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1. 发明授权

US5324813A Low dielectric constant fluorinated polymers and methods of fabrication thereof 失效
标题翻译：低介电常数氟化聚合物及其制造方法
公开(公告)号：US5324813A
公开(公告)日：1994-06-28
申请号：US918814
申请日：1992-07-22
申请人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
发明人： Gareth G. Hougham , Jane M. Shaw , Alfred Viehbeck
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1039
摘要： Low dielectric constant polyimides formed from an optionally fluorinated dianhydride and a fluorinated diamine are described. The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redryed and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.
摘要翻译：描述了由任选氟化二酐和氟化二胺形成的低介电常数聚酰亚胺。含氟成分被空间排列，使得成分的偶极矩倾向于抵消。由于含氟二胺通常是非反应性的，为了实现高分子量的聚酰亚胺实际上是有用的，提供了由低反应性单体制备高分子量聚合物的方法。在形成低分子量聚酰胺酸的溶液中提供单体，例如二胺和二酐。将溶液干燥。使用的聚酰胺酸固化成低分子量聚酰亚胺。将聚酰亚胺重新溶解，重新混合并再次回收足够的时间以将分子量建立到有用的水平。该方法适用于制造其它高分子量聚合物，如聚酰胺，聚酯和聚氨酯。

2. 发明授权

US5599611A Prepreg and cured laminate fabricated from a toughened polycyanurate 失效
标题翻译：由增韧的聚氰酸酯制成的预浸料和固化层压板
公开(公告)号：US5599611A
公开(公告)日：1997-02-04
申请号：US344479
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A prepreg comprising a reinforcing material impregnated with a curable material. The curable material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：一种预浸料，其包含浸渍有可固化材料的增强材料。可固化材料包括含氟氰酸酯和含氟亚芳基醚聚合物的共混物。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，并且含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，X是任何能够与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

3. 发明授权

US5582858A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5582858A
公开(公告)日：1996-12-10
申请号：US474985
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

4. 发明授权

US5556899A Fluorinated carbon polymer composites 失效
标题翻译：氟化碳聚合物复合材料
公开(公告)号：US5556899A
公开(公告)日：1996-09-17
申请号：US346766
申请日：1994-11-30
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J5/18
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.
摘要翻译：公开了通过基于2-60重量份的分散体形成复合材料来实现聚酰亚胺材料的介电常数和热膨胀系数的变化的方法。％的氟化颗粒碳材料和聚酰亚胺或聚酰亚胺前体，并将分散体在65℃-200℃/秒加热至约400℃。

5. 发明授权

US5527838A Toughened polycyanurate resins containing particulates 失效
标题翻译：含有微粒的增韧聚氰脲酸酯树脂
公开(公告)号：US5527838A
公开(公告)日：1996-06-18
申请号：US344478
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , C08K7/16
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A curable material comprising a particulate filler and a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of said fluorine-containing thermoplastic polymer dispersed therein wherein said thermoplastic polymer phases are of submicron size.
摘要翻译：一种包含颗粒填料和含氟氰酸酯和含氟亚芳基醚聚合物的共混物的可固化材料。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100; 固化状态的材料包括含氟聚氰化酸盐网络，其中分散有所述含氟热塑性聚合物的多个离散相，其中所述热塑性聚合物相具有亚微米尺寸。

6. 发明授权

US5571852A Fluorinated carbon polymer composites 失效
公开(公告)号：US5571852A
公开(公告)日：1996-11-05
申请号：US472120
申请日：1995-06-07
申请人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Juan Ayala-Esquilin , Bodil E. Braren , Shahrokh Daijavad , Elizabeth Foster , James L. Hedrick, Jr. , Jeffrey C. Hedrick , Rodney T. Hodgson , Ashit A. Mehta , Steven E. Molis , Jane M. Shaw , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： C08J7/00 , C08K3/04 , C08K9/02 , H01B3/30 , H01L21/312 , H05K1/03 , H05K3/10 , C08J3/28
CPC分类号： H05K1/0373 , C08K3/04 , C08K9/02 , H05K1/0346 , H05K2201/0154 , H05K2201/0239 , H05K2201/0323 , H05K2201/068 , H05K3/105 , Y10T428/31544
摘要： Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

7. 发明授权

US5529836A Multilayer article comprising a toughened polycyanurate 失效
标题翻译：包含增韧的聚氰化油酸酯的多层制品
公开(公告)号：US5529836A
公开(公告)日：1996-06-25
申请号：US344476
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B7/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： A laminate comprising a layer of conductive metal and a plurality of layers of a cured prepreg is disclosed. The prepreg comprises a reinforcing material impregnated with a curable material. The curable material is a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.ident.C--O--R--[R.sup.1 ].sub.n --O--C.ident.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：公开了一种包含导电金属层和多层固化预浸料的层压体。预浸料包括浸渍有可固化材料的增强材料。可固化材料是含氟氰酸酯和含氟亚芳基醚聚合物的共混物。氰酸酯是具有结构N = C-O-R- [R 1] n -O-C = N的单体，含氟亚芳基醚聚合物具有结构X-R- [R 1] m -X，其中X是能够与-C = N基团反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

8. 发明授权

US5527593A Structures fabricated from toughened polycyanurate 失效
标题翻译：由增韧的聚氰化物制成的结构
公开(公告)号：US5527593A
公开(公告)日：1996-06-18
申请号：US344477
申请日：1994-11-23
申请人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
发明人： Ali Afzali-Ardakani , Jeffrey T. Gotro , Jeffrey C. Hedrick , Konstantinos Papathomas , Niranjan M. Patel , Jane M. Shaw , Alfred Viehbeck
IPC分类号： B32B27/06 , C08G65/40 , C08G73/06 , C08G75/00 , C08G75/20 , C08G79/02 , C08G79/04 , C08J5/24 , C08L79/04 , C08L101/00 , C08L101/02 , C08L101/04 , H05K1/03 , B32B3/00
CPC分类号： C08L79/04 , H05K1/0373 , Y10S428/901 , Y10T428/24917 , Y10T442/2902 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3569 , Y10T442/656 , Y10T442/671
摘要： An electronic circuit package comprising an electrically conductive pattern embedded within a curable material. The curable material comprises a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein. The thermoplastic polymer phases are of submicron size.
摘要翻译：一种电子电路封装，包括嵌入可固化材料内的导电图案。可固化材料包括含氟氰酸酯和含氟亚芳基醚聚合物。氰酸酯是具有结构N 3BOND C-O-R- [R 1] n -O-C 3 N N的单体，含氟亚芳基醚聚合物具有X-R- [R 1] m -X的结构，其中X是可与-C 3 N N基反应的基团; R是可以是或不是氟取代的脂族或芳族基团; R1是脂族或芳族基团，其可以是或不是氟取代的，或者R1选自醚，羰基，砜，氧化膦和硫化物，并且R或R 1中的至少一个必须是氟取代的; n为0-10; m为0-100。固化状态的材料含有分散在其中的含氟热塑性聚合物的多个离散相的含氟聚氰脲酸酯网络。热塑性聚合物相具有亚微米尺寸。

9. 发明授权

US5326643A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5326643A
公开(公告)日：1994-07-05
申请号：US771929
申请日：1991-10-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B32B9/00
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

10. 发明授权

US5569739A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5569739A
公开(公告)日：1996-10-29
申请号：US197941
申请日：1994-02-17
申请人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , C08F8/34
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。接合操作。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。

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