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    • 61. 发明申请
    • Radiation emitting semiconductor device
    • 辐射发射半导体器件
    • US20050003565A1
    • 2005-01-06
    • US10837828
    • 2004-05-03
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • Dominik EisertVolker HaerleFrank KuehnManfred Mundbrod-VangerowUwe StraussUlrich Zehnder
    • H01L33/00H01L33/20H01L33/22H01L33/38H01L33/40H01L21/00
    • H01L33/20H01L33/0079H01L33/22H01L33/38H01L33/405H01L33/60H01L2224/32245H01L2224/32257H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/73265H01L2924/10155H01L2924/00014H01L2924/00
    • Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device. A radiation-emitting semiconductor device with a multilayer structure (100) comprising a radiation-emitting active layer (10), with electrical contacts (30, 40) for impressing a current in the multilayer structure (100) and with a radiotransparent window layer (20). The window layer is arranged exclusively on the side of the multilayer structure (100) facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion (20a) which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence. In its subsequent extension toward the back side, viewed from the multilayer structure, the side wall changes over into a second side wall portion (20b) that extends perpendicularly to the multilayer structure, that is, parallel to the central axis, and the portion of the window layer (20) encompassing the second side wall portion (20b) forms a mounting pedestal for the semiconductor device. The first and second side wall portions are fabricated especially preferably by means of a saw blade having a shaped edge. In a preferred optical device, the semiconductor device is mounted window layer downward in a reflector cup.
    • 辐射发射半导体器件,其制造方法和发射光学器件。 一种具有多层结构(100)的辐射发射半导体器件(100),包括辐射发射有源层(10),具有用于在多层结构(100)中施加电流的电触点(30,40)以及无线电透过窗口层 20)。 窗层仅排列在背离半导体器件的主辐射方向的多层结构(100)的侧面上,并具有至少一个侧壁,该侧壁包括第一侧壁部分(20a),该第一侧壁部分倾斜地, 或者以逐步的方式朝向垂直于多层序列的半导体器件的中心轴线。 在从多层结构观察的随后的向后延伸的过程中,侧壁转变成垂直于多层结构延伸的第二侧壁部分(20b),即平行于中心轴线的部分 包围第二侧壁部分(20b)的窗口层(20)形成用于半导体器件的安装基座。 第一和第二侧壁部分特别优选地通过具有成形边缘的锯片来制造。 在优选的光学器件中,半导体器件将窗口层向下安装在反射杯中。
    • 66. 发明授权
    • Semiconductor component and method for producing a semiconductor component
    • 半导体元件的制造方法及半导体元件的制造方法
    • US08565278B2
    • 2013-10-22
    • US12863673
    • 2009-03-09
    • Christoph EichlerUwe Strauss
    • Christoph EichlerUwe Strauss
    • H01S5/00
    • H01L22/10H01L22/12H01S5/22H01S2301/173
    • A semiconductor component includes a semiconductor body with a semiconductor layer sequence having an active region, provided for generating coherent radiation, and an indicator layer. With respect to an interface which delimits the semiconductor body in regions in a vertical direction, on that side of said interface which is remote from the active region, the semiconductor body has a web-like region extending in a vertical direction between the interface and a surface of the semiconductor body. The indicator layer has a material composition that differs from that of the material of the web-like region which adjoins the indicator layer. A distance between the indicator layer and the surface is at most of the same magnitude as a distance between the interface and the surface.
    • 半导体部件包括具有半导体层序列的半导体本体,其具有用于产生相干辐射的有源区域和指示层。 关于在垂直方向的区域中限定半导体本体的界面,在远离有源区的所述界面的该侧,半导体本体具有在界面和a之间沿垂直方向延伸的网状区域 半导体体的表面。 指示剂层具有与邻接指示剂层的网状区域的材料组成不同的材料组成。 指示剂层和表面之间的距离与界面和表面之间的距离最大相同的大小。
    • 68. 发明申请
    • Optoelectronic Semiconductor Component
    • 光电半导体元件
    • US20120250715A1
    • 2012-10-04
    • US13257515
    • 2010-01-20
    • Martin MüllerUwe Strauss
    • Martin MüllerUwe Strauss
    • H01S5/20
    • H01S5/4031H01S3/094096H01S3/0941H01S5/0425H01S5/1053H01S5/3095H01S5/4043H01S5/405H01S5/4087H01S5/423
    • In at least one embodiment of the optoelectronic semiconductor component (1), the latter comprises an epitaxially grown semiconductor body (2) with at least one active layer (3). Furthermore, the semiconductor body (2) of the semiconductor component (1) comprises at least one barrier layer (4), the barrier layer (4) directly adjoining the active layer (3). A material composition and/or a layer thickness of the active layer (3) and/or of the barrier layer (4) is varied in a direction of variation or a longitudinal direction (L), perpendicular to a direction of growth (G) of the semiconductor body (2). By varying the material composition and/or the layer thickness of the active layer (3) and/or of the barrier layer (4), an emission wavelength (λ) of a radiation (R) generated in the active layer (3) is likewise adjusted in the direction of variation or in the longitudinal direction (L).
    • 在光电子半导体部件(1)的至少一个实施例中,后者包括具有至少一个有源层(3)的外延生长的半导体本体(2)。 此外,半导体部件(1)的半导体本体(2)包括至少一个阻挡层(4),阻挡层(4)直接邻接有源层(3)。 活性层(3)和/或阻挡层(4)的材料组成和/或层厚度在垂直于生长方向(G)的变化方向或纵向方向(L)上变化, 的半导体本体(2)。 通过改变有源层(3)和/或阻挡层(4)的材料组成和/或层厚度,在有源层(3)中产生的辐射(R)的发射波长(λ)为 同样地在变化的方向或纵向(L)上调整。