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    • 53. 发明申请
    • Flash memory cell and method of manufacturing the same and programming/erasing/reading method of flash memory cell
    • 闪存单元及其制造方法和闪存单元的编程/擦除/读取方法
    • US20050121712A1
    • 2005-06-09
    • US11040969
    • 2005-01-21
    • Sung ParkYoung YouYong KimYoo Jeon
    • Sung ParkYoung YouYong KimYoo Jeon
    • G11C11/56G11C16/02G11C16/04H01L21/8247H01L27/115H01L29/788H01L29/792H01L21/336H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L27/11521G11C11/5628G11C11/5635G11C11/5642G11C16/0458G11C2211/5612H01L27/115H01L29/7887
    • Disclosed is a flash memory cell and method of manufacturing the same, and programming/erasing/reading method thereof. The flash memory cell comprises a first tunnel oxide film formed at a given region of a semiconductor substrate, a first floating gate formed on the first tunnel oxide film, a second tunnel oxide film formed over the semiconductor substrate and along one sidewall of the first floating gate, a second floating g ate isolated from the first floating gate while contacting the second tunnel oxide film, a dielectric film formed on the first floating gate and the second floating gate, a control gate formed on the dielectric film, a first junction region formed in the semiconductor substrate below one side of the second tunnel oxide film, and a second junction region formed in the semiconductor substrate below one side of the first tunnel oxide film. Therefore, the present invention can implement 2-bit cell or 3-bit cell of a high density using the existing process technology. Further, it can reduce the manufacture cost and implement a high-integrated flash memory cell that is advantageous than a conventional flash memory cell in view of charge storage/retention as well as programming time.
    • 公开了一种闪存单元及其制造方法及其编程/擦除/读取方法。 闪速存储单元包括形成在半导体衬底的给定区域的第一隧道氧化物膜,形成在第一隧道氧化物膜上的第一浮栅,形成在半导体衬底上并沿着第一浮置区的一个侧壁的第二隧道氧化膜 栅极,与第一沟槽氧化膜接触时与第一浮栅隔离的第二浮置栅极,形成在第一浮置栅极和第二浮置栅极上的电介质膜,形成在电介质膜上的控制栅极,形成的第一结区域 在第二隧道氧化膜的一侧以下的半导体衬底中形成的第二结区,以及形成在第一隧道氧化膜的一侧以下的半导体衬底中的第二结区。 因此,本发明可以使用现有的工艺技术来实现高密度的2比特单元或3比特单元。 此外,鉴于电荷存储/保持以及编程时间,它可以降低制造成本并实现比传统闪存单元有利的高集成闪存单元。