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1. 发明授权

US08070931B1 Electrochemical fabrication method including elastic joining of structures 有权
标题翻译：包括结构弹性连接的电化学制造方法
公开(公告)号：US08070931B1
公开(公告)日：2011-12-06
申请号：US12345624
申请日：2008-12-29
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译：实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保留，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触，或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

2. 发明申请

US20110031183A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
公开(公告)号：US20110031183A1
公开(公告)日：2011-02-10
申请号：US12873131
申请日：2010-08-31
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B01D39/00 , B32B3/26 , B32B5/18 , B32B7/02
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

3. 发明申请

US20100155253A1 Microprobe Tips and Methods for Making 审中-公开
标题翻译：微型技巧和制作方法
公开(公告)号：US20100155253A1
公开(公告)日：2010-06-24
申请号：US12631632
申请日：2009-12-04
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
IPC分类号： C25D5/02 , B32B37/00 , C25D5/48
CPC分类号： G01R1/0483 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/06744 , G01R1/07314 , G01R1/07357 , G01R3/00 , G01R31/2886 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T156/10 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

4. 发明申请

US20100121307A1 Microneedles, Microneedle Arrays, Methods for Making, and Transdermal and/or Intradermal Applications 审中-公开
标题翻译：微针，微针阵列，制造方法和透皮和/或内皮应用
公开(公告)号：US20100121307A1
公开(公告)日：2010-05-13
申请号：US12611108
申请日：2009-11-02
申请人： Michael S. Lockard , Vacit Arat , Adam L. Cohen , Kirk G. Nielsen
发明人： Michael S. Lockard , Vacit Arat , Adam L. Cohen , Kirk G. Nielsen
IPC分类号： A61M5/32
CPC分类号： A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0046 , A61M2037/0053
摘要： Embodiments are directed to microneedle array devices for intradermal and/or transdermal interaction with the body of patient to provide therapeutic, diagnostic or preventative treatment wherein portions of the devices may be formed by multi-layer, multi-material electrochemical fabrication methods and wherein individual microneedles may include valve elements or other elements for controlling interaction (e.g. fluid flow). In some embodiments needles are retractable and extendable from a surface of the device. In some embodiments, interaction occurs automatically with movement across the skin of the patient while in other embodiments interaction is controlled by an operator (e.g. doctor, nurse, technician, or patient).
摘要翻译：实施例涉及用于与患者体内皮内和/或透皮相互作用的微针阵列装置，以提供治疗，诊断或预防性治疗，其中装置的部分可以通过多层多材料电化学制造方法形成，并且其中单个微针可以包括用于控制相互作用（例如流体流动）的阀元件或其它元件。在一些实施例中，针可从装置的表面缩回并延伸。在一些实施例中，通过穿过患者皮肤的运动自动发生相互作用，而在其他实施例中，相互作用由操作者（例如医生，护士，技术人员或患者）控制。

5. 发明授权

US07412767B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07412767B2
公开(公告)日：2008-08-19
申请号：US11029217
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01R43/02 , H01R9/00
CPC分类号： G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49211 , Y10T29/49213
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

6. 发明授权

US07160429B2 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures 有权
公开(公告)号：US07160429B2
公开(公告)日：2007-01-09
申请号：US10434103
申请日：2003-05-07
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher J. Lee
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher J. Lee
IPC分类号： C25D5/48 , C25D5/02 , C25D5/10
CPC分类号： B81C1/00293 , B33Y10/00 , B81B2201/042 , B81C2203/0145 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

7. 发明授权

US08702955B2 Electrochemical fabrication method including elastic joining of structures 有权
标题翻译：包括结构弹性连接的电化学制造方法
公开(公告)号：US08702955B2
公开(公告)日：2014-04-22
申请号：US13287437
申请日：2011-11-02
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译：实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保持，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触，或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

8. 发明授权

US08512861B2 Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers 有权
公开(公告)号：US08512861B2
公开(公告)日：2013-08-20
申请号：US13323995
申请日：2011-12-13
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B32B19/00 , B01D39/00
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

9. 发明授权

US07273812B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07273812B2
公开(公告)日：2007-09-25
申请号：US11178145
申请日：2005-07-07
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
IPC分类号： H01L21/44
CPC分类号： C25D1/003 , G01R3/00 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

10. 发明授权

US07241689B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07241689B2
公开(公告)日：2007-07-10
申请号：US11029169
申请日：2005-01-03
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard
IPC分类号： H01L21/44
CPC分类号： H01R13/187 , H01L24/72 , H01L2924/15747 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

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