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    • 66. 发明授权
    • Physical design automation system and process for designing integrated
circuit chip using simulated annealing with
    • 物理设计自动化系统和使用模拟退火设计集成电路芯片的过程用“棋盘和摆动”优化
    • US5796625A
    • 1998-08-18
    • US609359
    • 1996-03-01
    • Ranko ScepanovicJames S. KofordAlexander E. AndreevIvan Pavisic
    • Ranko ScepanovicJames S. KofordAlexander E. AndreevIvan Pavisic
    • G06F17/50
    • G06F17/5072
    • A cell placement for an integrated circuit chip is divided into two "chessboard" patterns or "jiggles". Each pattern resembles a chessboard in that it consists of alternating regions of different types or "colors" such that no region of a given color has an edge common with another region of the same color. The jiggles are offset relative to each other such that the regions of one jiggle partially overlap at least two regions of the other jiggle. Simulated annealing is performed sequentially for each color of each jiggle. During each operation, a plurality of parallel processors operate on the regions simultaneously using a previous copy of the entire chip, with one processor being assigned to one or more regions. At the end of each operation, the copy of the chip is updated. The chessboard patterns eliminate unproductive cell moves resulting from adjacent regions having a common edge. The jiggles enable cells to move to their optimal positions from their initial region to any other region on the chip. The regions can have rectangular, triangular or hexagonal shapes. An initial temperature for the actual simulated annealing operation is determined by performing simulated annealing without cell swaps with different temperature, and selecting the temperature at which a cost function such as total wirelength does not significantly change.
    • 集成电路芯片的单元布局分为两个“棋盘”图案或“跳棋”。 每个图案类似于棋盘,其由不同类型或“颜色”的交替区域组成,使得给定颜色的区域不具有与相同颜色的另一区域相同的边缘。 跳块相对于彼此偏移,使得一个颤动的区域部分地与另一个摇摆的至少两个区域重叠。 对每个抖动的每个颜色依次执行模拟退火。 在每个操作期间,多个并行处理器使用整个芯片的先前副本同时在该区域上操作,一个处理器被分配给一个或多个区域。 在每个操作结束时,更新芯片的副本。 棋盘图案消除由具有共同边缘的相邻区域产生的非生产性细胞移动。 这些跳跃使得电池从它们的初始区域移动到其最佳位置到芯片上的任何其它区域。 这些区域可以具有矩形,三角形或六边形形状。 实际模拟退火操作的初始温度是通过进行模拟退火而不使用不同温度的电池互换来确定的,并且选择诸如总线长度的成本函数不会显着改变的温度。
    • 67. 发明授权
    • Physical design automation system and process for designing integrated
circuit chips using generalized assignment
    • 物理设计自动化系统和使用广义分配设计集成电路芯片的过程
    • US5784287A
    • 1998-07-21
    • US536004
    • 1995-09-29
    • Ranko ScepanovicJames S. KofordEdwin R. JonesValeriy B. KudryavtsevAlexander E. AndreevStanislav V. AleshinAlexander S. Podkolzin
    • Ranko ScepanovicJames S. KofordEdwin R. JonesValeriy B. KudryavtsevAlexander E. AndreevStanislav V. AleshinAlexander S. Podkolzin
    • G06F17/50
    • G06F17/5072
    • A process for designing an integrated circuit chip s comprises specifying a plurality of regions on the chip in which a plurality of objects are to be placed, such that there are more of the objects than the regions, and specifying penalties for the objects to be placed in the regions respectively. The objects can be microelectronic cells, interconnect wiring segments, etc. An assignment of the objects to the regions is constructed, and a number of objects for movement between the regions is selected. An optimal permutation of movement of the selected number of objects between the regions is computed such that a cost corresponding to the total penalties for the assignment is maximally reduced, and the assignment is modified by moving the selected number of objects through the optimal permutation. The process steps are repeated iteratively such that a maximum number of objects which will produce a maximal reduction in cost is moved during each iteration. The optimal permutation is determined by computing penalty changes for moving the objects between the regions respectively, defining a penalty change scale having a plurality of subintervals, assigning the objects to the penalty change scale in accordance with their penalty changes, and moving the objects which have penalty changes in a number of subintervals having largest values of negative penalty change.
    • 设计集成电路芯片的过程包括在芯片上指定多个对象要放置的多个区域,使得存在比区域更多的对象,并且指定要放置的对象的处罚 分别在区域。 物体可以是微电子单元,互连布线段等。构造对象到区域的分配,并且选择用于在区域之间移动的多个对象。 计算在区域之间所选择的对象数量的移动的最佳排列,使得对应于分配的总惩罚的成本被最大程度地减少,并且通过移动所选择的对象数量通过最优排列来修改分配。 迭代地重复处理步骤,使得在每次迭代期间移动将产生最大成本降低的最大数量的对象。 通过计算用于在区域之间移动对象的惩罚变化来确定最优排列,定义具有多个子区间的惩罚改变量表,根据其惩罚改变将对象分配给惩罚改变量表,以及移动具有 在具有最大值的负惩罚变化的多个子区间中的惩罚变化。