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51. 发明申请

US20130119492A1 Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method 有权
标题翻译：包含MEMS和ASIC的微型电气元件和生产方法
公开(公告)号：US20130119492A1
公开(公告)日：2013-05-16
申请号：US13520923
申请日：2011-01-24
申请人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
发明人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81C1/00238 , B81C1/00309 , G01L9/0073 , H01L23/10 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16145 , H01L2224/16146 , H01L2224/27438 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/73203 , H01L2224/81801 , H01L2224/8185 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/01029 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/163 , H01L2924/181 , H04R19/04 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00
摘要： The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
摘要翻译：本发明涉及包括MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片设置在彼此的顶部; MEMS芯片和ASIC芯片的内部安装通过MEMS芯片或ASIC芯片的通孔连接到电气部件的外部电气端子。

52. 发明授权

US08404516B2 Method for producing a MEMS package 有权
标题翻译： MEMS封装的制造方法
公开(公告)号：US08404516B2
公开(公告)日：2013-03-26
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译：载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔。

53. 发明授权

US08169041B2 MEMS package and method for the production thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US08169041B2
公开(公告)日：2012-05-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

54. 发明授权

US08098001B2 Component with reduced temperature response, and method for production 有权
标题翻译：降低温度响应的组分和生产方法
公开(公告)号：US08098001B2
公开(公告)日：2012-01-17
申请号：US12700446
申请日：2010-02-04
申请人： Wolfgang Pahl , Hans Krueger , Werner Ruile
发明人： Wolfgang Pahl , Hans Krueger , Werner Ruile
IPC分类号： H01L41/08
CPC分类号： H03H9/02834 , H03H9/02574 , Y10T29/42
摘要： A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.
摘要翻译：组件具有衬底和补偿层。基板的下表面机械地牢固地连接到补偿层。衬底的下表面和补偿层的上表面具有形貌。

55. 发明授权

US07544540B2 Encapsulated electrical component and production method 有权
标题翻译：封装电气元件及生产方法
公开(公告)号：US07544540B2
公开(公告)日：2009-06-09
申请号：US11578854
申请日：2005-04-21
申请人： Christian Bauer , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/44
CPC分类号： H01L21/44 , B81C1/0023 , H01L2224/16225 , H03H3/0072 , H03H9/1057
摘要： A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
摘要翻译：微电子机械系统（MEMS）部件包括面板，具有包含有源部件结构的底部的芯片，其中芯片通过凸块安装在面板上，框架结构在面板上并且包围芯片的安装位置以及在框架结构和芯片之间封闭接缝的喷墨印刷结构。喷墨印刷结构具有在芯片的下边缘上方的上边缘。

56. 发明申请

US20080048317A1 Electric Component With A Flip-Chip Construction 有权
标题翻译：具有倒装芯片结构的电气部件
公开(公告)号：US20080048317A1
公开(公告)日：2008-02-28
申请号：US11659146
申请日：2005-06-08
申请人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
发明人： Hans Krueger , Karl Nicolaus , Juergen Portmann , Peter Selmeier
IPC分类号： H01L21/60
CPC分类号： H01L23/49838 , H01L23/50 , H01L23/562 , H01L24/14 , H01L24/73 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10135 , H01L2224/14132 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.
摘要翻译：一种组件包括具有热膨胀系数α载体的载体衬底和通过多个凸块安装在载体衬底上的芯片。该芯片在第一方向x 1上具有第一热膨胀系数α1，并且第一膨胀差Δalpha1等于绝对值 αα-α1的值。芯片还具有在第二方向x 2 2上的第二热膨胀系数α2 2和第二膨胀差Δα2 2等于 α2α2的绝对值。凸块被布置成使得与第一方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x的轴线上的第一距离Deltax 1 小于与第二方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x 2的轴线的第二距离。

57. 发明授权

US07259041B2 Method for the hermetic encapsulation of a component 有权
标题翻译：组件气密封装的方法
公开(公告)号：US07259041B2
公开(公告)日：2007-08-21
申请号：US10500279
申请日：2002-12-18
申请人： Alois Stelzl , Hans Krueger , Ernst Christl
发明人： Alois Stelzl , Hans Krueger , Ernst Christl
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/552
CPC分类号： H03H9/1078 , H01L21/561 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/15174 , H01L2224/81 , H01L2924/00
摘要： For hermetic encapsulation of a component, which includes a chip with component structures applied on a substrate in a flip-chip construction, a material is applied onto the lower edge of the chip and regions of the substrate abutting the chip, and then a first continuous metal layer is applied on the back side of the chip and on the material, as well as on edge regions of the substrate abutting the material. For hermetic encapsulation, a second sealing metal layer is subsequently applied by a solvent-free process at least on those regions of the first metal layer that cover the material.
摘要翻译：对于包括具有以倒装芯片结构施加在基板上的部件结构的芯片的部件的气密封装，将材料施加到芯片的下边缘和邻接芯片的基板的区域，然后施加第一连续金属层被施加在芯片的背面和材料上，以及与衬底邻接的材料的边缘区域上。为了气密封装，随后通过无溶剂工艺至少在覆盖材料的第一金属层的那些区域上施加第二密封金属层。

58. 发明授权

US4291947A Process for making a liquid crystal cell 失效
标题翻译：制造液晶盒的方法
公开(公告)号：US4291947A
公开(公告)日：1981-09-29
申请号：US40040
申请日：1979-05-17
申请人： Werner Cirkler , Hans Krueger
发明人： Werner Cirkler , Hans Krueger
IPC分类号： G09F9/30 , G02F1/1333 , G02F1/1343 , G02F1/133
CPC分类号： G02F1/13439 , Y10S359/90
摘要： A liquid crystal cell having a pair of carrier plates spaced apart to form a chamber for receiving a layer of liquid crystal material, each of the carrier plates having an electrical conductive coating or layer forming the electrodes on the surface facing the chamber with the surface of the electrodes being flush with the surface of an insulating material. The insulating material may be an additional layer of material disposed with the electrical conductive coating on the carrier plate or may be the carrier plate with the conductive coating being placed in recesses which have a depth equal to the thickness of the conductive coating. To form the recesses, a mask is applied to the surface of the carrier plate which is then etched, a conductive coating is applied on the remaining portions of the mask and in the recesses and then the mask is stripped with the coating thereon. When the coating and an insulating coating are applied on the carrier plate, a coating of electrical conductive material is applied on the surface of the carrier plate, a mask is applied, those portions of the coating which are not necessary to form the electrode structure are removed, a second coating of insulating material is applied in the areas where the electrical conductive coating was removed and then the mask is removed with the portion of the coating disposed thereon.
摘要翻译：一种液晶单元，其具有间隔开的一对载体板，以形成用于接收液晶材料层的腔室，每个载体板具有导电涂层或层，所述导电涂层或层在面向腔室的表面上形成电极，电极与绝缘材料的表面齐平。绝缘材料可以是在载体板上设置有导电涂层的附加材料层，或者可以是载体板，其中导电涂层被放置在具有等于导电涂层的厚度的深度的凹槽中。为了形成凹部，将掩模施加到载体板的表面，然后将其蚀刻，在掩模的其余部分和凹部中施加导电涂层，然后用其上的涂层剥离掩模。当涂层和绝缘涂层施加在载体板上时，将导电材料涂层施加在载体板的表面上，施加掩模，涂层的不需要形成电极结构的那些部分是去除，在除去导电涂层的区域中施加绝缘材料的第二涂层，然后用设置在其上的涂层部分去除掩模。

59. 发明授权

US4256377A Process for producing homeotropic orientation layers for liquid crystal devices and the resultant liquid crystal devices 失效
标题翻译：用于制造液晶装置的垂直取向层和所得液晶装置的方法
公开(公告)号：US4256377A
公开(公告)日：1981-03-17
申请号：US907003
申请日：1978-05-18
申请人： Hans Krueger , Hans Pink
发明人： Hans Krueger , Hans Pink
IPC分类号： G02F1/1337 , G02F1/13
CPC分类号： G02F1/133719 , Y10S359/90
摘要： A homeotropic orientation layer for a liquid crystal cell is produced by forming an organic liquid solution containing a suitable amount of Si and Me to provide a necessary ratio of such elements to correspond to a chemical composition defined by the formula:(Me.sub.2 O.sub.3).sub.1-x (SiO.sub.y).sub.xwherein Me is an element selected from the group consisting of Al and Cr, x is a numeral at least equal to 0 and smaller than 1, and y is a numeral at least equal to 1.9 and not more than 2; applying a layer of such organic solution onto at least one face of a liquid crystal cell substrate, which may have a conductive layer thereon, and transferring such layer of organic solution into a solid homeotropically orientating layer by thermal decomposition of the organic solution, as by heating the solution-coated substrate at a temperature in the range of about 100.degree. to 550.degree. C. for a period of time ranging from about 10 to 30 minutes.
摘要翻译：通过形成含有适当量的Si和Me的有机液体溶液来制备液晶单元的垂直取向层，以提供这样的元素所需的比例，以符合由下式定义的化学组成：（Me 2 O 3）1-x （SiO y）x其中Me是选自Al和Cr的元素，x是至少等于0且小于1的数，y是至少等于1.9且不大于2的数字; 将这样的有机溶液层施加到可以在其上具有导电层的液晶单元基板的至少一个表面上，并且通过有机溶液的热分解将这种有机溶液层转移到固体垂直取向层中，如通过在约100℃至550℃的温度范围内将溶液涂覆的基材加热约10至30分钟的时间。

60. 发明授权

US4248502A Electro-optical liquid crystal display device 失效
标题翻译：电光液晶显示装置
公开(公告)号：US4248502A
公开(公告)日：1981-02-03
申请号：US47745
申请日：1979-06-12
申请人： Martin Bechteler , Hans Krueger
发明人： Martin Bechteler , Hans Krueger
IPC分类号： G02F1/133 , G02F1/1335 , G02F1/1337 , G02F1/13
CPC分类号： G02F1/1337 , G02F1/133502
摘要： An electro-optical display device particularly a liquid crystal display device having a pair of carrier plates spaced apart to form a cavity with each of the carrier plates on a surface facing the cavity being provided with an electrically conductive layer covered by a dielectric layer with the device having the medium, which may be the liquid crystal layer and is switchable between two optically different states, disposed in the cavity, characterized by the conductive layer having a thickness d.sub.1 and an index of refraction n.sub.1 and each of the dielectric layers having a thickness d.sub.2 and a refractive index n.sub.2 with the thickness having a range of 0.5 d.sub.1 .ltoreq.d.sub.1 .ltoreq.1.5 d.sub.1 and 0.5 d.sub.2 .ltoreq.d.sub.2 .ltoreq.1.5 d.sub.2, wherein ##EQU1## with .lambda. being the mean free wavelength of the operating light, ##EQU2## with n.sub.o being the index of refraction of the carrier plate and n.sub.3 being the index of refraction of the liquid crystal layer in the idle state.
摘要翻译：一种电光显示装置，特别是一种液晶显示装置，其具有间隔开以形成空腔的一对载体板，每个承载板在面向空腔的表面上设置有由介电层覆盖的导电层，具有介质的装置，其可以是液晶层并且可设置在空腔中的两种光学不同状态之间，其特征在于，导电层具有厚度d1和折射率n1，并且每个电介质层具有厚度 d2和折射率n2，其厚度为0.5d1 / d1 = 1.5d1和0.5d2 ，不是载板的折射率，n3是处于空闲状态的液晶层的折射率。

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