会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 62. 发明申请
    • Microcomputer
    • 微电脑
    • US20060206746A1
    • 2006-09-14
    • US11357166
    • 2006-02-21
    • Kenji YamadaHideaki Ishihara
    • Kenji YamadaHideaki Ishihara
    • G06F1/04
    • G06F1/30
    • A microcomputer includes a CPU, a program memory for storing a subroutine program, peripheral circuits, a clock circuit, and a voltage drop detection circuit. When the voltage drop detection circuit detects the voltage drop at the end of a power line, a frequency of a clock signal provided through the clock circuit to the CPU is divided down and a supply of a clock signal provided to the peripheral circuits is stopped. The CPU executes the subroutine program, thereby resuming the supply of the clock signal provided to the peripheral circuits.
    • 微型计算机包括CPU,用于存储子程序的程序存储器,外围电路,时钟电路和电压降检测电路。 当电压降检测电路检测到电力线末端的电压降时,通过CPU的时钟电路提供的时钟信号的频率被分频,并且提供给外围电路的时钟信号的供给被停止。 CPU执行子程序,从而重新提供提供给外围电路的时钟信号。
    • 64. 发明申请
    • Probe card, method of manufacturing the probe card and alignment method
    • 探针卡,制造探针卡的方法和对准方法
    • US20060132155A1
    • 2006-06-22
    • US11299656
    • 2005-12-13
    • Kenji YamadaYoshirou Nakata
    • Kenji YamadaYoshirou Nakata
    • G01R31/02
    • G01R31/2891G01R1/07314G01R1/0735G01R3/00Y10T29/49117Y10T29/49151
    • A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.
    • 一种用于形成在半导体晶片上的多个半导体集成电路器件的电特性的晶片级测试的探针卡。 该卡具有带有凸块的薄膜,多个凸起分别与半导体集成电路器件的所有检查电极接触,并且保持在刚性陶瓷环上。 由与凸起接触形成的凸起构成的对准标记被加到具有凸块的薄膜上。 保持对准标记相对于用于接触的凸块的期望位置。 因此,可以通过参照对准标记的图像处理器容易地测量用于接触的凸块的位置精度的变化。 可以从测量结果计算要检查的晶片与晶片上的检查电极之间的接触的最佳位置。