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51. 发明授权

US5868847A Clamp ring for shielding a substrate during film layer deposition 失效
标题翻译：用于在膜层沉积期间屏蔽衬底的夹环
公开(公告)号：US5868847A
公开(公告)日：1999-02-09
申请号：US358161
申请日：1994-12-16
申请人： Aihua Chen , Zheng Xu , Howard Grunes , Avi Tepman , Igor Kogan
发明人： Aihua Chen , Zheng Xu , Howard Grunes , Avi Tepman , Igor Kogan
IPC分类号： C23C14/50 , C23C16/458 , H01L21/20 , H01L21/203 , H01L21/205 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68721 , C23C14/50 , C23C16/4585
摘要： A chamber for depositing a film layer on a substrate includes a support member on which the substrate is positioned for processing in the chamber, and a clamp ring suspended in the chamber on a chamber shield. The support member is positionable in the chamber to receive a substrate thereon, and further positionable to pass the substrate through the shield and thereby lift the clamp ring off the shield. After deposition is complete, the support member retracts through the shield, to reposition the clamp on the shield. In the event that a deposition material layer has formed between the substrate and the clamp ring, the clamp ring includes a plurality of actuators thereon which force the substrate out of the clamp ring as the clamp ring is repositioned on the shield.
摘要翻译：用于在衬底上沉积膜层的腔室包括支撑构件，衬底被定位在其上用于在腔室中进行处理，以及在室屏蔽罩上悬挂在腔室中的夹紧环。支撑构件可定位在腔室中以在其上接收衬底，并且还可定位成使衬底穿过屏蔽件，从而将夹紧环提离屏蔽。沉积完成后，支撑构件通过屏蔽件缩回，以将夹具重新定位在屏蔽上。在衬底和夹紧环之间形成沉积材料层的情况下，夹紧环包括多个致动器，当钳位环重新定位在屏蔽上时，该致动器迫使衬底离开夹紧环。

52. 外观设计

USD400511S Magnet structure for a conical target 失效
公开(公告)号：USD400511S
公开(公告)日：1998-11-03
申请号：US52010
申请日：1996-03-21
申请人： Avi Tepman
设计人： Avi Tepman

53. 发明授权

US5746875A Gas injection slit nozzle for a plasma process reactor 失效
标题翻译：用于等离子体处理反应器的气体注入狭缝喷嘴
公开(公告)号：US5746875A
公开(公告)日：1998-05-05
申请号：US551881
申请日：1995-10-16
申请人： Dan Maydan , Steve S. Y. Mak , Donald Olgado , Gerald Zheyao Yin , Timothy D. Driscoll , James S. Papanu , Avi Tepman
发明人： Dan Maydan , Steve S. Y. Mak , Donald Olgado , Gerald Zheyao Yin , Timothy D. Driscoll , James S. Papanu , Avi Tepman
IPC分类号： H05H1/46 , C23C16/44 , C23C16/455 , C23F4/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H05H1/42 , H05H1/00
CPC分类号： C23C16/45574 , C23C16/45576 , C23C16/45587 , H01J37/3244 , H01J37/32449
摘要： The invention is embodied in a gas injection apparatus for injecting gases into a plasma reactor vacuum chamber having a chamber housing, a pedestal holding a workpiece to be processed, a device for applying RF energy into the chamber, the gas injection apparatus having a gas supply containing an etchant species in a gas, an opening in the chamber housing, a gas distribution apparatus disposed within the opening in the chamber housing which has at least one slotted aperture facing the interior of the chamber and a device for controlling the flow rate of gas from the one or more slotted apertures, and a gas feed line from the supply to the gas distribution apparatus. In a preferred embodiment, the gas distribution apparatus includes a center member surrounded by at least one annular member with a gap therebetween comprising the slotted aperture. Preferably, each of the members of the gas distribution apparatus comprises a material at least nearly impervious to attack from the etchant species. In one example, each of the members of the gas distribution apparatus comprises one of a ceramic, fused quartz, polymeric or anodized aluminum material and the gas feed line comprises stainless steel. Preferably, each of the members has its surface polished prior to assembly of the gas distribution apparatus.
摘要翻译：本发明体现在一种用于将气体注入等离子体反应器真空室中的气体注入装置，其具有腔室壳体，保持要加工的工件的基座，用于将RF能量施加到腔室中的装置，该气体注入装置具有气体供应在气体中含有蚀刻剂物质，在腔室中的开口，设置在腔室中的开口内的气体分配装置，其具有面向腔室内部的至少一个开口孔，以及用于控制气体流速的装置从一个或多个开槽孔，以及从供给到气体分配装置的气体供给管线。在优选实施例中，气体分配装置包括由至少一个环形构件包围的中心构件，其间具有间隙，包括开槽孔。优选地，气体分配装置的每个构件包括至少几乎不受蚀刻剂物质侵蚀的材料。在一个示例中，气体分配装置的每个构件包括陶瓷，熔融石英，聚合物或阳极氧化铝材料中的一种，气体供给管线包括不锈钢。优选地，每个构件在气体分配装置的组装之前具有其表面抛光。

54. 外观设计

USD381030S Sputtering target 失效
公开(公告)号：USD381030S
公开(公告)日：1997-07-15
申请号：US47081
申请日：1995-11-21
申请人： Avi Tepman
设计人： Avi Tepman

55. 发明授权

US5516403A Reversing orientation of sputtering screen to avoid contamination 失效
标题翻译：溅射屏的反向取向以避免污染
公开(公告)号：US5516403A
公开(公告)日：1996-05-14
申请号：US357695
申请日：1994-12-16
申请人： John Forster , James S. Van Gogh , Avi Tepman
发明人： John Forster , James S. Van Gogh , Avi Tepman
IPC分类号： C23C14/34 , C23C14/56 , H01J37/34 , H01L21/203
CPC分类号： H01J37/3447 , C23C14/34 , C23C14/564 , H01J37/34
摘要： A sputtering apparatus deposits a layer of material on a substrate. The apparatus includes a screening member, such as a plate collimator or a tube collimator, located between the target and substrate. A motor drive reverses the respective positions of the two opposite sides of the screening device which respectively face the substrate and the target.
摘要翻译：溅射装置在衬底上沉积一层材料。该装置包括位于靶和衬底之间的屏蔽构件，例如板准直器或管准直器。电动机驱动器反转分别面对基板和目标的屏蔽装置的两个相对侧的相应位置。

56. 发明授权

US5484011A Method of heating and cooling a wafer during semiconductor processing 失效
标题翻译：在半导体处理期间加热和冷却晶片的方法
公开(公告)号：US5484011A
公开(公告)日：1996-01-16
申请号：US289989
申请日：1994-08-12
申请人： Avi Tepman , Howard Grunes , Dana Andrews
发明人： Avi Tepman , Howard Grunes , Dana Andrews
IPC分类号： C23C14/50 , H01J37/32 , H01L21/00 , H01L21/687 , H01L21/02
CPC分类号： H01L21/68721 , C23C14/50 , H01J37/32477 , H01J37/32623 , H01J37/32743 , H01J37/32862 , H01L21/67069 , Y10T29/41
摘要： A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.
摘要翻译：用于将晶片夹持到压板并调节晶片的温度的夹紧环和温度调节压板。夹紧环抵靠晶片的力由夹紧环的重量产生。屋顶屏蔽来自接收沉积颗粒的晶片和夹具之间的接口的所有除了几个接触区域，使得形成在晶片上的涂层在仅存在几个狭窄区域中与夹紧环连续接触，当狭缝区域当存在层是导电的。

57. 发明授权

US5380414A Shield and collimator pasting deposition chamber with a wafer support periodically used as an acceptor 失效
标题翻译：屏蔽和准直器粘贴沉积室与周期性地用作受体的晶片支架
公开(公告)号：US5380414A
公开(公告)日：1995-01-10
申请号：US75259
申请日：1993-06-11
申请人： Avi Tepman
发明人： Avi Tepman
IPC分类号： C23C14/34 , C23C14/56 , H01J37/32
CPC分类号： H01J37/32862 , C23C14/34 , C23C14/564
摘要： A deposition chamber includes a target and an acceptor for supporting a wafer during a deposition cycle. The acceptor is made out of a pasting material in order that a pasting cycle can be run periodically in the deposition chamber to form a barrier between the layers of the target material to prevent the layer of target material from becoming too thick and thereby cracking and flaking. A shield protects the interior of the chamber during a deposition cycle. A collimator may be present between the target and the acceptor. A plasma is formed in the chamber and selectively attracted toward the target for deposition of target material onto a wafer or toward the acceptor for pasting acceptor material onto the shield and the bottom of the collimator, if present. A plurality of wafers are cycled through the deposition chamber for depositing the deposition material on their surface. After the plurality of wafers, a pasting cycle is run, depositing the pasting material around the interior of the shield, on the collimator and on the target. The target is then cleaned of pasting material while using a dummy wafer in the deposition chamber.
摘要翻译：沉积室包括靶和用于在沉积循环期间支撑晶片的受体。受体由粘贴材料制成，以便可以在沉积室中周期性地运行粘贴循环，以在目标材料层之间形成阻挡层，以防止目标材料层变得太厚，从而破裂和剥落。屏蔽在沉积循环期间保护室的内部。目标和受体之间可能存在准直仪。在室中形成等离子体并选择性地朝向靶吸附，以将目标材料沉积到晶片上或朝向受体，以将受体材料粘贴到屏蔽件和准直仪的底部（如果存在）上。多个晶片循环通过沉积室，用于在其表面上沉积沉积材料。在多个晶片之后，运行粘贴循环，将粘贴材料围绕屏蔽件的内部，准直器和目标物体沉积。然后在沉积室中使用伪晶片的同时清除目标物的粘贴材料。

58. 发明授权

US5186718A Staged-vacuum wafer processing system and method 失效
标题翻译：分级真空晶圆加工系统及方法
公开(公告)号：US5186718A
公开(公告)日：1993-02-16
申请号：US685976
申请日：1991-04-15
申请人： Avi Tepman , Howard Grunes , Sasson Somekh , Dan Maydan
发明人： Avi Tepman , Howard Grunes , Sasson Somekh , Dan Maydan
IPC分类号： H01L21/00 , H01L21/677
CPC分类号： H01L21/67167 , H01L21/67184 , H01L21/67742 , Y10S148/006 , Y10S148/169 , Y10T29/41 , Y10T29/413
摘要： A processing system for workpieces such as semiconductor wafers is disclosed which incorporates multiple, isolated vacuum stages between the cassette load lock station and the main vacuum processing chambers. A vacuum gradient is applied between the cassette load lock and the main processing chambers to facilitate the use of a very high degree of vacuum in the processing chambers without lengthy pump down times. Separate robot chambers are associated with the vacuum processing chambers and the load lock(s). In addition, separate transport paths are provided between the two robot chambers to facilitate loading and unloading of workpieces. Pre-treatment and post-treatment chambers may be incorporated in the two transport paths.
摘要翻译：公开了一种用于诸如半导体晶片的工件的处理系统，其在盒加载锁定站和主真空处理室之间并入多个隔离的真空级。在盒式加载锁和主处理室之间施加真空梯度，以便在处理室中使用非常高的真空度，而不需要冗长的抽空时间。分离的机器人腔室与真空处理室和负载锁相关联。另外，在两个机器人室之间提供单独的输送路径，以便于加工和卸载工件。预处理和后处理室可以并入两个运输路径中。

59. 发明授权

US07459056B2 Pad conditioning head for CMP process 失效
标题翻译：用于CMP工艺的垫片调节头
公开(公告)号：US07459056B2
公开(公告)日：2008-12-02
申请号：US11927048
申请日：2007-10-29
申请人： Alexander S Polyak , Avi Tepman
发明人： Alexander S Polyak , Avi Tepman
IPC分类号： C23F1/00 , B24B1/00 , B24B49/00 , B24B7/00
CPC分类号： B24B53/017 , H01L21/31053
摘要： In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.
摘要翻译：在第一方面，提供了用于化学机械抛光（CMP）工艺的第一设备。第一装置包括（1）可旋转构件; （2）适于接收和保持调节盘的端部执行器; 和（3）设置在可旋转构件和末端执行器之间的弹性装置。弹性装置是（a）适于通过来自可旋转构件的扭矩旋转末端执行器，以及（b）柔性可伸展的，以便向末端执行器施加力，同时允许末端执行器偏离与可旋转构件，以便调节盘的调节表面与被调节的垫的不规则抛光表面相一致。提供了许多其它方面，包括使用液体或气体来阻止抛光浆料或碎屑进入调节头的方法和装置。

60. 发明申请

US20080279658A1 BATCH EQUIPMENT ROBOTS AND METHODS WITHIN EQUIPMENT WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY 审中-公开
标题翻译：装配设备的工艺和方法在设备工作中转让光伏工厂
公开(公告)号：US20080279658A1
公开(公告)日：2008-11-13
申请号：US11747372
申请日：2007-05-11
申请人： Robert Z. Bachrach , Avi Tepman , Alexander S. Polyak
发明人： Robert Z. Bachrach , Avi Tepman , Alexander S. Polyak
IPC分类号： B65H1/00
CPC分类号： B25J15/0052 , B25J15/0226 , H01L21/67236 , H01L21/67276 , H01L21/67715 , H01L21/67721 , H01L21/67733 , H01L21/67736 , H01L21/67742 , H01L21/67748
摘要： The present invention generally comprises equipment for an automated high volume batch work-piece manufacturing factory comprising work-piece handling and work-piece processing in a high productivity factory architecture capable of producing 1,000 or more work-piece an hour. The work-pieces may be presented to the equipment from a stacked supply to a parallel array. Additionally, the work-pieces may be transferred between manufacturing architectures by an array to array batch transfer. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation. The robotic operations may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.
摘要翻译：本发明通常包括用于自动化大批量批量工件制造工厂的设备，其包括能够每小时生产1,000个或更多个工件的高生产率工厂结构中的工件处理和工件加工。工件可以从堆叠的供应提供给设备到并行阵列。另外，工件可以通过阵列在制造架构之间转移到阵列批量传输。工件可以在并行批量传输操作的同时在制造架构内转移。机器人操作可以在机器人设备之间，机器人设备和处理设备之间以及处理设备内。

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