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61. 发明申请

US20110198281A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
标题翻译：具有小于单个层的形成的最小特征尺寸的特征的多层三维结构
公开(公告)号：US20110198281A1
公开(公告)日：2011-08-18
申请号：US13040500
申请日：2011-03-04
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B01D39/00 , C25D1/08 , B32B5/18
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

62. 发明申请

US20110092988A1 Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making 审中-公开
标题翻译：用于组织近似和保留的微型装置，使用方法和制造方法
公开(公告)号：US20110092988A1
公开(公告)日：2011-04-21
申请号：US12909743
申请日：2010-10-21
申请人： Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： A61B17/10 , A61B17/08
CPC分类号： A61B17/0057 , A61B17/0401 , A61B17/0469 , A61B17/0482 , A61B17/0487 , A61B17/0643 , A61B17/083 , A61B2017/00345 , A61B2017/00526 , A61B2017/00575 , A61B2017/00592 , A61B2017/00606 , A61B2017/00623 , A61B2017/00628 , A61B2017/00663 , A61B2017/00668 , A61B2017/0409 , A61B2017/0435 , A61B2017/0462 , A61B2017/0464 , A61B2017/0488 , A61B2017/0495 , A61B2017/0496 , A61B2017/06052 , A61B2017/06176 , A61B2017/081 , A61B2017/22054
摘要： Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.
摘要翻译：本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀，然后可以使得彼此移动以使两个组织区域进入更靠近的位置。在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。

63. 发明授权

US07878385B2 Probe arrays and method for making 有权
标题翻译：探针阵列和制作方法
公开(公告)号：US07878385B2
公开(公告)日：2011-02-01
申请号：US11929539
申请日：2007-10-30
申请人： Ananda H. Kumar , Ezekiel J. J. Kruglick , Adam L. Cohen , Kieun Kim , Gang Zhang , Richard T. Chen , Christopher A. Bang , Vacit Arat , Michael S. Lockard , Uri Frodis , Pavel B. Lembrikov , Jeffrey A. Thompson
发明人： Ananda H. Kumar , Ezekiel J. J. Kruglick , Adam L. Cohen , Kieun Kim , Gang Zhang , Richard T. Chen , Christopher A. Bang , Vacit Arat , Michael S. Lockard , Uri Frodis , Pavel B. Lembrikov , Jeffrey A. Thompson
IPC分类号： B23K31/02
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

64. 发明授权

US07836371B2 On-chip service processor 有权
标题翻译：片上服务处理器
公开(公告)号：US07836371B2
公开(公告)日：2010-11-16
申请号：US11424610
申请日：2006-06-16
申请人： Bulent Dervisoglu , Laurence H. Cooke , Vacit Arat
发明人： Bulent Dervisoglu , Laurence H. Cooke , Vacit Arat
IPC分类号： G01R31/28
CPC分类号： G01R31/318572 , G01R31/31705 , G01R31/31723 , G01R31/318385 , G01R31/318566
摘要： An integrated circuit is described that includes a stored program processor for test and debug of user-definable logic plus external interface between the test/debug circuits and the component pins. The external interface may be via an existing test interface or a separate serial or parallel port. Test and debug circuits may contain scan strings that may be used to observe states in user-definable logic or be used to provide pseudo-random bit sequences to user-definable logic. Test and debug circuits may also contain an on-chip logic analyzer for capturing sequences of logic states in user-definable circuits. Test and debug circuits may be designed to observe states in user-definable circuits during the normal system operation of said user-definable circuits.
摘要翻译：描述了一种集成电路，其包括存储的程序处理器，用于测试和调试用户可定义逻辑以及测试/调试电路和组件引脚之间的外部接口。外部接口可以通过现有的测试接口或单独的串行或并行端口。测试和调试电路可能包含可用于观察用户可定义逻辑状态的扫描串，或用于向用户定义的逻辑提供伪随机位序列。测试和调试电路还可以包含用于捕获用户可定义电路中的逻辑状态序列的片上逻辑分析器。测试和调试电路可以被设计为在所述用户可定义电路的正常系统操作期间观察用户可定义电路中的状态。

65. 发明申请

US20100133109A1 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20100133109A1
公开(公告)日：2010-06-03
申请号：US12624240
申请日：2009-11-23
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
IPC分类号： C25D5/02 , C25D5/48 , C25D7/00
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

66. 发明申请

US20100094320A1 Atherectomy and Thrombectomy Devices, Methods for Making, and Procedures for Using 审中-公开
标题翻译：动脉粥样硬化切除术和血栓切除术装置，制造方法和使用程序
公开(公告)号：US20100094320A1
公开(公告)日：2010-04-15
申请号：US12614006
申请日：2009-11-06
申请人： Vacit Arat , Richard T. Cohen , Ming Ting Wu , Pavel B. Lembrikov , Adam L. Cohen
发明人： Vacit Arat , Richard T. Cohen , Ming Ting Wu , Pavel B. Lembrikov , Adam L. Cohen
IPC分类号： A61B17/22
CPC分类号： A61B17/320725 , A61B17/320758 , A61B2017/003 , A61B2017/22071 , A61B2017/320004 , A61B2017/320008
摘要： Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.
摘要翻译：实施例涉及用于从血管内壁移除材料的装置，例如在动脉粥样硬化切除术或血栓切除术过程期间，其中装置包括消融工具和至少一个消融工具稳定器，其可用于将消融工具径向定位在容器内的期望位置处。在一些实施例中，消融工具可以具有旋转切割元件，旋转切割元件具有大致平行于待清除的容器的局部轴线的旋转轴线。在一些实施例中，消融工具可以具有允许清除材料并且能够经由稳定装置或装置进行径向定位和旋转定位的单侧和/或顶部，并且还可以通过稳定性轴向运动设备。

67. 发明申请

US20080211524A1 Electrochemically Fabricated Microprobes 审中-公开
标题翻译：电化学制造的微波
公开(公告)号：US20080211524A1
公开(公告)日：2008-09-04
申请号：US11928868
申请日：2007-10-30
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kieun Kim , Gang Zhang , Dennis R. Smalley
IPC分类号： G01R1/073
CPC分类号： A61N1/00 , C25D1/00 , C25D1/003
摘要： Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
摘要翻译：用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。在一些实施例中，提供了多个探针的阵列。

68. 发明申请

US20080142369A1 Integrated Circuit Packaging Using Electrochemically Fabricated Structures 审中-公开
标题翻译：使用电化学结构的集成电路封装
公开(公告)号：US20080142369A1
公开(公告)日：2008-06-19
申请号：US11943536
申请日：2007-11-20
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard
IPC分类号： C25D5/02
CPC分类号： C25D1/003 , C23C18/16 , C23C18/1605 , C23C18/1651 , C25D5/02 , C25D5/022 , C25D5/10 , H01L21/48 , H01L21/4857 , H01L21/50 , H01L24/16 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1461 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2224/0401 , H01L2924/014
摘要： Embodiments of the invention provide a package for holding an integrated circuit or other electronic component and/or a packaged integrated circuit or electronic component which is formed at least in part via an electrochemical fabrication process from a plurality of adhered layers of conductive and dielectric materials.
摘要翻译：本发明的实施例提供一种用于保持集成电路或其它电子部件和/或封装的集成电路或电子部件的封装，所述集成电路或电子部件至少部分地通过电化学制造工艺从多个粘附的导电和介电材料层形成。

69. 发明申请

US20080106280A1 Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes 审中-公开
标题翻译：用于接触电子元件的垂直微孔及其制造方法
公开(公告)号：US20080106280A1
公开(公告)日：2008-05-08
申请号：US11928707
申请日：2007-10-30
申请人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
发明人： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
IPC分类号： G01R1/067
CPC分类号： G01R3/00 , A61N1/00 , C25D1/00 , C25D1/003 , G01R1/06722 , G01R1/06744 , G01R1/06761
摘要： Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
摘要翻译：用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

70. 发明申请

US20080100315A1 Electrochemically fabricated microprobes 审中-公开
标题翻译：电化学制造的微型纺织品
公开(公告)号：US20080100315A1
公开(公告)日：2008-05-01
申请号：US11928398
申请日：2007-10-30
申请人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
发明人： Vacit Arat , Adam Cohen , Dennis Smalley , Ezekiel Kruglick , Richard Chen , Kieun Kim
IPC分类号： G01R1/067
CPC分类号： G01R1/06711 , G01R1/06716 , G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.
摘要翻译：多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如，当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在方向垂直于IC的表面的平面。在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

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