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    • 1. 发明授权
    • Method of manufacturing semiconductor device using top antireflection
film
    • 使用顶部防反射膜制造半导体器件的方法
    • US5985519A
    • 1999-11-16
    • US960314
    • 1997-10-29
    • Yoko KakamuYuichiro Yanagishita
    • Yoko KakamuYuichiro Yanagishita
    • G03F7/11G03F7/09G03F7/20H01L21/027
    • G03F7/091Y10S430/151
    • A method of manufacturing a semiconductor device for patterning a semiconductor substrate by photolithography, the semiconductor substrate having a transparent or semitransparent layer having a high transmissivity at an exposure wavelength .lambda., and the transparent or semitransparent layer being formed on an underlying structure with a surface having a high reflectivity at the exposure wavelength .lambda.. The method comprises the steps of: forming a resist layer having a refractive index n.sub.r and a thickness d.sub.r on the transparent or semitransparent layer; forming a top antireflection film having a refractive index n.sub.a and a thickness d.sub.a on the resist layer; selectively exposing the resist layer via the top antireflection film with light having the exposure wavelength .lambda.; removing the top antireflection film; and developing a latent image in the resist layer to form a resist pattern, wherein an optical thickness n.sub.a d.sub.a of the top antireflection film and an optical thickness n.sub.r d.sub.r of the resist layer are selected so that a size change in the resist pattern becomes small even if the thickness of the transparent or semitransparent layer changes. This method provides an excellent size precision in patterning a transparent or semitransparent layer formed on a high reflectivity surface.
    • 一种通过光刻法制造半导体衬底图案化的半导体器件的方法,所述半导体衬底具有在曝光波长λ下具有高透射率的透明或半透明层,并且所述透明或半透明层形成在具有表面的基底结构上 曝光波长λ的高反射率。 该方法包括以下步骤:在透明或半透明层上形成具有折射率nr和厚度dr的抗蚀剂层; 在抗蚀剂层上形成具有折射率na和厚度da的顶部抗反射膜; 通过具有曝光波长λ的光通过顶部抗反射膜选择性地曝光抗蚀剂层; 去除顶部抗反射膜; 并且在抗蚀剂层中显影潜像以形成抗蚀剂图案,其中选择顶部抗反射膜的光学厚度nada和抗蚀剂层的光学厚度nrdr,使得抗蚀剂图案的尺寸变化变小,即使 透明或半透明层的厚度发生变化。 该方法在形成在高反射率表面上的透明或半透明层的图案化方面提供了优异的尺寸精度。