专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5868847A Clamp ring for shielding a substrate during film layer deposition 失效
标题翻译：用于在膜层沉积期间屏蔽衬底的夹环
公开(公告)号：US5868847A
公开(公告)日：1999-02-09
申请号：US358161
申请日：1994-12-16
申请人： Aihua Chen , Zheng Xu , Howard Grunes , Avi Tepman , Igor Kogan
发明人： Aihua Chen , Zheng Xu , Howard Grunes , Avi Tepman , Igor Kogan
IPC分类号： C23C14/50 , C23C16/458 , H01L21/20 , H01L21/203 , H01L21/205 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68721 , C23C14/50 , C23C16/4585
摘要： A chamber for depositing a film layer on a substrate includes a support member on which the substrate is positioned for processing in the chamber, and a clamp ring suspended in the chamber on a chamber shield. The support member is positionable in the chamber to receive a substrate thereon, and further positionable to pass the substrate through the shield and thereby lift the clamp ring off the shield. After deposition is complete, the support member retracts through the shield, to reposition the clamp on the shield. In the event that a deposition material layer has formed between the substrate and the clamp ring, the clamp ring includes a plurality of actuators thereon which force the substrate out of the clamp ring as the clamp ring is repositioned on the shield.
摘要翻译：用于在衬底上沉积膜层的腔室包括支撑构件，衬底被定位在其上用于在腔室中进行处理，以及在室屏蔽罩上悬挂在腔室中的夹紧环。支撑构件可定位在腔室中以在其上接收衬底，并且还可定位成使衬底穿过屏蔽件，从而将夹紧环提离屏蔽。沉积完成后，支撑构件通过屏蔽件缩回，以将夹具重新定位在屏蔽上。在衬底和夹紧环之间形成沉积材料层的情况下，夹紧环包括多个致动器，当钳位环重新定位在屏蔽上时，该致动器迫使衬底离开夹紧环。

2. 发明授权

US06783639B2 Coils for generating a plasma and for sputtering 有权
公开(公告)号：US06783639B2
公开(公告)日：2004-08-31
申请号：US10052951
申请日：2002-01-17
申请人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
发明人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
IPC分类号： C23C1434
CPC分类号： H01J37/3438 , H01J37/3402
摘要： A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.

3. 发明授权

US06368469B1 Coils for generating a plasma and for sputtering 失效
公开(公告)号：US06368469B1
公开(公告)日：2002-04-09
申请号：US08851946
申请日：1997-05-06
申请人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
发明人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
IPC分类号： C23C1434
CPC分类号： H01J37/3438 , H01J37/3402
摘要： A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.

4. 发明申请

US20060070875A1 Coils for generating a plasma and for sputtering 有权
公开(公告)号：US20060070875A1
公开(公告)日：2006-04-06
申请号：US11229139
申请日：2005-09-15
申请人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
发明人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard Grunes , Avi Tepman , John Forster , Praburam Gopalraja
IPC分类号： C23C14/00 , C25B11/00
CPC分类号： C23C14/34 , H01J37/321 , H01J37/34
摘要： A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.

5. 发明授权

US06254746B1 Recessed coil for generating a plasma 失效
标题翻译：用于产生等离子体的嵌入式线圈
公开(公告)号：US06254746B1
公开(公告)日：2001-07-03
申请号：US08853024
申请日：1997-05-08
申请人： Anantha Subramani , John C. Forster , Bradley O. Stimson , Sergio Edelstein , Howard Grunes , Avi Tepman , Zheng Xu
发明人： Anantha Subramani , John C. Forster , Bradley O. Stimson , Sergio Edelstein , Howard Grunes , Avi Tepman , Zheng Xu
IPC分类号： C23C1434
CPC分类号： H01J37/32504 , H01J37/321 , H01J37/32623 , H01J37/32651 , H01J37/34
摘要： A recessed coil for a plasma chamber in a semiconductor fabrication system is provided. Recessing the coil reduces deposition of material onto the coil which in turn leads to a reduction in particulate matter shed by the coil onto the workpiece.
摘要翻译：提供了一种用于半导体制造系统中的等离子体室的凹陷线圈。嵌入线圈减少材料在线圈上的沉积，这又导致线圈在工件上脱落的颗粒物质的减少。

6. 发明授权

US5763851A Slotted RF coil shield for plasma deposition system 失效
标题翻译：用于等离子体沉积系统的开槽RF线圈屏蔽
公开(公告)号：US5763851A
公开(公告)日：1998-06-09
申请号：US676599
申请日：1996-07-03
申请人： John Forster , Aihua Chen , Howard Grunes , Robert B. Lowrance , Ralf Hofmann , Zheng Xu , Fernand Dorleans
发明人： John Forster , Aihua Chen , Howard Grunes , Robert B. Lowrance , Ralf Hofmann , Zheng Xu , Fernand Dorleans
IPC分类号： H01J37/32 , B23K10/00
CPC分类号： H01J37/32477 , H01J37/321 , Y10S156/916
摘要： A coil shield assembly for an RF field coil in a plasma processing system includes a first shield positioned inside the coil. The first shield has a central opening substantially surrounding a central space of a processing chamber in which the plasma is maintained. At least one slot is formed in the first shield and extends therethrough. A barrier is positioned between the first shield and the coil and spaced apart from the first shield near the at least one slot. The slot permits an RF signal from the coil to couple with the plasma, and the first shield and the barrier are structured and arranged to prevent plasma ions or sputtered material from bombarding the coil by a direct path from the central space and through the at least one slot.
摘要翻译：用于等离子体处理系统中的RF场线圈的线圈屏蔽组件包括位于线圈内部的第一屏蔽件。第一屏蔽件具有基本上围绕处理室的中心空间的中心开口，其中维持等离子体。在第一屏蔽件中形成至少一个槽，并延伸穿过其中。屏障位于第一屏蔽和线圈之间，并且在靠近至少一个槽的位置处与第一屏蔽隔开。该槽允许来自线圈的RF信号与等离子体耦合，并且第一屏蔽和屏障被构造和布置成防止等离子体离子或溅射材料通过从中心空间的直接路径至少通过至少一个槽

7. 发明授权

US08398832B2 Coils for generating a plasma and for sputtering 有权
公开(公告)号：US08398832B2
公开(公告)日：2013-03-19
申请号：US11229139
申请日：2005-09-15
申请人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard E. Grunes , Avi Tepman , John C. Forster , Praburam Gopalraja
发明人： Jaim Nulman , Sergio Edelstein , Mani Subramani , Zheng Xu , Howard E. Grunes , Avi Tepman , John C. Forster , Praburam Gopalraja
IPC分类号： C23C14/34
CPC分类号： C23C14/34 , H01J37/321 , H01J37/34
摘要： A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.

8. 发明申请

US20050173239A1 End point detection for sputtering and resputtering 失效
标题翻译：溅射和再溅射的终点检测
公开(公告)号：US20050173239A1
公开(公告)日：2005-08-11
申请号：US10659902
申请日：2003-09-11
申请人： Sasson Somekh , Marc Schweitzer , John Forster , Zheng Xu , Roderick Mosely , Barry Chin , Howard Grunes
发明人： Sasson Somekh , Marc Schweitzer , John Forster , Zheng Xu , Roderick Mosely , Barry Chin , Howard Grunes
IPC分类号： C23C14/04 , C23C14/16 , C23C14/32 , C23C14/54 , C23C14/58 , G01N21/68 , H01J37/32 , H01L21/285 , H01L21/66 , H01L21/768
CPC分类号： C23C14/544 , C23C14/046 , C23C14/165 , C23C14/5833 , C23C14/5873 , G01N21/68 , H01J37/321 , H01J37/32477 , H01J37/32935 , H01J37/32963 , H01J37/3455 , H01L21/2855 , H01L21/76814 , H01L21/76844 , H01L21/76846 , H01L21/76862 , H01L21/76865 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window. Although deposition material may be deposited onto portions of the folded radiation path, in many applications, the deposition material will be sufficiently reflective to permit the emission spectra to be detected by a spectrometer or other suitable detector without significant signal loss. The etching or resputtering may be terminated when the detector detects that an underlying layer has been reached or when some other suitable process point has been reached.
摘要翻译：可以在溅射反应器系统中控制包括不透明金属导体材料的溅射材料层的等离子体蚀刻或再溅射。在一个实施例中，溅射沉积层的溅射在材料溅射沉积之后进行，并且另外的材料被溅射沉积到衬底上。位于系统的腔室内的路径将等离子体发射的光或其他辐射引导到腔室窗口或其他光学视图端口，其被屏蔽物保护以防止被导体材料沉积。在一个实施例中，辐射路径被折叠以将等离子体光围绕室屏蔽件并且通过窗口反射到位于室窗口外部的检测器。虽然沉积材料可以沉积在折叠辐射路径的部分上，但是在许多应用中，沉积材料将被充分反射，以允许发射光谱由光谱仪或其它合适的检测器检测，而没有显着的信号损失。当检测器检测到已经到达下层或者当达到某些其它合适的处理点时，蚀刻或再溅射可以被终止。

9. 发明授权

US09372724B2 System and method for conditional task switching during ordering scope transitions 有权
标题翻译：在订购范围转换期间进行条件任务切换的系统和方法
公开(公告)号：US09372724B2
公开(公告)日：2016-06-21
申请号：US14231789
申请日：2014-04-01
申请人： Zheng Xu , Tommi M. Jokinen , William C. Moyer
发明人： Zheng Xu , Tommi M. Jokinen , William C. Moyer
IPC分类号： G06F9/48
CPC分类号： G06F9/4843 , G06F9/461 , G06F9/48
摘要： A data processing system includes a processor core and a hardware module. The processor core performs tasks on data packets. The hardware module stores a first ordering scope identifier at a first storage location of the ordering scope manager. The first ordering scope identifier indicates a first ordering scope that a first task is operating in. The ordering scope manager increments the first ordering scope identifier to create a new ordering scope identifier. In response to determining that the processor core is authorized to transition the first task from the first ordering scope to a second ordering scope associated with the new ordering scope identifier, the ordering scope manager provides hint information to the processor core. The processor core transitions from the first ordering scope to the second ordering scope without completing a task switch in response to the hint information.
摘要翻译：数据处理系统包括处理器核心和硬件模块。处理器内核在数据包上执行任务。硬件模块在订购范围管理器的第一存储位置处存储第一订购范围标识符。第一个订购范围标识符指示第一个任务正在操作的第一个订购范围。订购范围管理器增加第一个订购范围标识符以创建新的订购范围标识符。响应于确定处理器核被授权将第一任务从第一排序范围转换到与新排序范围标识符相关联的第二排序范围，订购范围管理器向处理器核提供提示信息。处理器核心从第一订购范围转换到第二订购范围，而不响应于提示信息完成任务切换。

10. 发明授权

US08700878B2 Event triggered memory mapped access 有权
标题翻译：事件触发内存映射访问
公开(公告)号：US08700878B2
公开(公告)日：2014-04-15
申请号：US12485190
申请日：2009-06-16
申请人： William D. Schwarz , Joseph P. Gergen , Jason T. Nearing , Zheng Xu
发明人： William D. Schwarz , Joseph P. Gergen , Jason T. Nearing , Zheng Xu
IPC分类号： G06F12/00
CPC分类号： G06F12/0292 , G06F11/3636
摘要： In one or more embodiments, a data processing system can include at least one core capable of executing instructions of an instruction set architecture and a triggered memory map access (tMMA) system coupled to the at least one core. The tMMA system can receive one or more events and, in response, perform one or more actions. For example, the actions can include transactions which can include a write to a an address of the memory map, a read from an address of the memory map, a read followed by write to two respective addresses of the memory map, and/or a fetch transaction. A result of a transaction (e.g., data read, data written, error, etc.) can be used in generating a trace message. For example, the tMMA system can generate a trace message that includes the result of the transaction and send the trace message to a trace message bus.
摘要翻译：在一个或多个实施例中，数据处理系统可以包括能够执行指令集架构的指令的至少一个核心以及耦合到所述至少一个核心的触发的存储器映射访问（tMMA）系统。 tMMA系统可以接收一个或多个事件，并作为响应执行一个或多个动作。例如，动作可以包括可以包括对存储器映射的地址的写入，从存储器映射的地址的读取，随后写入存储器映射的两个相应地址的读取的事务，和/或提取事务。事务的结果（例如，数据读取，数据写入，错误等）可用于生成跟踪消息。例如，tMMA系统可以生成包含事务结果的跟踪消息，并将跟踪消息发送到跟踪消息总线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式