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1. 发明专利

JP2013229358A Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013229358A
公开(公告)日：2013-11-07
申请号：JP2012098493
申请日：2012-04-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KAWASHIMA YUJI , SUDO SHINGO , MURAI JUNICHI
IPC分类号： H01L23/50 , H01L25/07 , H01L25/18
CPC分类号： H01L24/32 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of stably ensuring an insulation distance between a chip component and a lead frame, and to provide a method of manufacturing the same.SOLUTION: A semiconductor device includes a lead frame, a chip component, and a semiconductor element, and is resin-sealed. The lead frame has a projection portion 110 opposed to a non-electrode portion 20b of the chip component and projecting from the lead frame, the projection portion having a projection height over the height h of an electrode portion 20a of the chip component.
摘要翻译：要解决的问题：提供能够稳定地确保芯片部件和引线框架之间的绝缘距离的半导体器件，并提供其制造方法。解决方案：半导体器件包括引线框架，芯片部件，和半导体元件，并进行树脂密封。引线框架具有与芯片部件的非电极部分20b相对并从引线框突出的突出部分110，突出部分具有高于芯片部件的电极部分20a的高度h的突出高度。

2. 发明专利

JP2004063688A Semiconductor device and semiconductor assembly module 审中-公开
公开(公告)号：JP2004063688A
公开(公告)日：2004-02-26
申请号：JP2002218681
申请日：2002-07-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAYASHI KENICHI , KAWATO HISASHI , MURAI JUNICHI , IDETA GORO
IPC分类号： H01L23/50 , H01L23/433 , H01L23/495 , H05K3/30
CPC分类号： H05K3/308 , H01L23/4334 , H01L23/49541 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a means for permitting easily and surely mounting an insertion mount semiconductor device on an external substrate or the like by soldering. SOLUTION: In the semiconductor device 1, semiconductor elements 2, 3 are mounted on a lead frame 5 equipped with lead wires 4. The semiconductor elements 2, 3 are connected to the leads 4 by metallic fine wires 6, 7. The semiconductor device 1 is also equipped with a heat sink 8. Respective members 2-8 are sealed with a plastic package 10. The leads 4 are exposed to the outside of the plastic package. The terminal leads 4a-4d are provided with a wide first lead unit, a narrow second lead unit, a third lead unit inserted into the external substrate, and a projected gap regulating unit 9 for keeping a gap between the semiconductor device 1 and the external substrate in constant. The temperature raising property of the lead is improved by the increase of a thermal resistance of a heat dissipating route from the leads 4 toward the plastic package 10 whereby soldering property is improved. COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2011020153A Soldering device 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2011020153A
公开(公告)日：2011-02-03
申请号：JP2009167968
申请日：2009-07-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANABE TAKESHI , TANIGUCHI TOMOYUKI , MURAI JUNICHI , KAWAKAMI YUTAKA , TAKAHASHI NAOYA , SAKAO MASAYUKI
IPC分类号： B23K1/08 , B23K1/00 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device which can realize a highly reliable joint by controlling the height of a liquid surface of molten solder to suppress a soldering failure. SOLUTION: A soldering device 1 is a device in which a soldering object 10 is immersed in molten solder 2a and comprises a non-contact displacement gauge 3 that, in a state of non-contacting with the molten solder 2a, measures the height of a liquid level LS of the molten solder 2a, and a movement mechanism 5 that, based on the height of the liquid level LS measured with the non-contact displacement gauge 3, the travel distance of the soldering object 10 is controlled so that the soldering object 10 is immersed in the molten solder 2a. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过控制熔融焊料的液面的高度来抑制焊接故障来实现高可靠性接头的焊接装置。焊接装置1是将焊接对象物10浸渍在熔融焊料2a中并且包括非接触位移计3的装置，其在与熔融焊料2a不接触的状态下测量熔融焊料2a的液面LS的高度以及移动机构5，其基于用非接触式位移计3测量的液面LS的高度，控制焊接对象10的移动距离，使得将焊接对象10浸入熔融焊料2a中。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2009090333A Solder and solder feeder 有权
标题翻译：焊机和焊接机
公开(公告)号：JP2009090333A
公开(公告)日：2009-04-30
申请号：JP2007263486
申请日：2007-10-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YANAGIMOTO TATSUNORI , IDETA GORO , MURAKAMI KOHEI , FUJIMA YOSHIKO , MURAI JUNICHI
IPC分类号： B23K35/14 , B23K3/06
摘要： PROBLEM TO BE SOLVED: To prevent erroneous charge of a solder since it is difficult to correctly identify the composition and the composition ratio of the solder to be fed into a solder tank.
SOLUTION: A solder 8 having the first solder composition suitable for charging in a solder tank 1 and another solder 9 having the second solder composition different from the first solder composition and unsuitable for charging in the solder tank 1 are classified by using a bar-like solder so that the first and second sectional shapes of the solder 8 and another solder 9 in the surface orthogonal to their longitudinal direction are different (circular, rectangular) from each other corresponding to the first and second solder compositions. A solder feeder 10 has a solder pass limiting mechanism 6 having an opening part 7 of the opening shape corresponding to the sectional shape of the solder, and the opening part 7 is formed in such a shape that only the solder 8 to be fed to the solder tank 1 can be passed.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止焊料的错误充电，因为难以正确地识别要供给到焊料槽中的焊料的组成和组成比。解决方案：具有适于在焊料槽1中充电的第一焊料组合物的焊料8和具有不同于第一焊料组合物的第二焊料组成并且不适于在焊料槽1中充电的另一焊料9被分类为使用使得焊料8和与其纵向正交的表面中的另一焊料9的第一和第二截面形状与第一和第二焊料组合物相对不同（圆形，矩形）。焊料进料器10具有焊料通过限制机构6，该焊料通过限制机构6具有对应于焊料的截面形状的开口形状的开口部分7，并且开口部分7形成为只有焊料8被供给到锡罐1可以通过。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2005203693A Method for mounting connection sheet and surface-mounted component 审中-公开
标题翻译：安装连接片和表面安装部件的方法
公开(公告)号：JP2005203693A
公开(公告)日：2005-07-28
申请号：JP2004010666
申请日：2004-01-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MURAI JUNICHI , UEDA YOSHIYUKI
IPC分类号： H05K3/34
CPC分类号： H05K3/3478 , H05K3/3489 , H05K2203/0405
摘要： PROBLEM TO BE SOLVED: To provide a method for ensuring high-density packaging and mounting surface-mounted components including solders of high joint reliability.
SOLUTION: This component mount method connects a surface-mounted component 8 to an electrode 3 formed on a printed circuit board 1. It comprises a process for positioning a connection sheet 4 at the electrode 3 formed on the printed circuit board 1, a process for positioning the surface-mounted component 8 at the printed circuit board 1 in a way that the mounted component electrode 9 touches the connection sheet 4, and a process for dissolving the connection sheet 4. The connection sheet 4 has an adhesive flux film 20 formed on the surface of a solder sheet 10.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于确保高密度封装和安装包括具有高接头可靠性的焊料的表面安装部件的方法。解决方案：该组件安装方法将表面安装组件8连接到形成在印刷电路板1上的电极3.其包括将连接片4定位在形成在印刷电路板1上的电极3处的工艺，将表面安装部件8以安装的部件电极9接触连接片4的方式定位在印刷电路板1上的过程以及用于溶解连接片4的工艺。连接片4具有粘合剂焊剂膜 20形成在焊料片10的表面上。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004235196A Method for setting heating condition of heating furnace and reflow soldering device using it 审中-公开
标题翻译：用于设置加热炉加热条件的方法和使用它的回流焊接装置
公开(公告)号：JP2004235196A
公开(公告)日：2004-08-19
申请号：JP2003018473
申请日：2003-01-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MURAKAMI MASAAKI , IDETA GORO , MORI MITSUMASA , MURAI JUNICHI
IPC分类号： B23K31/02 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method for setting heating conditions by which the heating conditions satisfying reflow conditions to electronic parts having various heat characteristics can be set.
SOLUTION: The method for setting the heating conditions of a heating furnace for a reflow soldering device has a plurality of zones, in which reflow soldering is conducted by heating a substrate supplied with solder and the electronic part in the heating furnace. The method is composed of a process in which the heating conditions of two kinds or more of the heating furnaces are set and heating-furnace profiles containing the data of air temperatures in the heating furnaces and thermal conductivities are measured, a process in which the heating-furnace profiles under arbitrary heating conditions are obtained by interpolating the heating-furnace profiles at every zone, a process in which the temperatures of the electronic parts after a mere fragment of time are computed successively and temperature profiles are obtained, a process for deciding that temperature profiles satisfy the reflow conditions, and a process in which the condition settings of the heating furnaces are changed when the reflow conditions are not satisfied.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于设定满足回流条件的加热条件的加热条件的方法，其可以设定具有各种热特性的电子部件。解决方案：用于设置回流焊装置的加热炉的加热条件的方法具有多个区域，其中通过加热供应有焊料的基板和加热炉中的电子部件来进行回流焊接。该方法由将加热炉的2种以上的加热条件设定为加热炉的加热炉状态和加热炉内的空气温度数据的加热炉型材进行测定，在任意加热条件下的炉床型材通过在每个区域内插加热炉型材获得，其中连续计算仅仅片段时间之后的电子部件的温度并获得温度曲线的过程，确定温度曲线满足回流条件，并且当不满足回流条件时，加热炉的状态设置改变的过程。版权所有（C）2004，JPO＆NCIPI

7. 发明专利

JP2010283122A Solder bonding device, solder bonding part, solder bonding method, and method of manufacturing printed wiring board 有权
标题翻译：焊接接合装置，焊接接合部件，焊接接合方法和制造印刷电路板的方法
公开(公告)号：JP2010283122A
公开(公告)日：2010-12-16
申请号：JP2009134979
申请日：2009-06-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IDETA GORO , MURAI JUNICHI , YAMASHITA HIROYOSHI , SASAKI SHUNSUKE
IPC分类号： H05K3/34 , B23K1/00 , B23K1/005 , B23K1/08 , B23K3/04
摘要： PROBLEM TO BE SOLVED: To provide a solder bonding device, a solder bonding part and a solder bonding method that suppress occurrence of a bridge defect or icicle defect between adjacent electrodes when an electronic component having an electrode lead is mounted on a printed wiring board by soldering the electronic component to a through hole electrode of the printed wiring board, and to provide a method of manufacturing printed wiring board.
SOLUTION: A heating device 11 selectively heats solder 1 supplied to the through hole electrode 7 to delay solidification of the supplied solder 1. Consequently, occurrence of a bridge defect or icicle defect between adjacent electrode leads 6 can be suppressed.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种当具有电极引线的电子部件安装在印刷电路板上时，能够抑制相邻电极之间的桥接缺陷或冰柱缺陷的发生的焊接接合装置，焊接接合部和焊接接合方法通过将电子部件焊接到印刷电路板的通孔电极上的布线板，并提供制造印刷线路板的方法。解决方案：加热装置11选择性地加热提供给通孔电极7的焊料1，以延迟提供的焊料1的固化。因此，可以抑制相邻电极引线6之间的桥缺陷或冰柱缺陷的发生。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2009076727A Printed wiring board, electronic equipment using the same, and manufacturing method thereof 审中-公开
标题翻译：印刷电路板，使用该印刷电路板的电子设备及其制造方法
公开(公告)号：JP2009076727A
公开(公告)日：2009-04-09
申请号：JP2007244937
申请日：2007-09-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANABE TAKESHI , MURAI JUNICHI , IDETA GORO
IPC分类号： H05K3/34 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can prevent disconnection of a wiring pattern even when lead-free solder is used and is reliable, electronic equipment using the same, and a manufacturing method thereof.
SOLUTION: Disclosed is the printed wiring board 1 characterized in that a land 3 provided to a through hole 2 comprises a plurality of conductive layers. As a concrete example, the plurality of conductive layers comprise a first conductive layer 31 formed at an extension portion of the wiring pattern 5 and connected to the wiring pattern 5, and a second conductive layer 32 formed on a top surface side of the first conductive layer 31 and electrically and physically connected to the first conductive layer 31 at an end on the side of the through hole 2.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使在使用无铅焊料时也能够防止布线图案断开且可靠的印刷布线板，使用该布线板的电子设备及其制造方法。解决方案：公开了印刷电路板1，其特征在于，设置在通孔2上的焊盘3包括多个导电层。作为具体实例，多个导电层包括形成在布线图案5的延伸部分并连接到布线图案5的第一导电层31和形成在第一导电层的顶表面侧上的第二导电层32 层31，并且在通孔2的一侧的端部与第一导电层31电连接并物理连接。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2006245620A Method for manufacturing insertion-mounting type semiconductor device 有权
标题翻译：制造插入式半导体器件的方法
公开(公告)号：JP2006245620A
公开(公告)日：2006-09-14
申请号：JP2006167727
申请日：2006-06-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAYASHI KENICHI , KAWATO HISASHI , MURAI JUNICHI , IDETA GORO
IPC分类号： H01L23/50
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of being mounted easily and surely on an external substrate and the like through soldering. SOLUTION: A semiconductor device is provided with a first lead portion 21 with a large width, second lead portion 22 with narrow width, third lead portion 23, which is inserted into an external substrate, and gap control portion 9, which keeps a gap constant between the semiconductor device and the external substrate. The method for manufacturing the semiconductor device is configured, in such a way that the lead is formed by linearly cutting a lead frame having a broad portion corresponding to the first lead portion 21, narrow portion corresponding to the third lead portion 23, and tie bar portion 11, which couples the broad portion and narrow portion, and in which two notch portions 31 are formed in the region on the side of the narrow portion. Furthermore, both notch portions 31 are made to be located on both sides of the range of the narrow portion in terms of the lead width direction, located on the extension of both sides of the broad portion and is provided with the gap control means 9, in advance. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种能够通过焊接容易且可靠地安装在外部基板等上的半导体器件的制造方法。解决方案：半导体器件设置有具有宽度的第一引线部分21和窄的第二引线部分22，被插入到外部基板中的第三引线部分23和保持在外部基板中的间隙控制部分9 半导体器件和外部衬底之间的间隙常数。半导体器件的制造方法被构造成使引线通过直线切割具有与第一引线部分21相对应的宽部分的引线框架，对应于第三引线部分23的窄部分和连接杆部分11，其连接宽部分和窄部分，并且其中在狭窄部分侧面上的区域中形成有两个切口部分31。此外，两个切口部31被制成位于宽度方向上的狭窄部分的范围的两侧，位于宽部的两侧的延伸部上，并且设置有间隙控制装置9，提前。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006165048A Electronic circuit board assembly and its manufacturing method 审中-公开
标题翻译：电子电路板组件及其制造方法
公开(公告)号：JP2006165048A
公开(公告)日：2006-06-22
申请号：JP2004350047
申请日：2004-12-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MURAI JUNICHI , TANABE TAKESHI , KANETANI MASAO , KAWAKAMI YUTAKA
IPC分类号： H05K1/14 , H01R13/03 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit board assembly which is capable of being manufactured inexpensively and simply, and which can be reduced in size and is easy to repair. SOLUTION: The external electrode 40a of an electronic component 4a and a convex conductive pin 5 are connected to a plurality of conductive layers 2a, connected to printed wiring of a printed wiring board 1a with the aid of a solder 6a. Further, the external electrode 40b of an electronic component 4b and a concave conductive pin 8 are connected with a plurality of conductive layers 2b, connected to printed wiring of a printed wiring board 1b with a solder 6b. Then, the convex conductive pin 5 and the concave conductive pin 8 are fitted to each other. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够廉价且简单地制造并且可以减小尺寸并且易于修理的电子电路板组件。解决方案：电子部件4a的外部电极40a和凸形导电引脚5与多个导电层2a连接，导电层2a借助于焊料6a连接到印刷线路板1a的印刷布线。此外，电子部件4b的外部电极40b和凹状导电性引脚8与多个导电层2b连接，导电层2b与印刷布线基板1b的印刷布线用焊料6b连接。然后，凸形导电销5和凹形导电销8彼此嵌合。版权所有（C）2006，JPO＆NCIPI

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