro ObataAkira YamakawaTakao NishiokaMasashi Yoshimura
    • Naoki KondohFumihiro WakaiYoshihiro ObataAkira YamakawaTakao NishiokaMasashi Yoshimura
    • B28B1/00C04B35/584C04B35/593C04B35/597C04B35/599C04B35/626
    • C04B35/593C04B35/597
    • There are provided a process for forming a silicon nitride sintered body, encompassing a sialon sintered body, by making much of the superplasticity of the sintered body intact as a simple material without formation thereof into a composite material, and a formed sintered body produced by the foregoing process. A silicon nitride sintered body (encompassing a sialon sintered body) having a relative density of at least 95% and a linear density of 120 to 250 in terms of the number of grains per 50 .mu.m in length in a two-dimensional cross section of the sintered body is formed through plastic deformation thereof at a strain rate of at most 10.sup.-1 /sec under a tensile or compressive pressure at a temperature of 1,300 to 1,700.degree. C. The formed sintered body has a degree of orientation of 5 to 80% as examined according to a method specified by Saltykov, a linear density of 80 to 200, and excellent mechanical properties especially at ordinary temperatures.
    • PCT No.PCT / JP95 / 02026 Sec。 371日期:1996年4月10日 102(e)日期1996年4月10日PCT提交1995年10月4日PCT公布。 公开号WO96 / 10546 日本特开1996年4月11日提供了一种形成氮化硅烧结体的方法,其包括塞隆烧结体,通过使烧结体的大部分超塑性作为简单材料而不被形成为复合材料而形成,并形成 通过上述方法制造的烧结体。 一种氮化硅烧结体(包括赛隆烧结体),其相对密度至少为95%,线密度为120-250,以二维截面为单位长度的每50微米的颗粒数 该烧结体通过在1300〜1700℃的拉伸或压缩压力下以至多10-1 /秒的应变速率的塑性变形形成。所形成的烧结体的取向度为5〜80 %,根据Saltykov规定的方法,线密度为80〜200,特别是在常温下,具有优异的机械性能。
    • 79. 发明授权
    • Method of producing a silicon nitride based sintered body
    • 制造氮化硅基烧结体的方法
    • US5698156A
    • 1997-12-16
    • US448189
    • 1995-05-23
    • Takashi MatsuuraAkira YamakawaHasaya Miyake
    • Takashi MatsuuraAkira YamakawaHasaya Miyake
    • C04B35/584C04B35/64C04B33/32C04B33/34C04B33/36C04B35/71
    • C04B35/584C04B35/64
    • Provided herein is a me silicon nitride based sintered body composed only of uniform, fine crystal grains, and improved in both strength and fracture toughness in the middle and low temperature ranges. The crystalline silicon nitride powder thus produced is composed of crystal grains whose longer-axis diameter is not more than 200 nm or an amorphous silicon nitride powder is used as material powder. According to the disclosed method, the silicon nitride powder is sintered at a temperature of 1200.degree. C. to 1400.degree. C. or sintered with a product of sintering temperature (.degree. C.) and sintering time (sec) below 600000 (.degree. C. sec) at a temperature of 1400.degree. C. to 1900.degree. C. By this method, a silicon nitride based sintered body in which the longer-axis diameter of silicon nitride and/or sialon crystals is not more than 200 nm is obtained.
    • 本文提供了仅由均匀的细晶粒组成的I型氮化硅基烧结体,并且在中低温范围内提高了强度和断裂韧性。 由此制造的结晶氮化硅粉末由长轴直径不大于200nm的晶粒或非晶氮化硅粉末用作材料粉末构成。 根据所公开的方法,氮化硅粉末在1200℃至1400℃的温度下烧结,或烧结温度(℃)和烧结时间(秒)低于600000℃的产物烧结。 秒),在1400℃〜1900℃的温度下,得到氮化硅和/或赛隆晶体的长轴径不大于200nm的氮化硅系烧结体。
    • 80. 发明授权
    • Facility for grinding silicon nitride ceramic workpiece
    • 研磨氮化硅陶瓷工件的设备
    • US5605494A
    • 1997-02-25
    • US423726
    • 1995-04-18
    • Takao NishiokaKenji MatsunumaAkira Yamakawa
    • Takao NishiokaKenji MatsunumaAkira Yamakawa
    • B24B1/00B24B7/22B24B19/22B24D3/00C04B35/584
    • B24B19/22B24B1/00
    • An industrially feasible method of grinding silicon nitride ceramics is disclosed and provides a sufficiently smooth surface. Namely, the surface has a maximum height-roughness Rmax of 0.1 microns or less and a ten-point mean roughness Rz of 0.05 micron. Further, with this method, surface damage can be repaired while grinding. The vertical cutting feed rate of a grinding wheel into a workpiece should be within the range of 0.005-0.1 micron for each rotation of the working surface of the wheel and change linearly or stepwise. The cutting speed of the grinding wheel in a horizontal (rotational) direction should be within the range of 25 to 75 m/sec. With this arrangement, the contact pressure and grinding heat that is generated between the workpiece and the hard abrasive grains during grinding are combined. In other words, mechanical and thermal actions are combined.
    • 公开了一种工业上可行的研磨氮化硅陶瓷的方法,并提供了足够光滑的表面。 即,表面的最大高度粗糙度Rmax为0.1微米以下,十点平均粗糙度Rz为0.05微米。 此外,通过该方法,可以在磨削时修复表面损伤。 研磨轮进入工件的垂直切削进给速率应在车轮工作表面的每次旋转时在0.005-0.1微米的范围内,并且线性或逐步改变。 砂轮在水平(旋转)方向上的切割速度应在25至75米/秒的范围内。 通过这种布置,在磨削期间在工件和硬磨粒之间产生的接触压力和磨削热被组合。 换句话说,组合了机械和热动作。