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61. 发明申请

US20070247165A1 Wafer backside particle detection for track tools 审中-公开
标题翻译：轨道工具的晶圆背面颗粒检测
公开(公告)号：US20070247165A1
公开(公告)日：2007-10-25
申请号：US11411422
申请日：2006-04-25
申请人： Harald Herchen
发明人： Harald Herchen
IPC分类号： G01N27/00 , G01N27/60
CPC分类号： H01L22/14
摘要： A particle detection apparatus includes a substrate support adapted to support a substrate. The substrate support includes a number of proximity pins extending a predetermined distance from a surface of the substrate support and a number of probe electrodes coupled to the surface of the substrate support. The particle detection apparatus also includes electrical circuitry electrically coupled to the substrate support and adapted to generate an electric field at a backside of the substrate in contact with the plurality of proximity pins. The particle detection apparatus further includes detection circuitry electrically coupled to the plurality of probe electrodes and a processor adapted to process electrical signals associated with the detection circuitry.
摘要翻译：粒子检测装置包括适于支撑衬底的衬底支撑件。衬底支撑件包括从衬底支撑件的表面延伸预定距离的多个接近引脚和耦合到衬底支撑件的表面的多个探针电极。粒子检测装置还包括电耦合到衬底支撑件并且适于在与多个接近销接触的衬底的背面处产生电场的电路。粒子检测装置还包括电耦合到多个探针电极的检测电路和适于处理与检测电路相关联的电信号的处理器。

62. 发明申请

US20070246839A1 Method of proximity pin manufacture 审中-公开
标题翻译：接近销的制造方法
公开(公告)号：US20070246839A1
公开(公告)日：2007-10-25
申请号：US11408465
申请日：2006-04-21
申请人： Harald Herchen , Sharathchandra Somayaji , Brian Lue
发明人： Harald Herchen , Sharathchandra Somayaji , Brian Lue
IPC分类号： H01L23/52
CPC分类号： H01L21/6875 , H01L21/67011
摘要： A method and apparatus related to a substrate support structure are provided. In accordance with one embodiment of the present invention, a method for manufacturing a substrate support structure including proximity pins and apparatus for supporting a substrate inside a semiconductor processing equipment are provided. The method includes providing a plate assembly comprising a plate and a plate surface and forming a plurality of recessed regions in the plate surface. Additionally, the method includes filling the recessed regions with a bonding material including epoxy material and placing a plurality of support members into the epoxy-coated recessed regions. The method further includes pushing the support members with a flat plate held up from the surface by shims to provide a uniform local height of the support members, followed by a curing step to fix the supporting members to the recessed regions.
摘要翻译：提供了与基板支撑结构相关的方法和装置。根据本发明的一个实施例，提供了一种用于制造衬底支撑结构的方法，其包括用于在半导体加工设备内部支撑衬底的邻近销和装置。该方法包括提供包括板和板表面的板组件，并在板表面中形成多个凹陷区域。此外，该方法包括用包括环氧材料的接合材料填充凹陷区域，并将多个支撑构件放置到环氧树脂涂覆的凹陷区域中。该方法还包括通过垫片将平板从表面推压以提供支撑构件，以提供支撑构件的均匀的局部高度，随后是将支撑构件固定到凹陷区域的固化步骤。

63. 发明申请

US20060278165A1 CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE 有权
公开(公告)号：US20060278165A1
公开(公告)日：2006-12-14
申请号：US11458664
申请日：2006-07-19
申请人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Michael Rice , David Quach , Mohsen Salek , Robert Lowrance , John Backer , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
发明人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Michael Rice , David Quach , Mohsen Salek , Robert Lowrance , John Backer , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
IPC分类号： C23C16/00
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

64. 发明申请

US20060130750A1 Cluster tool architecture for processing a substrate 有权
公开(公告)号：US20060130750A1
公开(公告)日：2006-06-22
申请号：US11112281
申请日：2005-04-22
申请人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Mike Rice , David Quach , Mohsen Salek , Robert Lowrance , John Backer , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
发明人： Tetsuya Ishikawa , Rick Roberts , Helen Armer , Leon Volfovski , Jay Pinson , Mike Rice , David Quach , Mohsen Salek , Robert Lowrance , John Backer , William Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
IPC分类号： C23C14/00 , B05C5/00 , B05C11/00
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

65. 发明申请

US20060000708A1 Noble metal contacts for plating applications 审中-公开
标题翻译：贵金属触点用于电镀应用
公开(公告)号：US20060000708A1
公开(公告)日：2006-01-05
申请号：US11221607
申请日：2005-09-08
申请人： Harald Herchen
发明人： Harald Herchen
IPC分类号： C25D17/06
CPC分类号： H01L21/2885 , C25D17/001
摘要： Apparatus for electrochemical plating, comprising a support ring and a plurality of inwardly directed shanks extended from an inner circumference of the ring, wherein each of the shanks comprises a contacting tip brazed to the distal end the shank.
摘要翻译：用于电化学电镀的装置，包括支撑环和从环的内周延伸的多个向内指向的柄，其中每个柄包括钎焊到柄的远端的接触尖端。

66. 发明授权

US06869516B2 Method for removing electrolyte from electrical contacts and wafer touching areas 失效
标题翻译：从电触点和晶片接触区域去除电解质的方法
公开(公告)号：US06869516B2
公开(公告)日：2005-03-22
申请号：US10273539
申请日：2002-10-18
申请人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D7/12 , C25D21/00 , H01L21/288 , C25D5/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译：提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板或更多的与包含醇的蒸汽混合物的电接触。在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

67. 发明授权

US06444040B1 Gas distribution plate 有权
标题翻译：气体分布板
公开(公告)号：US06444040B1
公开(公告)日：2002-09-03
申请号：US09565150
申请日：2000-05-05
申请人： Harald Herchen , David Palagashvili , Dmitry Lubomirsky , Alex Schreiber
发明人： Harald Herchen , David Palagashvili , Dmitry Lubomirsky , Alex Schreiber
IPC分类号： C23C1600
CPC分类号： C23C16/45565 , C23C16/455 , H01L21/67017
摘要： An apparatus for use in a substrate processing system. The apparatus is generally a fluid distribution plate comprising an inner disk and an outer ring. The fluid distribution plate has a plurality of openings for fluid distribution and at least one slot defined therein.
摘要翻译：一种用于基板处理系统的装置。该装置通常是包括内盘和外圈的流体分配板。流体分配板具有用于流体分配的多个开口和限定在其中的至少一个狭槽。

68. 发明授权

US06369493B1 Microwave plasma applicator having a thermal transfer medium between a plasma containing tube and a cooling jacket 失效
标题翻译：微波等离子体施加器具有在等离子体容纳管和冷却套之间的热转印介质
公开(公告)号：US06369493B1
公开(公告)日：2002-04-09
申请号：US09300182
申请日：1999-04-27
申请人： Dmitry Lubomirsky , Harald Herchen , Simon Yavelberg , David Palagashvili , Donald J. Olgado
发明人： Dmitry Lubomirsky , Harald Herchen , Simon Yavelberg , David Palagashvili , Donald J. Olgado
IPC分类号： H01J1726
CPC分类号： G03F7/70016 , H01J37/32192 , H01J37/32522
摘要： A plasma applicator having a tube that is surrounded by a cooling jacket such that a volume is defined proximate the tube. The volume is filled with a thermal transfer medium to couple heat from the tube to the cooling jacket. The cooling jacket contains an aperture through which energy is transmitted to a process gas contained in the tube. As such, the process gas is infused with energy and a plasma is formed in the tube.
摘要翻译：一种等离子体施加器，其具有由冷却套包围的管，使得容积限定在管附近。体积填充有热传递介质，以将热量从管耦合到冷却套管。冷却套包含孔，通过该孔将能量传递到管中包含的处理气体。因此，工艺气体注入能量，并且在管中形成等离子体。

69. 发明授权

US5737178A Monocrystalline ceramic coating having integral bonding interconnects for electrostatic chucks 失效
标题翻译：单晶陶瓷涂层，具有用于静电卡盘的整体接合互连
公开(公告)号：US5737178A
公开(公告)日：1998-04-07
申请号：US812194
申请日：1997-03-06
申请人： Harald Herchen
发明人： Harald Herchen
IPC分类号： H01L21/683 , H02N13/00
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00
摘要： An electrostatic chuck (20) comprises at least one mesh electrode (30) on an underlying dielectric layer (25), the mesh electrode having apertures therethrough. A monocrystalline ceramic (28) covers the mesh electrode (30). The monocrystalline ceramic (28) comprises a layer of large crystals substantially oriented to one another, the layer of crystals having a resistivity sufficiently high to electrically insulate the mesh electrode (30). The monocrystalline ceramic (28) further comprises integral bonding interconnects (40) that form a unitary structure with the layer of large crystals, the bonding interconnects extending through the apertures in the mesh electrode (30) to bond directly to the underlying dielectric layer (25), substantially without adhesive.
摘要翻译：静电卡盘（20）包括在下面的介电层（25）上的至少一个网状电极（30），网状电极具有穿过其中的孔。单晶陶瓷（28）覆盖网状电极（30）。单晶陶瓷（28）包括大致相互取向的大晶体层，所述晶体层具有足够高的电阻以使网状电极（30）电绝缘。单晶陶瓷（28）还包括与大晶体层形成整体结构的整体接合互连（40），所述接合互连件延伸穿过网状电极（30）中的孔直接结合到下面的介电层（25）），基本上没有粘合剂。

70. 发明授权

US08181596B2 Cluster tool architecture for processing a substrate 有权
标题翻译：用于处理基板的集群工具架构
公开(公告)号：US08181596B2
公开(公告)日：2012-05-22
申请号：US12254750
申请日：2008-10-20
申请人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
发明人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
IPC分类号： B05C13/02 , C23C14/00 , H01L21/677
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.
摘要翻译：一种使用具有增加的系统吞吐量，增加的系统可靠性，更小的系统占用面积和更可重复的晶片历史的多室处理系统（例如，集群工具）处理衬底的设备。实施例提供了一种集群工具，其包括第一和第二处理机架，每个具有两个或更多个垂直堆叠的衬底处理室，能够从第一侧接近第一处理架的第一机器人组件，能够访问第一处理的第二机器人组件从第二侧起第二机架和从第二侧起第二处理齿条的第三机器人组件，以及能够从第二侧进入第二处理齿条的第三机器人组件，以及能够接近第一和第二处理机架并将基板装入的第四机器人组件一个盒子。

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