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41. 发明专利

JP2006115307A High-frequency amplifier and differential amplifier 审中-公开
标题翻译：高频放大器和差分放大器
公开(公告)号：JP2006115307A
公开(公告)日：2006-04-27
申请号：JP2004301669
申请日：2004-10-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UEDA HIROTAMI , SHINJO SHINTARO , MORI KAZUTOMI , HIEDA MORISHIGE , SUEMATSU KENJI , TAKAGI SUNAO
IPC分类号： H03F3/68 , H03F3/195 , H03F3/45
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency amplifier capable of suppressing its loop oscillation, and a differential amplifier to be used for the high-frequency amplifier.
SOLUTION: In the high-frequency amplifier, feeding to bases and collectors is performed with resistors, and the amplifier has amplifying stages connected into multiple stages and comprises a differential amplifier wherein high-frequency grounding of the common emitter or source of transistors 22 forming a differential pair is performed. Only a high-frequency grounding terminal for the common emitter or source of the differential amplifier is isolated from the grounding terminals of the other amplifying stages and is made independent, or a power terminal to which their connectors are connected is isolated from the power terminals of the other amplifying stages and is made independent.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够抑制其环路振荡的高频放大器以及用于高频放大器的差分放大器。解决方案：在高频放大器中，通过电阻对基极和集电极进行馈电，放大器具有多级连接的放大级，并且包括差分放大器，其中共发射极或晶体管源的高频接地形成差分对。只有差分放大器的共同发射极或源极的高频接地端子与其他放大级的接地端子隔离，并且独立于其连接器所连接的电源端子与电源端子其他放大级并独立完成。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2006081073A Transmitting/receiving circuit 审中-公开
标题翻译：发射/接收电路
公开(公告)号：JP2006081073A
公开(公告)日：2006-03-23
申请号：JP2004265275
申请日：2004-09-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHINJO SHINTARO , SUGANO TAKAYUKI , TSUTSUMI TSUNEJI , NAKAJIMA KENSUKE , SUEMATSU KENJI , TAKAGI SUNAO
IPC分类号： H04B1/44
摘要： PROBLEM TO BE SOLVED: To obtain a transmitting/receiving circuit enabling a high output at the time of the transmission and miniaturization of the circuit.
SOLUTION: Between a transmitting circuit 21 and a receiving circuit 23 in the transmitting/receiving circuit, a high-frequency input/output terminal 22 is provided for outputting a transmitting signal and inputting a receiving signal. The transmitting/receiving circuit has a function for separating transmission by the transmitting circuit 21 from reception by the receiving circuit 23. A single-pole single-throw switch 28 is loaded on a high-frequency signal line connecting the high-frequency input/output terminal 22 and the receiving circuit 23. Transmission and reception are switched by turning the single-pole single-throw switch 28 on and off.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：获得在电路传输时能够实现高输出并且使电路小型化的发送/接收电路。解决方案：在发送/接收电路中的发送电路21和接收电路23之间，提供高频输入/输出端22用于输出发送信号并输入接收信号。发送/接收电路具有通过发送电路21将接收电路23接收的发送分离的功能。单极单掷开关28被加载在连接高频输入/输出的高频信号线上端子22和接收电路23.通过打开和关闭单极单掷开关28来切换发送和接收。版权所有（C）2006，JPO＆NCIPI

43. 发明专利

JP2004356801A Multi-band oscillator 有权
标题翻译：多波段振荡器
公开(公告)号：JP2004356801A
公开(公告)日：2004-12-16
申请号：JP2003150340
申请日：2003-05-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KAGEYAMA CHIEMI , KAWAKAMI KENJI , TANIGUCHI EIJI , SUEMATSU KENJI , TAKAGI SUNAO , SOGABE YASUSHI , SUNAGA TERUMI , SHIMOZAWA MITSUHIRO , MORI KAZUTOMI , TAJIMA KENICHI , TSURU MASAOMI
IPC分类号： H03L7/18 , H03L7/08 , H03L7/183 , H04B1/3822 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To realize a multi-band oscillator having a plurality of desired bands capable of covering the frequency band of a plurality of communication systems by connecting a single oscillator with wideband frequency dividers by two, and to obtain a multi-band oscillator in which reduction in cost and size of a multi-band transceiver is realized. SOLUTION: The multi-band oscillator comprises a frequency synthesizer 1 corresponding to a communication system having a highest frequency band, n frequency dividers by two 2-1 to 2-n, n switches 3-1 to 3-n, an output terminal 4 connected with the n-th frequency divider by two 2-n, and a frequency control section 5 for controlling the frequency synthesizer 1 and the switches 3-1 to 3-n wherein the variable frequency range of the frequency synthesizer 1 is set at octave. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了实现具有能够通过将具有宽带分频器的单个振荡器连接两个而能够覆盖多个通信系统的频带的多个期望频带的多频带振荡器，并且获得多带式振荡器，其中实现了多频带收发器的成本和尺寸的降低。解决方案：多频带振荡器包括频率合成器1，其对应于具有最高频带的通信系统，n个分频器由2-1至2-n，n个开关3-1至3-n，输出端子4与第n分频器连接两个2-n，频率控制部分5用于控制频率合成器1和开关3-1至3-n，其中频率合成器1的可变频率范围为设置在八度。版权所有（C）2005，JPO＆NCIPI

44. 发明专利

JP2004193779A Mixer, receiver, and transmitter 审中-公开
公开(公告)号：JP2004193779A
公开(公告)日：2004-07-08
申请号：JP2002357061
申请日：2002-12-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SEKINE TOMOTSUGU , KAWAKAMI KENJI , SHIMOZAWA MITSUHIRO , TAKAGI SUNAO
IPC分类号： H03D7/12 , H03D7/14 , H04B1/26
摘要： PROBLEM TO BE SOLVED: To provide a mixer that can be downsized with less power consumption, and a receiver and a transmitter employing the mixer.
SOLUTION: In the mixer, a gate terminal 2 of a FET 1 is connected to ground in terms of DC via an inductor 5 with a high impedance, the gate terminal 2 receives an RF signal from an RF signal terminal 54, a converted IF signal is outputted from the drain terminal 3 to an IF signal terminal 55, a positive voltage is applied from a source voltage terminal 52 to a source terminal 4 of the FET 1 via an inductor 7 with a high impedance, and a positive voltage is applied from a drain voltage terminal 53 to the drain terminal 3 of the FET 1 via an inductor 9 with a high impedance.
COPYRIGHT: (C)2004,JPO&NCIPI

45. 发明专利

JP2003309483A High frequency module, active phased array antenna and communication equipment 审中-公开
标题翻译：高频模块，主动定时阵列天线和通信设备
公开(公告)号：JP2003309483A
公开(公告)日：2003-10-31
申请号：JP2002113758
申请日：2002-04-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IKEMATSU HIROSHI , TAKEUCHI NORIO , OWADA SATORU , OHASHI HIDEMASA , HIEDA MORISHIGE , MORI KAZUTOMI , TAKAGI SUNAO
IPC分类号： H01Q3/26 , H01Q13/08 , H04B1/18
摘要： PROBLEM TO BE SOLVED: To realize a small and low-cost high frequency module, which is used for a communication system using a microwave such as mobile satellite communication.
SOLUTION: A multilayer package 17 comprising a box-shaped cavity 17a wherein one face forms an opening part and a lid 17a covering the opening part, wherein the lid composed of multilayer substrates layered in the direction of its thickness, and in the cavity, the bottom part and four side walls are composed of multilayer substrates whose laying direction is the same as that of the lid is provided. An element antenna 31 is formed on the surface of the lid 17b of the multilayer package, and low noise amplifiers 2 and 9 are mounted on the rear face of the lid 17b. A 90° hybrid circuit 4 and low-pass filters 3 and 10 as well as low noise amplifiers 5 and 11 and phase shifters 6 and 17 are mounted in the cavity 17a. A ball grid array 21 for connection with a mother substrate 22 is provided on the bottom face of the cavity 17a.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：实现用于使用诸如移动卫星通信之类的微波的通信系统的小型和低成本的高频模块。解决方案：一种多层封装17，其包括盒形腔17a，其中一个面形成开口部分和覆盖开口部分的盖子17a，其中由沿其厚度方向分层的多层基板构成的盖子和空腔，底部和四个侧壁由多层基板构成，其布置方向与盖的方向相同。元件天线31形成在多层封装的盖17b的表面上，低噪声放大器2和9安装在盖17b的后表面上。 90°混合电路4和低通滤波器3和10以及低噪声放大器5和11以及移相器6和17安装在腔17a中。用于与母基板22连接的球栅阵列21设置在空腔17a的底面上。版权所有（C）2004，JPO

46. 发明专利

JP2003298222A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2003298222A
公开(公告)日：2003-10-17
申请号：JP2002098800
申请日：2002-04-01
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： FUJINO JUNJI , KITAMURA YOICHI , TAKEUCHI NORIO , TAKAGI SUNAO , IDETA GORO , MURAI JUNICHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To evenly solder inserted electrodes to through holes.
SOLUTION: Soldered connections 18 are formed by putting solder paste 13 in recesses 10a provided in an amount-of-protrusion regulating body 10 and disposing a substrate 15 on the regulating body 10 so that the through holes 16 of the substrate 15 may overlap the recesses 10a. Then the inserted electrodes 17 are inserted into the through holes 16 and the front end sections of the electrodes 17 are brought into contact with the bottom sections of the recesses 10a. While the front end sections of the electrodes 17 are abutted with the bottom sections of the recesses 10a, the solder paste 13 is melted to adhere to both the through holes 16 and electrodes 17.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：将插入的电极均匀地焊接到通孔中。解决方案：焊接连接18是通过将焊膏13放置在设置在突出量调节体10中的凹部10a中并将基板15设置在调节体10上而形成的，使得基板15的通孔16可以与凹部10a重叠。然后将插入的电极17插入到通孔16中，使电极17的前端部与凹部10a的底部接触。当电极17的前端部与凹部10a的底部抵接时，焊膏13熔化，从而与通孔16和电极17两者粘合。（C）2004，JPO

47. 发明专利

JP2002368566A Phase shift circuit and phase shifter 审中-公开
标题翻译：相移电路和相位变换器
公开(公告)号：JP2002368566A
公开(公告)日：2002-12-20
申请号：JP2001169450
申请日：2001-06-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MIYAGUCHI KENICHI , HIEDA MORISHIGE , KASAHARA MICHIAKI , TAKAGI SUNAO
IPC分类号： H01P1/185 , H03H7/20
摘要： PROBLEM TO BE SOLVED: To provide a phase shift circuit and a phase shifter, with which multi- bit operation can be achieved by one circuit, a circuit configuration can be made compact and simple and costs can be reduced.
SOLUTION: This device is provided with a capacitor 3a, a first serial circuit composed of an FET 2a and a capacitor 3b connected serially and a second serial circuit composed of an FET 2b and a capacitor 3c connected serially, one terminal of each of capacitor 3a, first serial circuit and second serial circuit is connected to a high frequency signal input/output terminal 1 and the other terminal is connected to the ground.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种移相电路和移相器，通过一个电路可以实现多位操作，可以使电路结构紧凑且简单，并且可以降低成本。解决方案：该器件设有电容器3a，由串联连接的FET 2a和电容器3b构成的第一串联电路和串联连接的FET 2b和电容器3c构成的第二串联电路，电容器3a的一端，第一串行电路和第二串行电路连接到高频信号输入/输出端子1，另一个端子连接到地。

48. 发明专利

JP2011072026A High-frequency amplifier and differential amplifier 有权
标题翻译：高频放大器和差分放大器
公开(公告)号：JP2011072026A
公开(公告)日：2011-04-07
申请号：JP2010270168
申请日：2010-12-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UEDA HIROTAMI , SHINJO SHINTARO , MORI KAZUTOMI , HIEDA MORISHIGE , SUEMATSU KENJI , TAKAGI SUNAO
IPC分类号： H03F3/68 , H03F3/195 , H03F3/45
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency amplifier capable of suppressing its loop oscillation, and a differential amplifier for use in the high-frequency amplifier. SOLUTION: A differential amplifier uses inductors 35, 36 for respective collector or drain loads of transistors 39, 40 constituting a differential couple. In the differential amplifier, resistors 33, 34 are connected in series to the respective inductors 35, 36. Otherwise, one-side terminals of the respective inductors 35, 36 are connected in common and then connected through the resistors to a power terminal 30. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够抑制其环路振荡的高频放大器和用于高频放大器的差分放大器。解决方案：差分放大器使用电感器35,36来构成构成差分耦合的晶体管39,40的相应集电极或漏极负载。在差分放大器中，电阻器33,34与各个电感器35,36串联连接。另外，各个电感器35,36的一侧端子共同连接，然后通过电阻器连接到电源端子30。版权所有（C）2011，JPO＆INPIT

49. 发明专利

JP2007189302A High frequency through-communication-signal line 有权
标题翻译：高频通信信号线
公开(公告)号：JP2007189302A
公开(公告)日：2007-07-26
申请号：JP2006003458
申请日：2006-01-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NISHINO TAMOTSU , KIYUUZAKI MORIYASU , TAKAGI SUNAO , FUJII YOSHIO
IPC分类号： H01P3/02 , H01L23/12 , H01P5/02 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a compact high frequency through-communication-signal line with less transmission loss even when a signal transmission direction of a signal line formed on a front side of a semiconductor substrate differs from a signal transmission direction of a signal line formed on a rear side of the semiconductor substrate. SOLUTION: The high frequency through-communication-signal line is characterized in such that a first through-conductor is formed on a position not overlapped with a perpendicular line from second and third through-conductors to a first front side ground conductor line, and the second through-conductor is formed on a position not overlapped with a perpendicular line from the third through-conductor to a second front side ground conductor line. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使当形成在半导体基板的正面上的信号线的信号传输方向与信号传输方向不同时，也能提供具有较少传输损耗的紧凑型高频通信信号线形成在半导体衬底的后侧的信号线。解决方案：高频通信信号线的特征在于，第一直通导体形成在与第二和第三直导体的垂直线不重叠的位置到第一前侧接地导体线并且第二贯通导体形成在不与从第三贯通导体到第二前侧接地导体线的垂直线重叠的位置。版权所有（C）2007，JPO＆INPIT

50. 发明专利

JP2006100676A Semiconductor integrated circuit 有权
标题翻译：半导体集成电路
公开(公告)号：JP2006100676A
公开(公告)日：2006-04-13
申请号：JP2004286652
申请日：2004-09-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TSUTSUMI TSUNEJI , SHINJO SHINTARO , SUEMATSU KENJI , INOUE MASAHIRO , MORI KAZUTOMI , HIEDA MORISHIGE , TAKAGI SUNAO
IPC分类号： H01L21/822 , H01L27/04
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit in which influences of noise or an interference signal are suppressed, even if an oscillator and a transmission amplifier are made into one chip, by configuring the oscillator to be immune to disturbance.
SOLUTION: In a semiconductor integrated circuit (1) disposing an oscillation circuit (3) and a transmission amplifier circuit (4) on the same chip, the oscillation circuit (3) is a differential voltage controlled oscillation circuit including a pair of varactor diode (6a, 6b), anode terminals or cathode terminals of the pair of varactor diodes (6a, 6b) are disposed proximately with each other, and the anode terminals or the cathode terminals are connected using a common signal line (7).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得抑制噪声或干扰信号的影响的半导体集成电路，即使将振荡器和发送放大器制成一个芯片，通过将振荡器配置为免受干扰。解决方案：在同一芯片上配置振荡电路（3）和发送放大电路（4）的半导体集成电路（1）中，振荡电路（3）是包括一对变容二极管（6a，6b），一对变容二极管（6a，6b）的阳极端子或阴极端子彼此靠近地设置，并且阳极端子或阴极端子使用公共信号线（7）连接。版权所有（C）2006，JPO＆NCIPI

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