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51. 发明申请

US20080015768A1 Driving force control unit for a vehicle 有权
标题翻译：用于车辆的驱动力控制单元
公开(公告)号：US20080015768A1
公开(公告)日：2008-01-17
申请号：US11783268
申请日：2007-04-06
申请人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
发明人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Atsushi Atake , Kouji Kaneda , Tatsuru Fukuda , Minoru Yuki , Masayuki Ushiki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
IPC分类号： G06F19/00
CPC分类号： B60W30/182 , B60W2540/04 , Y10T477/30 , Y10T477/33 , Y10T477/60 , Y10T477/675 , Y10T477/688
摘要： The driving force control unit for a vehicle comprises a plurality of control modes for controlling a driving force, each of control modes having each driving force characteristic, a vehicle driving condition detecting unit for detecting a vehicle driving condition, a selector for selecting one control mode from the control modes, a temporary selector for changing the current mode to other mode, and a driving force indication value setting unit for setting a driving force indication value according to the vehicle driving condition and the driving force characteristic corresponding to the selected mode by the selector or the temporary selector.
摘要翻译：用于车辆的驱动力控制单元包括用于控制驱动力的多个控制模式，每个控制模式具有每个驱动力特性，用于检测车辆驾驶状况的车辆驾驶状况检测单元，用于选择一个控制模式的选择器从所述控制模式，将用于将所述当前模式改变为其他模式的临时选择器，以及驱动力指示值设定单元，用于根据所述车辆行驶条件和对应于所选择的模式的驱动力特性来设定驱动力指示值选择器或临时选择器。

52. 发明申请

US20070247291A1 Vehicle display device 有权
标题翻译：车载显示装置
公开(公告)号：US20070247291A1
公开(公告)日：2007-10-25
申请号：US11783111
申请日：2007-04-05
申请人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Kouji Kaneda , Atsushi Atake , Tatsuru Fukuda , Masayuki Ushiki , Minoru Yuki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
发明人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Kouji Kaneda , Atsushi Atake , Tatsuru Fukuda , Masayuki Ushiki , Minoru Yuki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
IPC分类号： B60Q1/00 , B60T7/12
CPC分类号： F02D11/105 , B60K2350/1092 , F02D2200/604 , Y02T10/84
摘要： The present invention provides a vehicle display device which can display fuel consumption information of a vehicle in a useful and optimum mode for a driver. A meter_EUC calculates an instantaneous fuel consumption of a vehicle based on a mileage and a fuel injection quantity within a set time, calculates an average fuel consumption of the vehicle based on respective cumulative values of the mileage and the fuel injection quantity repeatedly calculated for every set time, and displays the deviation of the instantaneous fuel consumption with respect to the average fuel consumption as fuel consumption information on a fuel consumption meter. The display on the fuel consumption meter is performed by swinging a pointer with respect to a neutral position. When the deviation takes a positive value, the pointer is swung in the pulse direction with a swinging width corresponding to the deviation quantity, while when the deviation takes a negative value, the pointer is swung in the minus direction with a swinging width corresponding to the deviation quantity.
摘要翻译：本发明提供一种能够以驾驶员的有用且最佳模式显示车辆的燃料消耗信息的车辆显示装置。根据在设定时间内的里程和燃料喷射量计算车辆的瞬时燃料消耗量，根据对于每一组重复计算的里程和燃料喷射量的累计值，计算出车辆的平均燃料消耗量时间，并且将相对于平均燃料消耗的瞬时燃料消耗的偏差显示为燃料消耗计量器上的燃料消耗信息。通过相对于中立位置摆动指针来执行燃料消耗计的显示。当偏差为正值时，指针以对应于偏差量的摆动宽度在脉冲方向上摆动，而当偏差为负值时，指针以负方向摆动，摆动宽度对应于偏差量。

53. 发明授权

US07169254B2 Plasma processing system and apparatus and a sample processing method 有权
标题翻译：等离子体处理系统和设备及样品处理方法
公开(公告)号：US07169254B2
公开(公告)日：2007-01-30
申请号：US10732285
申请日：2003-12-11
申请人： Toshio Masuda , Tatehito Usui , Mitsuru Suehiro , Hiroshi Kanekiyo , Hideyuki Yamamoto , Kazue Takahashi , Hiromichi Enami
发明人： Toshio Masuda , Tatehito Usui , Mitsuru Suehiro , Hiroshi Kanekiyo , Hideyuki Yamamoto , Kazue Takahashi , Hiromichi Enami
IPC分类号： H01L21/00 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67069 , G01N21/68 , H01J37/32082 , H01J37/32935 , H01J37/32972
摘要： A plasma processing apparatus having a sample stage disposed inside a vacuum chamber and a plate member disposed opposing to a sample which is placed on the sample stage and supplied with electric power. The sample is processed using a plasma generated between the sample stage and the plate member and a measuring port is disposed at a back side of the plate member. The measuring port includes an optical transmitter which receives light from a surface of the sample, and a seal which vacuum-seals between an atmospheric side and vacuum side of the vacuum chamber.
摘要翻译：一种等离子体处理装置，其具有设置在真空室内的样品台和与放置在样品台上并提供电力的样品相对设置的板构件。使用在样品台和板构件之间产生的等离子体处理样品，并且测量端口设置在板构件的后侧。测量端口包括从样品表面接收光的光发射器，以及在真空室的大气侧和真空侧之间进行真空密封的密封件。

54. 发明申请

US20060157449A1 Plasma processing apparatus and a plasma processing method 审中-公开
标题翻译：等离子体处理装置和等离子体处理方法
公开(公告)号：US20060157449A1
公开(公告)日：2006-07-20
申请号：US11348300
申请日：2006-02-07
申请人： Kazue Takahashi , Toshio Masuda , Tetsunori Kaji , Ken'etsu Yokogawa
发明人： Kazue Takahashi , Toshio Masuda , Tetsunori Kaji , Ken'etsu Yokogawa
IPC分类号： G01L21/30 , C23F1/00
CPC分类号： H01J37/32522 , H01J37/32192 , H01J37/32678 , H01L21/31116
摘要： In an oxide film etching process, a plasma having a suitable ratio of CF3, CF2, CF, and F is necessary, and there is a problem in that the etching characteristic fluctuates in accordance with a temperature fluctuation of the etching chamber. Using a UHF type ECR plasma etching apparatus having a low electron temperature, a suitable dissociation can be obtained, and by maintaining the temperature of a side wall of the etching chamber in a range from 10° C. and 120° C., a stable etching characteristic can be obtained. Since oxide film etching using a low electron temperature and a high density plasma can be obtained, an etching result having a superior characteristic can be obtained, and, also, since the side wall temperature adjustment range is low, a simplified apparatus structure and a heat resistant performance countermeasure can be obtained easily.
摘要翻译：在氧化膜蚀刻工艺中，需要具有CF 3 N，CF 2，CF和F的合适比例的等离子体，并且存在的问题是，特性根据蚀刻室的温度波动而波动。使用具有低电子温度的UHF型ECR等离子体蚀刻装置，可以获得适当的解离，并且通过将蚀刻室的侧壁的温度保持在10℃和120℃的范围内，稳定的可以获得蚀刻特性。由于可以获得使用低电子温度和高密度等离子体的氧化膜蚀刻，因此可以获得具有优异特性的蚀刻结果，并且由于侧壁温度调节范围低，因此简化的装置结构和热可以容易地获得耐性性能对策。

55. 发明申请

US20060124243A1 Disturbance-free, recipe-controlled plasma processing system and method 有权
公开(公告)号：US20060124243A1
公开(公告)日：2006-06-15
申请号：US11346298
申请日：2006-02-03
申请人： Akira Kagoshima , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda , Hiroyuki Kitsunai , Junichi Tanaka , Natsuyo Morioka , Kenji Tamaki
发明人： Akira Kagoshima , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda , Hiroyuki Kitsunai , Junichi Tanaka , Natsuyo Morioka , Kenji Tamaki
IPC分类号： C23F1/00 , H01L21/306
CPC分类号： H01L22/20 , G05B19/41875 , G05B2219/45031 , H01J37/32935 , H01L22/26 , Y02P90/20 , Y02P90/22
摘要： A plasma processing system includes a first unit for plasma-processing a sample based on a recipe for plasma processing, and a second unit for modifying the recipe in accordance with a monitored value obtained during the plasma processing of the sample in the first unit. A next sample is plasma processed in the first unit based on the modified recipe.

56. 发明授权

US07062347B2 Maintenance method and system for plasma processing apparatus 有权
公开(公告)号：US07062347B2
公开(公告)日：2006-06-13
申请号：US10434213
申请日：2003-05-09
申请人： Hideyuki Yamamoto , Toshio Masuda , Shoji Ikuhara , Akira Kagoshima , Junichi Tanaka
发明人： Hideyuki Yamamoto , Toshio Masuda , Shoji Ikuhara , Akira Kagoshima , Junichi Tanaka
IPC分类号： G06F19/00
CPC分类号： H01J37/32862 , H01J37/32935
摘要： For maintenance after wet cleaning of a plasma processing apparatus which processes a specimen in a vacuum processing chamber by using a plasma, when restoration processing after the wet cleaning of members configuring the vacuum processing chamber is performed with the vacuum processing chamber opened to the atmosphere, it is automatically or semiautomatically judged whether the restoration processing is appropriate or not according to a predetermined optimum sequence inherent in the apparatus, and the next processing is started automatically or semiautomatically according to the results.

57. 发明申请

US20050099684A1 Telescope main body and spotting scope 失效
标题翻译：望远镜主体和探测范围
公开(公告)号：US20050099684A1
公开(公告)日：2005-05-12
申请号：US10981788
申请日：2004-11-05
申请人： Makoto Mogamiya , Toshio Masuda
发明人： Makoto Mogamiya , Toshio Masuda
IPC分类号： G02B23/06 , G02B7/08 , G02B7/28 , G02B7/36 , G02B17/04 , G02B23/00 , G02B23/12 , H04N5/225 , H04N5/232
CPC分类号： G02B7/08 , G02B17/04 , G02B23/12 , H04N5/2254 , H04N5/23212 , H04N5/23293
摘要： A telescope main body, which is provided with an objective optical system, a focusing system, an imaging device, a beam splitter, and a correcting system that performs a correcting operation for correcting a position shift between an image forming position of an object image and a receiving surface of the imaging device caused by diopter variation of a user. The correcting system includes a focus driving system which relatively moves an image forming position of the object image with respect to the receiving surface, a focus detecting system which detects a status in which the image forming position coincides with the receiving surface, and a controller controlling the focus driving system. The controller has with a learning function of storing correction data of a preceding correcting operation so that the stored correction data of the preceding correcting operation is reflected in a subsequent correction operation.
摘要翻译：设置有物镜光学系统的望远镜主体，聚焦系统，成像装置，分束器和校正系统，其执行用于校正物体图像的图像形成位置与图像形成位置之间的位置偏移的校正操作由用户的屈光度变化引起的成像装置的接收表面。校正系统包括：相对于接收表面相对地移动对象图像的图像形成位置的对焦驱动系统;检测图像形成位置与接收面重合的状态的焦点检测系统;以及控制器重点驱动系统。控制器具有存储先前校正操作的校正数据的学习功能，使得存储的校正操作的校正数据反映在随后的校正操作中。

58. 发明申请

US20050022932A1 Disturbance-free, recipe-controlled plasma processing system and method 审中-公开
标题翻译：无干扰，配方控制等离子体处理系统和方法
公开(公告)号：US20050022932A1
公开(公告)日：2005-02-03
申请号：US10933413
申请日：2004-09-03
申请人： Akira Kagoshima , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda , Hiroyuki Kitsunai , Junichi Tanaka , Natsuyo Morioka , Kenji Tamaki
发明人： Akira Kagoshima , Hideyuki Yamamoto , Shoji Ikuhara , Toshio Masuda , Hiroyuki Kitsunai , Junichi Tanaka , Natsuyo Morioka , Kenji Tamaki
IPC分类号： H05H1/00 , B01J19/08 , H01J37/32 , H01L21/302 , H01L21/3065 , H01L21/66 , C23F1/00
CPC分类号： H01L22/20 , G05B19/41875 , G05B2219/45031 , H01J37/32935 , H01L22/26 , Y02P90/20 , Y02P90/22
摘要： A plasma processing control system for a plasma processing apparatus having a plasma processor for performing a plasma processing operation over a sample accommodated within a vacuum processing chamber, a sensor for monitoring process parameters during the processing operation, a unit for providing a processed-result estimation model which estimates a processed result on the basis of a monitored output from the sensor and a preset processed-result estimation equation, a unit for providing an optimum recipe calculation model which calculates corrections to the processing conditions so that the processed result becomes a target value on the basis of the estimated result of the processed-result estimation model, and a unit for causing the processing apparatus to process the sample under the optimum processing conditions in the next processing step on the basis of a recipe generated from the optimum recipe calculation model.
摘要翻译：一种用于等离子体处理装置的等离子体处理控制系统，其具有用于对容纳在真空处理室内的样品进行等离子体处理操作的等离子体处理装置，用于在处理操作期间监视处理参数的传感器，用于提供处理结果估计的单元模型，其基于来自传感器的监视输出和预设处理结果估计方程来估计处理结果;单元，用于提供最佳配方计算模型，其计算对处理条件的校正，使得处理结果变为目标值基于处理结果估计模型的估计结果，以及用于使处理装置根据从最佳配方计算模型生成的配方在下一个处理步骤中的最佳处理条件下处理样本的单元。

59. 发明授权

US06815365B2 Plasma etching apparatus and plasma etching method 失效
标题翻译：等离子体蚀刻装置和等离子体蚀刻方法
公开(公告)号：US06815365B2
公开(公告)日：2004-11-09
申请号：US09983946
申请日：2001-10-26
申请人： Toshio Masuda , Kazue Takahashi , Mitsuru Suehiro , Tetsunori Kaji , Saburo Kanai
发明人： Toshio Masuda , Kazue Takahashi , Mitsuru Suehiro , Tetsunori Kaji , Saburo Kanai
IPC分类号： H01L21302
CPC分类号： H01J37/32504 , H01J37/32522 , H01J2237/022 , H01L21/3065 , H01L21/67069 , H01L21/67109 , H01L21/6831
摘要： A plasma etching method for etching a sample within an etching chamber having a sidewall, an exchangeable jacket which is held inside of the sidewall, and a heating mechanism proximate to top end of the exchangeable jacket for generating heat which radiates towards an inside of the etching chamber. The plasma etching method further including a step of evacuating the etching chamber by an evacuation system, a step of supplying an etching gas into the etching chamber, a step of generating a plasma for performing etching of the sample in the etching chamber, and a step of conducting a heating operation by the heating mechanism during an initial stage of the step of generating a plasma.
摘要翻译：一种用于蚀刻在具有侧壁的蚀刻室内的样品的等离子体蚀刻方法，保持在侧壁内侧的可更换夹套，以及靠近可更换护套顶端的加热机构，用于产生朝向蚀刻内部辐射的热量房间。等离子体蚀刻方法还包括通过抽气系统对蚀刻室进行排气的步骤，向蚀刻室供给蚀刻气体的步骤，产生用于在蚀刻室中进行蚀刻的等离子体的工序，以及工序在产生等离子体的步骤的初始阶段期间通过加热机构进行加热操作。

60. 发明授权

US06745096B2 Maintenance method and system for plasma processing apparatus etching and apparatus 有权
标题翻译：等离子体处理设备蚀刻和设备的维护方法和系统
公开(公告)号：US06745096B2
公开(公告)日：2004-06-01
申请号：US09946621
申请日：2001-09-06
申请人： Hideyuki Yamamoto , Toshio Masuda , Shoji Ikuhara , Akira Kagoshima , Junichi Tanaka
发明人： Hideyuki Yamamoto , Toshio Masuda , Shoji Ikuhara , Akira Kagoshima , Junichi Tanaka
IPC分类号： G06F1900
CPC分类号： H01J37/32862 , H01J37/32935
摘要： For maintenance after wet cleaning of a plasma processing apparatus which processes a specimen in a vacuum processing chamber by using a plasma, when restoration processing after the wet cleaning of members configuring the vacuum processing chamber is performed with the vacuum processing chamber opened to the atmosphere, it is automatically or semiautomatically judged whether the restoration processing is appropriate or not according to a predetermined optimum sequence inherent in the apparatus, and the next processing is started automatically or semiautomatically according to the results.
摘要翻译：为了在通过使用等离子体处理真空处理室中的样品的等离子体处理装置进行湿式清洗之后进行维护，当对真空处理室构成的构件进行湿式清洗之后的恢复处理是在对大气开放的真空处理室的情况下进行的，根据设备固有的预定最佳顺序，自动或半自动判断恢复处理是否合适，根据结果自动或半自动地开始下一个处理。

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