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    • 41. 发明授权
    • Plasma processing apparatus and method
    • 等离子体处理装置及方法
    • US08231800B2
    • 2012-07-31
    • US12359691
    • 2009-01-26
    • Tsuyoshi MoriyaHiroyuki Nakayama
    • Tsuyoshi MoriyaHiroyuki Nakayama
    • B44C1/22
    • H01J37/32431H01J2237/022
    • There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma.
    • 提供了一种等离子体处理装置,其包括等离子体产生单元,用于在处理室中产生等离子体,其中对作为待处理对象的基板进行设定处理。 等离子体处理装置还包括一个粒子移动单元,用于在通过使用等离子体进行基板上的处理的同时,在处理室中的基板上方的区域中,将基板上方的区域中的颗粒静电驱动。 此外,提供了一种等离子体处理装置的等离子体处理方法,其包括以下步骤:在对作为被处理对象的基板进行设定处理的处理室中产生等离子体; 并通过等离子体对衬底进行处理。
    • 43. 发明授权
    • Method for cleaning elements in vacuum chamber and apparatus for processing substrates
    • 用于清洁真空室中的元件的方法和用于处理衬底的装置
    • US08137473B2
    • 2012-03-20
    • US10921947
    • 2004-08-20
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • B08B5/00B08B7/00
    • H01L21/67028B08B3/12H01J37/32862H01L21/6831
    • To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
    • 为了通过使颗粒粘附到元件上来清洁真空室中的元件散射,本发明使用了一种用于向元件施加电压并且通过利用麦克斯韦应力使颗粒散射的装置,用于对颗粒进行充电的装置和 通过利用库仑力使颗粒散射,用于将气体引入真空室中并通过使气体冲击波撞击元件而使颗粒粘附到元件上的装置,用于加热元件并引起 通过利用热应力和热压力来散射的颗粒,或通过对元件施加机械振动来使颗粒散射的装置。 通过在相对高压气氛中的气流中携带它们来除去如此散落的颗粒。
    • 47. 发明申请
    • METHOD FOR CHARGE-NEUTRALIZING TARGET SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS
    • 用于充电中和目标基板和基板处理装置的方法
    • US20100214712A1
    • 2010-08-26
    • US12710816
    • 2010-02-23
    • Jun YAMAWAKUJunji OikawaHiroyuki Nakayama
    • Jun YAMAWAKUJunji OikawaHiroyuki Nakayama
    • H05F3/04
    • H01L21/6833
    • A substrate processing apparatus includes a chamber; and a mounting table having an electrostatic attraction portion for electrostatically attracting a target substrate; a heat transfer gas supply system for injecting a heat transfer gas from the electrostatic attraction portion to the target substrate; and a separating unit by which the target substrate is separated from the electrostatic attraction portion. A method for charge-neutralizing a target substrate in the apparatus includes: supplying an ionized gas from the heat transfer gas supply system to the target substrate. The apparatus includes an irradiation unit for irradiating a soft X-ray or an UV beam toward the chamber. In the supplying of the ionized gas, the target substrate is separated from the electrostatic attraction portion by the separating unit, and a soft X-ray or an UV beam is irradiated from the irradiation unit toward a space between the target substrate and the electrostatic attraction portion.
    • 衬底处理设备包括:腔室; 以及具有用于静电吸引目标基板的静电吸引部的安装台; 用于将传热气体从静电吸引部分喷射到目标基板的传热气体供给系统; 以及分离单元,目标基板通过该分离单元与静电吸引部分分离。 一种用于对设备中的目标衬底进行电荷中和的方法包括:将来自传热气体供应系统的电离气体供应到目标衬底。 该装置包括用于向腔室照射软X射线或UV光束的照射单元。 在供给电离气体时,目标基板通过分离单元与静电吸引部分分离,并且从照射单元向目标基板和静电引力之间的空间照射软X射线或UV光束 一部分。
    • 48. 发明申请
    • TRANSFER CHAMBER AND METHOD FOR PREVENTING ADHESION OF PARTICLE
    • 转移室和防止颗粒粘结的方法
    • US20100202093A1
    • 2010-08-12
    • US12700771
    • 2010-02-05
    • Jun YAMAWAKUJunji OikawaHiroyuki Nakayama
    • Jun YAMAWAKUJunji OikawaHiroyuki Nakayama
    • H01L21/673H01L21/677H05F3/00
    • H01L21/67184H01L21/67069H01L21/67196H01L21/67201H01L21/67213H01L21/67742H01L21/6831
    • A transfer chamber is provided between a processing unit for performing a predetermined process on a target substrate to be processed in a depressurized environment and an atmospheric maintaining unit for maintaining the target substrate in an atmospheric environment to transfer the target substrate therebetween. The transfer chamber includes a chamber main body for accommodating the target substrate, a gas exhaust unit for exhausting the chamber main body to set the chamber main body to the depressurized environment, and a gas supply unit for supplying a predetermined gas to the chamber main body to set the chamber main body in the atmospheric environment. Further, in the transfer chamber, an ionization unit is provided outside the chamber main body, for ionizing the predetermined gas and an ionized gas supply unit is provided to supply the ionized gas generated by the ionization unit to the chamber main body.
    • 传送室设置在用于在减压环境中对要处理的目标基板进行预定处理的处理单元和用于将目标基板保持在大气环境中以在其间传送目标基板的大气保持单元。 传送室包括用于容纳目标基板的室主体,用于排出室主体以将室主体设置到减压环境的排气单元,以及用于将预定气体供应到室主体的气体供应单元 将室主体设置在大气环境中。 此外,在传送室中,离子化单元设置在室主体的外部,用于电离所述预定气体,并且提供电离气体供应单元以将由离子化单元产生的电离气体供应到室主体。
    • 49. 发明申请
    • PAPER CUTTING DEVICE AND A PRINTER WITH A PAPER CUTTING DEVICE
    • 纸张切割装置和具有纸切割装置的打印机
    • US20100003060A1
    • 2010-01-07
    • US12558689
    • 2009-09-14
    • YUKIHIRO HANAOKAHiroyuki Nakayama
    • YUKIHIRO HANAOKAHiroyuki Nakayama
    • B41J11/00B26D5/08
    • B41J11/663B26D1/305B26D5/14B26D11/00B41J3/44Y10T83/8799Y10T83/8828
    • A paper cutting device for cutting sheet material from the lengthwise edges of the material toward the middle comprising a stationary blade and first and second movable blades with the sheet material placed between the stationary blade and the first and second movable blades. The paper cutting device enables the spacing between the stationary blade and the first and second movable blades to be opened by moving the stationary blade frame and the movable blade frame relative to each other. The first movable blade and second movable blade are supported on a first stud and second stud, respectively, near the distal ends of the edge of the blade part of the stationary blade so that the paths of the blade tips overlap when cutting the sheet material. The movable blade drive mechanism drives the first movable blade and second movable blade with the first movable blade leading and the second movable blade following.
    • 一种用于从材料的纵向边缘向中间切割片材的切纸装置,包括固定刀片和第一和第二可动刀片,其中片材被放置在固定刀片与第一和第二可动刀片之间。 切纸装置通过相对于彼此移动固定刀片框架和可动刀片框架,能够使固定刀片与第一和第二可动刀片之间的间隔打开。 第一可动刀片和第二可动刀片分别支撑在固定刀片的刀片部分的边缘的远端附近的第一螺柱和第二螺柱上,使得当切割片材时刀片尖端的路径重叠。 可移动刀片驱动机构利用第一可动刀片引导件和第二可动刀片跟随来驱动第一可动刀片和第二可动刀片。