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1. 发明授权

US08011563B2 Compliant mold fill head with integrated cavity venting and solder cooling 有权
标题翻译：具有集成腔体排气和焊锡冷却的合适的模具填充头
公开(公告)号：US08011563B2
公开(公告)日：2011-09-06
申请号：US11696753
申请日：2007-04-05
申请人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
发明人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译：模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化界面部分和模板。

2. 发明申请

US20080245847A1 Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling 有权
标题翻译：符合标准的模具填充头，集成腔体通风和焊接冷却
公开(公告)号：US20080245847A1
公开(公告)日：2008-10-09
申请号：US11696753
申请日：2007-04-05
申请人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
发明人： Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
IPC分类号： B23K1/00
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译：模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化界面部分和模板。

3. 发明申请

US20080212282A1 METHOD AND APPARATUS FOR COOLING AN EQUIPMENT ENCLOSURE THROUGH CLOSED-LOOP LIQUID-ASSISTED AIR COOLING IN COMBINATION WITH DIRECT LIQUID COOLING 审中-公开
公开(公告)号：US20080212282A1
公开(公告)日：2008-09-04
申请号：US12042596
申请日：2008-03-05
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.

4. 发明授权

US07342789B2 Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling 有权
标题翻译：通过闭环，液体辅助空气冷却与直接液体冷却结合来冷却设备外壳的方法和设备
公开(公告)号：US07342789B2
公开(公告)日：2008-03-11
申请号：US11427384
申请日：2006-06-29
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
IPC分类号： H05K7/20 , F28D15/00 , F28F7/00
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
摘要翻译：优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

5. 发明授权

US07486513B2 Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling 失效
标题翻译：通过闭环液体辅助空气冷却与直接液体冷却结合来冷却设备外壳的方法和设备
公开(公告)号：US07486513B2
公开(公告)日：2009-02-03
申请号：US11862289
申请日：2007-09-27
申请人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
发明人： Shawn A. Hall , Shurong Tian , Paul W. Coteus , John P. Karidis , Evan G. Colgan , Robert W. Guernsey, Jr.
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , G06F1/20 , G06F2200/201
摘要： A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-density components, such as microprocessor chips for example, is removed by direct liquid cooling, whereas heat generated by the more numerous low-power or low-watt-density components, such as memory chips for example, is removed by liquid-assisted air cooling in the form of a closed loop comprising a plurality of heating and cooling zones that alternate along the air path.
摘要翻译：优选地在外壳内冷却发热部件的多样性的方法和装置，其中至少一些部件具有高功率密度，而其它部件具有低功率密度。由基本相对较少的高功率密度组件（例如微处理器芯片）产生的热量通过直接液体冷却而被去除，而由更多的低功率或低功率密度组件产生的热量，例如存储芯片例如，通过液体辅助空气冷却以封闭回路的形式除去，包括沿着空气路径交替的多个加热和冷却区域。

6. 发明申请

US20090183849A1 FULL-FIELD SOLDER COVERAGE 有权
标题翻译：全场焊接覆盖
公开(公告)号：US20090183849A1
公开(公告)日：2009-07-23
申请号：US12018421
申请日：2008-01-23
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B22D27/15 , B67D5/00 , B22D23/00
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

7. 发明授权

US07980445B2 Fill head for full-field solder coverage with a rotatable member 有权
标题翻译：用可旋转构件填充头用于全场焊接覆盖
公开(公告)号：US07980445B2
公开(公告)日：2011-07-19
申请号：US12018421
申请日：2008-01-23
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K1/00 , B23K37/06 , B23K37/00 , B23K35/12
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

8. 发明授权

US09314864B2 C4NP compliant solder fill head seals 有权
标题翻译： C4NP兼容焊料填充头密封
公开(公告)号：US09314864B2
公开(公告)日：2016-04-19
申请号：US11774713
申请日：2007-07-09
申请人： Russell A. Budd , John P. Karidis
发明人： Russell A. Budd , John P. Karidis
IPC分类号： B23K3/06 , B23K1/00
CPC分类号： B23K3/0638 , B23K1/0016 , B23K3/0607 , B23K2101/40 , H05K2203/0126
摘要： A seal, fill head, and system are provided. The seal is adapted to cooperate with a fill head that is configured to place conductive bonding material into cavities on a mold. The seal comprises a first outer wall that is configured to abut a first adjacent wall of a support groove in a fill head. A second outer wall is configured to abut a second adjacent wall of a support groove in a fill head. An outer horizontal wall is situated between the first outer wall and the second outer wall. The outer horizontal wall comprises at least a first portion that is configured to abut an upper portion of the support groove. A convex bottom portion extends from the first and second outer walls. The convex bottom portion is configured to cooperate with a top surface of a mold.
摘要翻译：提供密封，填充头和系统。该密封件适于与配置成将导电粘合材料置于模具中的空腔中的填充头配合。密封件包括第一外壁，其被构造成邻接填充头中的支撑槽的第一相邻壁。第二外壁构造成邻接填充头中的支撑槽的第二相邻壁。外部水平壁位于第一外壁和第二外壁之间。外部水平壁包括至少第一部分，其构造成邻接支撑槽的上部。凸起的底部部分从第一和第二外壁延伸。凸底部构造成与模具的顶表面配合。

9. 发明授权

US08181846B2 Method of full-field solder coverage using a vacuum fill head 有权
标题翻译：使用真空填充头的全场焊接覆盖方法
公开(公告)号：US08181846B2
公开(公告)日：2012-05-22
申请号：US13100133
申请日：2011-05-03
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K31/02
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

10. 发明授权

US08286855B2 Method of full-field solder coverage by inverting a fill head and a mold 有权
标题翻译：通过倒置灌装头和模具来实现全场焊接覆盖的方法
公开(公告)号：US08286855B2
公开(公告)日：2012-10-16
申请号：US13442322
申请日：2012-04-09
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K31/02 , B23K31/00
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供了一种将导电接合材料沉积在模具中的空腔中的方法。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

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