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    • 45. 发明授权
    • Reference voltage generation circuit
    • 参考电压发生电路
    • US5838188A
    • 1998-11-17
    • US794773
    • 1997-02-03
    • Masao Taguchi
    • Masao Taguchi
    • G05F3/24G05F3/26G11C5/14G11C11/407H03F1/02H03G3/20H03K19/00G05F1/10
    • G05F3/262G11C5/147
    • A reference voltage generation circuit includes: a load unit having one end thereof connected to a higher voltage power supply line; an enhancement type n-channel MIS transistor having a drain thereof connected to the other end of the load unit, and a source thereof connected to a lower voltage power supply line; and a source follower circuit using a MIS transistor as a driving element, the source follower circuit having an input end thereof connected to the drain of the n-channel MIS transistor and having an output end thereof connected to a gate of the n-channel MIS transistor. A reference voltage is obtained at the drain of the n-channel MIS transistor. By the constitution, it is possible to obtain a stable reference voltage, and to incorporate the reference voltage generation circuit into an integrated circuit produced by integrating MIS transistors, without introducing an increase in production processes. It is also possible to reduce a consumed current of the reference voltage generation circuit.
    • 参考电压产生电路包括:负载单元,其一端连接到较高电压电源线; 增强型n沟道MIS晶体管,其漏极连接到负载单元的另一端,其源极连接到较低电压电源线; 以及使用MIS晶体管作为驱动元件的源极跟随器电路,源极跟随器电路的输入端连接到n沟道MIS晶体管的漏极,并且其输出端连接到n沟道MIS的栅极 晶体管。 在n沟道MIS晶体管的漏极处获得参考电压。 通过该结构,可以获得稳定的参考电压,并且将参考电压产生电路并入到通过集成MIS晶体管而生成的集成电路中,而不引入生产过程的增加。 也可以减小参考电压产生电路的消耗电流。
    • 50. 发明授权
    • Dynamic random access memory trench capacitor
    • 动态随机存取存储器沟槽电容器
    • US4803535A
    • 1989-02-07
    • US020983
    • 1987-03-02
    • Masao Taguchi
    • Masao Taguchi
    • G11C11/34H01L21/8242H01L27/108H01L29/92H01L29/78H01L27/02H01L49/02
    • H01L28/40H01L27/10829H01L27/10861
    • A dynamic random access memory having a trench capacitor includes: a semiconductor substrate; a trench formed in a semiconductor substrate; an insulating layer formed on an inner surface of the trench and having a bottom opening; a first conductive layer formed at the bottom opening position and on the insulating layer and the first conductive layer is ohmically connected to the semiconductor substrate at the bottom opening. The device includes further a dielectric layer formed on the first conductive layer; a second conductive layer formed on the dielectric layer so as to fill the trench, the first conductive layer, the dielectric layer, and the second conductive layer constituting a charge storage capacitor; and a MIS transistor formed in the semiconductor substrate, wherein the second conductive layer is ohmically connected to a source or drain region of the MIS transistor.
    • 具有沟槽电容器的动态随机存取存储器包括:半导体衬底; 形成在半导体衬底中的沟槽; 绝缘层,形成在所述沟槽的内表面上并具有底部开口; 在底部开口位置和绝缘层上形成的第一导电层和第一导电层在底部开口处欧​​姆连接到半导体衬底。 该器件还包括形成在第一导电层上的电介质层; 形成在电介质层上以便填充沟槽的第二导电层,构成电荷存储电容器的第一导电层,电介质层和第二导电层; 以及形成在所述半导体衬底中的MIS晶体管,其中所述第二导电层欧姆连接到所述MIS晶体管的源极或漏极区域。