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61. 发明授权

US07703661B2 Method and process for reducing undercooling in a lead-free tin-rich solder alloy 失效
标题翻译：在无铅富锡焊料合金中减少过冷的方法和工艺
公开(公告)号：US07703661B2
公开(公告)日：2010-04-27
申请号：US11752382
申请日：2007-05-23
申请人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
发明人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
IPC分类号： B23K35/24
CPC分类号： B23K1/19 , B23K35/262 , H05K3/3436 , H05K3/3463 , H05K2201/0215
摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduced or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.
摘要翻译：简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以痕量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷却温度特性的焊料组合物。该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。

62. 发明申请

US20080290142A1 METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RICH SOLDER ALLOY 失效
标题翻译：无铅无铅焊料合金的减少方法和工艺
公开(公告)号：US20080290142A1
公开(公告)日：2008-11-27
申请号：US11752382
申请日：2007-05-23
申请人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
发明人： Gareth G. Hougham , Kamalesh K. Srivastava , Sung K. Kang , Da-Yuan Shih , Brian R. Sundlof , S. Jay Chey , Donald W. Henderson , David R. Di Milia , Richard P. Ferlita , Roy A. Carruthers
IPC分类号： B23K35/24 , B23K101/36 , B23K31/02
CPC分类号： B23K1/19 , B23K35/262 , H05K3/3436 , H05K3/3463 , H05K2201/0215
摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.
摘要翻译：简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。

63. 发明申请

US20080245847A1 Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling 有权
标题翻译：符合标准的模具填充头，集成腔体通风和焊接冷却
公开(公告)号：US20080245847A1
公开(公告)日：2008-10-09
申请号：US11696753
申请日：2007-04-05
申请人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
发明人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
IPC分类号： B23K1/00
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译：模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化界面部分和模板。

64. 发明授权

US07097884B2 Stability of ion beam generated alignment layers by surface modification 失效
公开(公告)号：US07097884B2
公开(公告)日：2006-08-29
申请号：US10606523
申请日：2003-06-26
申请人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
发明人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
IPC分类号： C23C14/02 , C23C14/14 , C23C14/48 , C23C14/58 , G02F1/1337
CPC分类号： G02F1/13378
摘要： A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

65. 发明授权

US07006193B2 Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation 有权
公开(公告)号：US07006193B2
公开(公告)日：2006-02-28
申请号：US09917087
申请日：2001-07-27
申请人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
发明人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
IPC分类号： G02F1/1339
CPC分类号： G02F1/1341 , G02F1/1339 , G02F2202/023
摘要： A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.

66. 发明授权

US08624152B2 Negative coefficient thermal expansion engineered particles for composite fabrication 失效
标题翻译：用于复合制造的负系数热膨胀工程颗粒
公开(公告)号：US08624152B2
公开(公告)日：2014-01-07
申请号：US13356778
申请日：2012-01-24
申请人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
发明人： Gareth G. Hougham , Vijayeshwar D. Khanna , Xiao Hu Liu , Gerard McVicker
IPC分类号： B23K26/00 , B23B3/00 , H01L21/30
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译：用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。此外，公开了通过本发明方法获得的新颖结构。

67. 发明授权

US07736152B2 Land grid array fabrication using elastomer core and conducting metal shell or mesh 失效
标题翻译：使用弹性体芯和导电金属壳或网的土地格栅阵列制造
公开(公告)号：US07736152B2
公开(公告)日：2010-06-15
申请号：US12249035
申请日：2008-10-10
申请人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, Jr.
发明人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, Jr.
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H01R12/7082 , H01R12/714 , H01R43/007 , H05K3/4007 , H05K3/42 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/0959 , H05K2201/10378 , Y10S439/931 , Y10T442/109 , Y10T442/172
摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.
摘要翻译：制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。还提供了通过本发明的方法制造的LGA插入器触点。提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

68. 发明授权

US07479014B2 Land grid array fabrication using elastomer core and conducting metal shell or mesh 失效
标题翻译：使用弹性体芯和导电金属壳或网的土地格栅阵列制造
公开(公告)号：US07479014B2
公开(公告)日：2009-01-20
申请号：US10531494
申请日：2003-05-13
申请人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, Jr.
发明人： Gareth G. Hougham , Keith E. Fogel , Paul A. Lauro , Joseph Zinter, Jr.
IPC分类号： H01R12/00
CPC分类号： H01R13/2414 , H01R12/7082 , H01R12/714 , H01R43/007 , H05K3/4007 , H05K3/42 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/0959 , H05K2201/10378 , Y10S439/931 , Y10T442/109 , Y10T442/172
摘要： Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.
摘要翻译：制造导电和弹性的Land Grid Array（LGA）插入器触点的方法。还提供了通过本发明的方法制造的LGA插入器触点。提供了LGA型，其利用由从按钮结构的顶表面到底表面连续的导电材料覆盖的纯未填充弹性体按钮芯。为了消除在使用导电插入器触点的地面栅格阵列的制造和结构的技术中目前遇到的缺点和缺点，提供了用于将弹性体按钮模制成预金属化的LGA载体片的方法和结构，以及其中非导电弹性体按钮被表面金属化以便将它们转换为导电电触点。

69. 发明授权

US06179679B2 Method and system for curing ultra violet curable sealant that is shadowed by metallization 有权
标题翻译：用于固化由金属化阴影的紫外线可固化密封剂的方法和系统
公开(公告)号：US06179679B2
公开(公告)日：2001-01-30
申请号：US09425701
申请日：1999-10-22
申请人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
发明人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
IPC分类号： G02F11339
CPC分类号： G02F1/1339
摘要： The invention is a method for curing a sealant used to affix two substrates to one another. The sealant requires curing by heat or uv photons. To overcome the shadowing caused by metal patterns, the uv light in the form of laser light is delivered at slant angles without losing light due to strong reflections caused by shallow angles of incidence. Several embodiments are described including a modulation technique for a providing scanned uv beam. Another method utilizes a sufficiently strong pulsed stationary or moving laser beam that can heat the regions of a metallized pattern to provide thermal energy for curing the sealant while providing uv photons through open regions of the metal pattern to access the sealant so as to afford a photolytic cure of a hybrid sealant.
摘要翻译：本发明是用于固化用于将两个基板彼此粘合的密封剂的方法。密封剂需要通过热或紫外光子固化。为了克服由金属图案引起的阴影，由于由较小的入射角引起的强烈的反射，激光形式的紫外光以倾斜的角度传送而不会损失光。描述了包括用于提供扫描的紫外线束的调制技术的几个实施例。另一种方法使用足够强的脉冲静止或移动的激光束，其可以加热金属化图案的区域以提供用于固化密封剂的热能，同时通过金属图案的开放区域提供紫外光子以进入密封剂，以提供光解固化混合密封剂。

70. 发明授权

US5324813A Low dielectric constant fluorinated polymers and methods of fabrication thereof 失效
标题翻译：低介电常数氟化聚合物及其制造方法
公开(公告)号：US5324813A
公开(公告)日：1994-06-28
申请号：US918814
申请日：1992-07-22
申请人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
发明人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1039
摘要： Low dielectric constant polyimides formed from an optionally fluorinated dianhydride and a fluorinated diamine are described. The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redryed and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.
摘要翻译：描述了由任选氟化二酐和氟化二胺形成的低介电常数聚酰亚胺。含氟成分被空间排列，使得成分的偶极矩倾向于抵消。由于含氟二胺通常是非反应性的，为了实现高分子量的聚酰亚胺实际上是有用的，提供了由低反应性单体制备高分子量聚合物的方法。在形成低分子量聚酰胺酸的溶液中提供单体，例如二胺和二酐。将溶液干燥。使用的聚酰胺酸固化成低分子量聚酰亚胺。将聚酰亚胺重新溶解，重新混合并再次回收足够的时间以将分子量建立到有用的水平。该方法适用于制造其它高分子量聚合物，如聚酰胺，聚酯和聚氨酯。

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