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1. 发明授权

US4256377A Process for producing homeotropic orientation layers for liquid crystal devices and the resultant liquid crystal devices 失效
标题翻译：用于制造液晶装置的垂直取向层和所得液晶装置的方法
公开(公告)号：US4256377A
公开(公告)日：1981-03-17
申请号：US907003
申请日：1978-05-18
申请人： Hans Krueger , Hans Pink
发明人： Hans Krueger , Hans Pink
IPC分类号： G02F1/1337 , G02F1/13
CPC分类号： G02F1/133719 , Y10S359/90
摘要： A homeotropic orientation layer for a liquid crystal cell is produced by forming an organic liquid solution containing a suitable amount of Si and Me to provide a necessary ratio of such elements to correspond to a chemical composition defined by the formula:(Me.sub.2 O.sub.3).sub.1-x (SiO.sub.y).sub.xwherein Me is an element selected from the group consisting of Al and Cr, x is a numeral at least equal to 0 and smaller than 1, and y is a numeral at least equal to 1.9 and not more than 2; applying a layer of such organic solution onto at least one face of a liquid crystal cell substrate, which may have a conductive layer thereon, and transferring such layer of organic solution into a solid homeotropically orientating layer by thermal decomposition of the organic solution, as by heating the solution-coated substrate at a temperature in the range of about 100.degree. to 550.degree. C. for a period of time ranging from about 10 to 30 minutes.
摘要翻译：通过形成含有适当量的Si和Me的有机液体溶液来制备液晶单元的垂直取向层，以提供这样的元素所需的比例，以符合由下式定义的化学组成：（Me 2 O 3）1-x （SiO y）x其中Me是选自Al和Cr的元素，x是至少等于0且小于1的数，y是至少等于1.9且不大于2的数字; 将这样的有机溶液层施加到可以在其上具有导电层的液晶单元基板的至少一个表面上，并且通过有机溶液的热分解将这种有机溶液层转移到固体垂直取向层中，如通过在约100℃至550℃的温度范围内将溶液涂覆的基材加热约10至30分钟的时间。

2. 发明授权

US08432007B2 MEMS package and method for the production thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US08432007B2
公开(公告)日：2013-04-30
申请号：US13075936
申请日：2011-03-30
申请人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
发明人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

3. 发明申请

US20110233690A1 SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING METHOD 有权
标题翻译：具有传感器芯片和制造方法的半导体芯片布置
公开(公告)号：US20110233690A1
公开(公告)日：2011-09-29
申请号：US12999421
申请日：2009-06-16
申请人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
发明人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
IPC分类号： H01L27/02 , H01L21/58
CPC分类号： G01L19/141 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/00
摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
摘要翻译：在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。

4. 发明申请

US20110186943A1 MEMS Package and Method for the Production Thereof 有权
标题翻译： MEMS封装及其制造方法
公开(公告)号：US20110186943A1
公开(公告)日：2011-08-04
申请号：US13075936
申请日：2011-03-30
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译：本文描述了微机电系统（MEMS）封装。封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。

5. 发明申请

US20100148285A1 MEMS Component and Method for Production 有权
标题翻译： MEMS组件和生产方法
公开(公告)号：US20100148285A1
公开(公告)日：2010-06-17
申请号：US12642357
申请日：2009-12-18
申请人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
IPC分类号： H01L29/84 , H01L21/3205
CPC分类号： H03H9/02866 , H03H9/14538
摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.
摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

6. 发明申请

US20100127377A1 Method for Producing a MEMS Package 有权
标题翻译：制造MEMS封装的方法
公开(公告)号：US20100127377A1
公开(公告)日：2010-05-27
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L23/485 , H01L21/98
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译：载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔。

7. 发明授权

US07388281B2 Encapsulated electronic component and production method 有权
标题翻译：封装电子元器件及生产方法
公开(公告)号：US07388281B2
公开(公告)日：2008-06-17
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译：本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。芯片的封装是用密封或介电层完成的。由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。

8. 发明申请

US20070222056A1 Encapsulated Electrical Component and Production Method 有权
标题翻译：封装电气元件及生产方法
公开(公告)号：US20070222056A1
公开(公告)日：2007-09-27
申请号：US11578854
申请日：2005-04-21
申请人： Christian Bauer , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Alois Stelzl
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H01L21/44 , B81C1/0023 , H01L2224/16225 , H03H3/0072 , H03H9/1057
摘要： A micro-electro-mechanical systems (MEMS) component includes a panel, a chip having an underside containing active component structures, where the chip is mounted on the panel via bumps, a frame structure on the panel and enclosing an installation site of the chip, and a jet-printed structure closing a seam between frame structure and chip. The jet-printed structure has an upper edge that is above a lower edge of the chip.
摘要翻译：微电子机械系统（MEMS）部件包括面板，具有包含有源部件结构的底部的芯片，其中芯片通过凸块安装在面板上，框架结构在面板上并且包围芯片的安装位置以及在框架结构和芯片之间封闭接缝的喷墨印刷结构。喷墨印刷结构具有在芯片的下边缘上方的上边缘。

9. 发明申请

US20060151203A1 Encapsulated electronic component and production method 有权
标题翻译：封装电子元器件及生产方法
公开(公告)号：US20060151203A1
公开(公告)日：2006-07-13
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
IPC分类号： H01L23/31 , H05K3/30 , H01L23/48 , H05K1/18
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译：本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。芯片的封装是用密封或介电层完成的。由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。

10. 发明授权

US5293573A Stripline laser including electrically conducting mirror 失效
标题翻译：带状激光器包括导电镜
公开(公告)号：US5293573A
公开(公告)日：1994-03-08
申请号：US950061
申请日：1992-09-23
申请人： Wolfgang Welsch , Hans Krueger
发明人： Wolfgang Welsch , Hans Krueger
IPC分类号： H01S3/038 , H01S3/03 , H01S3/0975 , H01S3/097
CPC分类号： H01S3/0315
摘要： A stripline laser wherein the distance between a mirror and a stripline is minimized without modifying the characteristics of the laser is provided. The stripline laser prevents damaging of the mirror due to plasma discharge by providing at least two insulating strips arranged between oppositely polarized electrodes. Electrically conductive paths lie between the insulating strips. The insulating strips are arranged to guarantee a voltage division. The voltage division maintains the voltage of the electrically conductive path neighboring the mirror below a plasma-maintaining voltage.
摘要翻译：提供了一种带状线激光器，其中在不改变激光器的特性的情况下，使反射镜和带状线之间的距离最小化。带状线激光器通过提供布置在相对极化的电极之间的至少两个绝缘带，防止由于等离子体放电而导致的镜子损坏。导电路径位于绝缘条之间。绝缘条布置成保证分压。电压分压保持与反射镜相邻的导电路径的电压低于等离子体维持电压。

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