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    • 53. 发明申请
    • Method For Cleaning Fine Pattern Surface Of Mold, And Imprinting Device Using Same
    • 用于清洁模具的精细图案表面的方法和使用其的印刷装置
    • US20130224322A1
    • 2013-08-29
    • US13883844
    • 2011-11-11
    • Noritake ShizawaNaoaki YamashitaMasashi AokiTetsuhiro Hatogai
    • Noritake ShizawaNaoaki YamashitaMasashi AokiTetsuhiro Hatogai
    • B29C59/16B29C33/72
    • B29C59/16B29C33/72B81C1/00857B81C99/009G03F7/0002
    • A method for removing foreign matters attaching on a surface of a fine pattern of a mold, having the fine pattern being convexo-concave, at least on one surface thereof, thereby cleaning the fine pattern surface of the mold, and an imprinting device applying that method therein, without removing, comprises the following steps of: applying a photo-curable resin on a surface of a body to be transcribed, onto which the mold is suppressed, and thereby forming a photo-curable resin layer; suppressing the mold on the photo-curable resin, which is applied on the surface of the body to be transcribed; separating the photo-curable resin cured from the mold, after curing the photo-curable resin, and whereby taking the foreign matters attaching on the surface of the fine pattern into the photo-curable resin cured to remove them, wherein the photo-curable resin to be formed on the surface of the body to be transcribed is formed with such thickness that it can remove the foreign matters attaching on the fine pattern, and also the mold is suppressed onto the photo-curable resin, which is formed on the surface of the body to be transcribed, under such pressure that it can remove the foreign matters attaching on the fine pattern.
    • 至少在其一个表面上除去附着在具有凹凸的微细图案的模具的精细图案的表面上的异物从而清洁模具的精细图案表面的方法以及应用该模具的压印装置的方法 的方法,包括以下步骤:将光固化树脂施加到待转印体上的表面上,模具被抑制,从而形成光固化树脂层; 抑制施加在待转印体的表面上的光固化树脂上的模具; 分离固化光固化树脂后的光固化树脂,固化光固化树脂后,将附着在精细图案表面上的异物固化成光固化树脂以除去它们,其中光固化树脂 形成在被转印体的表面上的厚度形成为能够除去附着在细图案上的异物的厚度,并且还将模具抑制在形成在表面上的光固化树脂上 身体被转录,在这样的压力下,它可以消除附着在精细图案上的异物。
    • 54. 发明申请
    • IMPRINTING APPARATUS AND IMPRINT TRANSFER METHOD
    • 印刷设备和印刷传输方法
    • US20120025419A1
    • 2012-02-02
    • US13189759
    • 2011-07-25
    • Toshimitsu SHIRAISHINaoaki YamashitaMasashi Aoki
    • Toshimitsu SHIRAISHINaoaki YamashitaMasashi Aoki
    • B29C59/02
    • G03F7/0002B29C43/021B29C43/10B82Y10/00B82Y40/00
    • The present invention provides an imprinting apparatus or an imprint transfer method in which uniformity of curing quality by UV light is maintained and a uniform application thickness of a UV curable resin is achieved, even if glass is contaminated with dust and/or smudges or has a flaw. A feature of the present invention resides in an imprinting apparatus or an imprint transfer method that, while irradiating an transferred object with energy, transfers a concavo-convex configuration on a stamper's surface onto the transferred object and, subsequently, detaches the stamper from the transferred object, the imprint transfer method including: pressurizing a first reverse surface of at least one of the stamper and the transferred object with a planar pressurizing body having a flat surface configuration; subsequently, pressurizing a second reverse surface of at least one of the stamper and the transferred object with a fluid; and controlling pressurization timing of pressurization by the planar pressurizing body and pressurization by the fluid, thus completing the transfer.
    • 本发明提供了一种压印装置或压印转印方法,其中,即使玻璃被灰尘和/或污迹污染,也可以维持紫外线固化质量的均匀性并且可实现UV可固化树脂的均匀涂布厚度 缺陷。 本发明的一个特征在于一种压印装置或压印转印方法,其在能量照射被转印物体的同时,将压模表面上的凹凸结构传递到被转印物体上,随后将压模从转印的 所述压印转印方法包括:用具有平坦表面构型的平面加压体对所述压模和所转印的物体中的至少一个进行加压; 随后用流体对压模和被转移物体中的至少一个加压第二反面; 并且通过平面加压体控制加压的加压正时和流体的加压,从而完成转印。
    • 60. 发明授权
    • Wafer processing method
    • 晶圆加工方法
    • US07134942B2
    • 2006-11-14
    • US10936678
    • 2004-09-09
    • Yusuke NagaiMasashi AokiHitoshi Hoshino
    • Yusuke NagaiMasashi AokiHitoshi Hoshino
    • B24B1/00H01L21/463
    • B24B37/042B23K26/364B23K26/40B23K2101/40B23K2103/50H01L21/78
    • A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.
    • 一种晶片处理方法,用于沿着分割线分割形成在由表面上形成为格子图案的分割线划分的多个区域中的光学器件的晶片,该分割线包括施加激光束的激光束施加步骤 沿着分割线从其背面的一侧到晶片,以形成在后表面中具有预定深度的凹槽; 保护片固定步骤,将保护片固定在具有后表面的凹槽的晶片的前表面; 分割步骤,沿着所述凹槽分割具有固定在所述前表面上的所述保护片的所述晶片; 以及磨削步骤,在保护片固定在晶片上的状态下研磨沿着槽划分的晶片的背面,以去除凹槽。