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51. 发明申请

US20100075343A1 NOVEL PEPTIDES 审中-公开
标题翻译：新款PEPTIDES
公开(公告)号：US20100075343A1
公开(公告)日：2010-03-25
申请号：US12524036
申请日：2007-11-29
申请人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi , Yoichi Ueta
发明人： Motoo Yamasaki , Noriyuki Takahashi , Naoto Minamino , Kazuki Sasaki , Toshifumi Takao , Yoshinori Satomi , Yoichi Ueta
IPC分类号： G01N33/53 , C07K14/00 , C07K7/06 , C07K7/08 , C07H21/00 , C12N15/63 , C12N5/00 , C12P21/00 , C07K16/00 , C12Q1/02
CPC分类号： C07K16/22 , A61K38/00 , C07K14/47 , G01N33/5008
摘要： The present invention provides novel peptides with energy-modulating activity or circulatory function-modulating activity. The peptides of the present invention have energy-modulating activity or circulatory function-modulating activity and thus are useful for treating food consumption disorders and diseases of the circulatory system.
摘要翻译：本发明提供具有能量调节活性或循环功能调节活性的新型肽。本发明的肽具有能量调节活性或循环功能调节活性，因此可用于治疗食物消耗障碍和循环系统的疾病。

52. 发明授权

US07615872B2 Semiconductor device 有权
公开(公告)号：US07615872B2
公开(公告)日：2009-11-10
申请号：US12314209
申请日：2008-12-05
申请人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani, legal representative , Kazuhiro Ichitani, legal representative , Sachiyo Ichitani, legal representative
发明人： Noriyuki Takahashi , Masahiro Ichitani
IPC分类号： H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

53. 发明申请

US20090091031A1 Semiconductor device 有权
公开(公告)号：US20090091031A1
公开(公告)日：2009-04-09
申请号：US12314209
申请日：2008-12-05
申请人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani , Kazuhiro Ichitani , Sachiyo Ichitani
发明人： Noriyuki Takahashi , Masahiro Ichitani , Rumiko Ichitani , Kazuhiro Ichitani , Sachiyo Ichitani
IPC分类号： H01L23/498
CPC分类号： H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

54. 发明申请

US20090087049A1 MEDICAL REPORTING SYSTEM, APPARATUS AND METHOD 有权
标题翻译：医疗报告系统，装置和方法
公开(公告)号：US20090087049A1
公开(公告)日：2009-04-02
申请号：US12212863
申请日：2008-09-18
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： G06K9/74
CPC分类号： G06F19/321 , A61B5/055 , A61B6/03 , A61B6/463 , A61B6/468 , G06F19/00 , G16H15/00
摘要： A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note.
摘要翻译：医疗报告系统包括用于显示多个CT图像的显示面板。 ROI设置单元指定CT图像中的感兴趣区域。组设定单元在CT图像之间设置具有感兴趣区域的一组特定CT图像，以生成组的组信息。报告编辑器显示用于输入与特定CT图像有关的音符的音符区域。存储器存储分配给组信息的笔记区域的文本位置，并将感兴趣区域的位置信息存储在特定CT图像中。此外，第一终端装置具有报告编辑器，ROI设置单元和组设置单元。第二终端设备在线上与第一终端设备通信。报告显示面板至少显示特定的CT图像和音符。

55. 发明申请

US20060141677A1 Method of manufacturing a semiconductor device 失效
公开(公告)号：US20060141677A1
公开(公告)日：2006-06-29
申请号：US11360512
申请日：2006-02-24
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/50 , H01L21/78
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

56. 发明授权

US07033857B2 Method of manufacturing a semiconductor device 有权
公开(公告)号：US07033857B2
公开(公告)日：2006-04-25
申请号：US10462463
申请日：2003-06-17
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/44
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

57. 发明授权

US07015069B2 Method of manufacturing a semiconductor device and a semiconductor device 有权
公开(公告)号：US07015069B2
公开(公告)日：2006-03-21
申请号：US11047660
申请日：2005-02-02
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L21/44
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

58. 发明申请

US20050140006A1 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20050140006A1
公开(公告)日：2005-06-30
申请号：US11003348
申请日：2004-12-06
申请人： Noriyuki Takahashi
发明人： Noriyuki Takahashi
IPC分类号： G01R31/26 , G01R1/04 , G01R31/28 , G01R31/30 , H01L21/02 , H01L21/28 , H01L21/301 , H01L21/60 , H01L21/66 , H01L21/768 , H01L21/78 , H01L23/12 , H01L23/31 , H01L23/48 , H01L23/50 , H01L23/52 , H01L23/58 , H01L29/06
CPC分类号： H01L21/78 , G01R1/0483 , G01R31/2863 , G01R31/2886 , H01L23/3114 , H01L23/3171 , H01L23/585 , H01L29/0657 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/13022 , H01L2224/16 , H01L2924/00014 , H01L2924/0002 , H01L2924/01079 , H01L2924/10253 , H01L2924/00 , H01L2224/05552
摘要： Chipping of semiconductor chips is to be prevented. A semiconductor device comprises a semiconductor chip having a main surface, a plurality of pads formed over the main surface, a rearrangement wiring formed over the main surface to alter an arrangement of the plurality of pads, and a protective film and an insulating film formed over the main surface, and a plurality of solder bumps each connected to the rearrangement wiring and arranged differently from the plurality of pads. The presence of a bevel cut surface obliquely continuous to the main surface and formed on a periphery of the main surface of the semiconductor chip prevents chipping.
摘要翻译：要防止半导体芯片的碎裂。半导体器件包括具有主表面的半导体芯片，在主表面上形成的多个焊盘，在主表面上形成的改变布线以改变多个焊盘的布置的重排布线，以及形成在多个焊盘上的保护膜和绝缘膜主表面和多个焊料凸块，每个焊料凸块连接到重排布线并且与多个焊盘不同的布置。形成在半导体芯片的主表面的周边上的与主表面倾斜连续的斜切面的存在防止了切屑。

59. 发明授权

US5224492A Thermotherapy apparatus 失效
标题翻译：热疗仪
公开(公告)号：US5224492A
公开(公告)日：1993-07-06
申请号：US713358
申请日：1991-06-11
申请人： Noriyuki Takahashi , Tamaki Sakamoto , Jun Shimoyama , Eiji Kasai , Makoto Saito , Jin-ichi Matsuda , Kazuo Kato
发明人： Noriyuki Takahashi , Tamaki Sakamoto , Jun Shimoyama , Eiji Kasai , Makoto Saito , Jin-ichi Matsuda , Kazuo Kato
IPC分类号： A61B5/00 , A61N1/08 , A61N1/40
CPC分类号： A61B5/417 , A61B5/015 , A61N1/08 , A61N1/403
摘要： In a CT image of a living body, contours of internal organs thereof are discriminated. Parameters are beforehand stored in a memory for a plurality of internal organs of the living body. Applicators are attached onto the living body and then a high frequency power is applied to electrodes disposed therein so as to heat an internal portion of the body. Based on an intensity of an electric field generated in the body due to the applied power and the parameters stored in the memory, a temperature distribution on the CT image is estimated. To retain an estimated temperature of an objective tumor at a predetermined target temperature, the high frequency power and the cooling water in the applicators are controlled. In the estimation of the temperature distribution, the parameters of the living body are repeatedly corrected to minimize a discrepancy between a temperature measured at a preset position and an estimated temperature associated therewith.
摘要翻译：在活体的CT图像中，鉴别其内脏的轮廓。参数预先存储在生物体的多个内部器官的存储器中。施加器附着在活体上，然后将高频电力施加到设置在其中的电极，以加热身体的内部。基于由于所施加的功率和存储在存储器中的参数而在体内产生的电场的强度，估计CT图像上的温度分布。为了将目标肿瘤的估计温度保持在预定目标温度，控制施加器中的高频功率和冷却水。在估计温度分布时，重复校正生物体的参数，以使在预设位置测量的温度与与其相关联的估计温度之间的差异最小化。

60. 发明授权

US5185887A Database generation management method and system 失效
标题翻译：数据库生成管理方法和系统
公开(公告)号：US5185887A
公开(公告)日：1993-02-09
申请号：US547512
申请日：1990-07-02
申请人： Noriyuki Takahashi , Kazunori Nishizawa , Rinichi Takashi , Naofumi Sakai , Yukiharu Tanabe , Nobuhiro Yasue
发明人： Noriyuki Takahashi , Kazunori Nishizawa , Rinichi Takashi , Naofumi Sakai , Yukiharu Tanabe , Nobuhiro Yasue
IPC分类号： G06F17/30
CPC分类号： G06F17/30286 , Y10S707/99954
摘要： In a data-base system including a data-base management system, a dictionary device for managing definition information and generation management information in a data base, and a dictionary file for storing the generation management information, a generation management system is provided between the data-base management system and a data storage file to acquire data in accordance with the generation management information, the dictionary device is made independent of the data-base management system and connected to an input/output device, the dictionary file and the data-base management system, new or update generation management information is registered in the dictionary file by means of the dictionary device when the new or update generation information classified for each item is designated through the input/output device while the timing for acquiring the generation information is designated suitably, and the data-base management system is operated to issue a data-base output request to the generation management system based on the generation management information registered in the dictionary file to thereby make the generation management system read out data from the data base in accordance with the registered generation management information to supply the read-out data to the designated data storage file.
摘要翻译：在包括数据库管理系统的数据库系统，用于管理数据库中的定义信息和生成管理信息的字典装置，以及存储生成管理信息的字典文件的情况下，在数据库管理系统基础管理系统和数据存储文件，以根据生成管理信息采集数据，字典装置独立于数据库管理系统，并连接到输入/输出装置，字典文件和数据库当通过输入/输出设备指定针对每个项目分类的新的或更新生成信息时，管理系统，新的或更新生成管理信息通过字典设备登记在字典文件中，同时指定用于获取生成信息的定时适当地，数据库管理系统被操作以发布数据库输出请求根据登记在字典文件中的生成管理信息，生成管理系统，从而使生成管理系统根据注册的生成管理信息从数据库读出数据，以将读出的数据提供给指定的数据存储文件。

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