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41. 发明授权

US08679576B2 Plating apparatus and method of plating 有权
标题翻译：电镀装置及电镀方法
公开(公告)号：US08679576B2
公开(公告)日：2014-03-25
申请号：US12186919
申请日：2008-08-06
申请人： Toru Nakai , Satoru Kawai
发明人： Toru Nakai , Satoru Kawai
IPC分类号： B05D1/12
CPC分类号： H05K3/423 , C25D5/02 , C25D5/16 , C25D5/22 , C25D7/06 , C25D17/005 , H05K3/421 , H05K3/429 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2203/0143 , H05K2203/0257 , H05K2203/1545
摘要： A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.
摘要翻译：一种电镀装置和方法，用于在具有至少一个非通孔或通孔的印刷电路板的非通孔开口或通孔开口中执行电镀以形成通孔导体或通孔导体。电镀方法在印刷电路板的表面上与具有非通孔或通孔的印刷电路板接触，其中电镀液包括电镀成分和板金属，同时与柔性接触体的至少一部分接触。

42. 发明授权

US08581104B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08581104B2
公开(公告)日：2013-11-12
申请号：US12981709
申请日：2010-12-30
申请人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
发明人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC分类号： H05K1/03
CPC分类号： H05K3/108 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2203/107
摘要： A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
摘要翻译：布线基板包括含有树脂的绝缘层和具有粗糙表面的二氧化硅型填料，以及形成在绝缘层的粗糙化表面上的导电层，并且具有第一导电部分和与第二导电部分相邻的第二导电部分第一导电部分。绝缘层的粗糙表面在第一导电部分下方具有粗糙度，第二导电部分下方的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度部分被设定为小于第一导电部分下的粗糙度和第二导电部分下方的粗糙度中的至少一个。

43. 发明授权

US08383956B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US08383956B2
公开(公告)日：2013-02-26
申请号：US12342772
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K1/11
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.
摘要翻译：多层印刷电路板具有绝缘层，设置在绝缘层的第一侧上的第一导体层，设置在与第一侧相反的绝缘层的第二侧上的第二导体层，以及多个填充的通孔，第一导体层和第二导体层。填充的通孔分别具有上表面，并且每个上表面被制成使得每个上表面的最低点和最高点之间的差小于或等于约7μm。

44. 发明授权

US08198544B2 Printed wiring board and manufacturing method thereof 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08198544B2
公开(公告)日：2012-06-12
申请号：US12821196
申请日：2010-06-23
申请人： Toru Nakai , Masanori Tamaki
发明人： Toru Nakai , Masanori Tamaki
IPC分类号： H05K1/03
CPC分类号： H05K1/0242 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/15311 , H05K1/0216 , H05K1/0245 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K2201/09236 , H05K2201/098
摘要： A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T≦|W1−W2|≦0.73T where W1 represents a width of a space between upper surfaces of the first and second conductive circuits, W2 represents a width of a space between lower surfaces of the first and second conductive circuits, and T represents a thickness of each of the first and second conductive circuit.
摘要翻译：一种包括树脂绝缘层的印刷线路板和形成在树脂绝缘层之间的导电电路，使得导电电路之间的空间被树脂绝缘层的树脂材料填充。所述导体电路包括第一导电电路和邻近所述第一导电电路定位的第二导电电路，所述第一和第二导电电路中的每一个具有梯形横截面，并且所述第一和第二导电电路满足公式：0.10T＆nlE; | W1-W2 |＆nlE; 0.73T其中W1表示第一和第二导电电路的上表面之间的间隔的宽度，W2表示第一和第二导电电路的下表面之间的空间的宽度，T表示每个第一和第二导电电路的厚度。

45. 发明申请

US20100279034A1 Thermal transfer receiving sheet and its manufacturing method 有权
公开(公告)号：US20100279034A1
公开(公告)日：2010-11-04
申请号：US12801994
申请日：2010-07-07
申请人： Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Kyoko Uchida , Yoshimasa Tanaka , Yoshihiro Shimizu , Hideaki Shinohara , Masato Kawamura , Chikara Tsukada
发明人： Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Kyoko Uchida , Yoshimasa Tanaka , Yoshihiro Shimizu , Hideaki Shinohara , Masato Kawamura , Chikara Tsukada
IPC分类号： B41M5/41
CPC分类号： B41M5/44 , B41M2205/02 , B41M2205/06 , B41M2205/12 , B41M2205/32 , B41M2205/36 , B41M2205/38 , Y10T428/249953
摘要： The present invention provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp, wherein the moisture content of the entire thermal transfer receiving sheet is from 2 to 8 mass % and the moisture permeability of the entire receiving sheet is 400 g/m2·day or less; and a production method thereof. The present invention further provides a thermal transfer receiving sheet obtained by sequentially forming a hollow particle-containing intermediate layer and an image receiving layer on one surface of a sheet-like support mainly comprising cellulose pulp and providing a backside layer on another surface of the support, wherein the backside layer mainly comprises an acryl-based resin having a glass transition point (Tg) of 45° C. or less and contains a resin filler having an average particle diameter of 5 to 22 μm and the Bekk smoothness according to JIS P 8119 on the backside layer surface is 100 seconds or less.

46. 发明申请

US20100252308A1 PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20100252308A1
公开(公告)日：2010-10-07
申请号：US12821196
申请日：2010-06-23
申请人： Toru Nakai , Masanori Tamaki
发明人： Toru Nakai , Masanori Tamaki
IPC分类号： H05K1/03
CPC分类号： H05K1/0242 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/15311 , H05K1/0216 , H05K1/0245 , H05K3/28 , H05K3/4602 , H05K3/4644 , H05K2201/09236 , H05K2201/098
摘要： A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T≦|W1−W2|≦0.73T where W1 represents a width of a space between upper surfaces of the first and second conductive circuits, W2 represents a width of a space between lower surfaces of the first and second conductive circuits, and T represents a thickness of each of the first and second conductive circuit.
摘要翻译：一种包括树脂绝缘层的印刷线路板和形成在树脂绝缘层之间的导电电路，使得导电电路之间的空间被树脂绝缘层的树脂材料填充。所述导体电路包括第一导电电路和邻近所述第一导电电路定位的第二导电电路，所述第一和第二导电电路中的每一个具有梯形横截面，并且所述第一和第二导电电路满足公式：0.10T＆nlE; | W1-W2 |＆nlE; 0.73T其中W1表示第一和第二导电电路的上表面之间的间隔的宽度，W2表示第一和第二导电电路的下表面之间的空间的宽度，T表示每个第一和第二导电电路的厚度。

47. 发明申请

US20080299334A1 Thermal transfer receiving sheet 审中-公开
标题翻译：热转印接收片
公开(公告)号：US20080299334A1
公开(公告)日：2008-12-04
申请号：US12155432
申请日：2008-06-04
申请人： Chikara Tsukada , Masanori Ohashi , Toru Nakai , Kazuyuki Tachibana , Noriyuki Fujii , Mitsuru Tsunoda , Naoki Kubo
发明人： Chikara Tsukada , Masanori Ohashi , Toru Nakai , Kazuyuki Tachibana , Noriyuki Fujii , Mitsuru Tsunoda , Naoki Kubo
IPC分类号： B41M5/40
CPC分类号： B41M5/42 , B41M5/44 , B41M2205/02 , B41M2205/06 , B41M2205/32
摘要： A thermal transfer receiving sheet in which at least a low-density layer, barrier layer and image receiving layer are sequentially laminated on one side of a sheet-like support, wherein the low-density layer contains hollow particles, a hydrophobic resin adhesive and a hydrophilic resin adhesive, the hydrophobic resin adhesive is at least one type selected from the group consisting of acrylic acid ester-acrylonitrile copolymer, methacrylic acid ester-acrylonitrile copolymer, styrene-butadiene copolymer, butadiene-acrylonitrile copolymer, styrene-butadiene-acrylonitrile copolymer and polybutadiene, the glass transition temperature in accordance with JIS K 7121 is between −90 and 10° C., and the weight ratio between the hydrophobic resin adhesive and the hydrophilic resin adhesive is between 95/5 and 65/35.
摘要翻译：一种热转印接收片材，其中至少一层低密度层，阻挡层和图像接收层依次层压在片状载体的一面上，其中低密度层含有中空颗粒，疏水性树脂粘合剂和亲水性树脂粘合剂，疏水性树脂粘合剂为选自丙烯酸酯 - 丙烯腈共聚物，甲基丙烯酸酯 - 丙烯腈共聚物，苯乙烯 - 丁二烯共聚物，丁二烯 - 丙烯腈共聚物，苯乙烯 - 丁二烯 - 丙烯腈共聚物和聚丁二烯，根据JIS K 7121的玻璃化转变温度为-90〜10℃，疏水性树脂粘合剂和亲水性树脂粘合剂的重量比为95/5〜65/35。

48. 发明申请

US20080103043A1 Thermal Transfer Receiving Sheet 审中-公开
标题翻译：热转印接收表
公开(公告)号：US20080103043A1
公开(公告)日：2008-05-01
申请号：US11663475
申请日：2005-10-05
申请人： Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Yoshimasa Tanaka , Yoshihiro Shimizu , Masato Kawamura
发明人： Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Yoshimasa Tanaka , Yoshihiro Shimizu , Masato Kawamura
IPC分类号： B41M5/382
CPC分类号： B41M5/52 , B41M5/42 , B41M5/44 , B41M5/50 , B41M5/502 , B41M2205/02 , B41M2205/32 , B41M2205/38
摘要： A thermal transfer receiving sheet comprising: the sequential formation of an intermediate layer containing hollow particles and an image receiving layer on at least one side of a sheet-form substrate; wherein, the mean particle diameter of the hollow particles is 0.2 to 30 μm, the volumetric hollow rate is 40 to 95%, the printing smoothness (Rp value) of the surface of the image receiving layer as determined 10 msec after the start of pressurization at a printing pressure of 0.1 MPa using a microtopograph is 1.5 μm or less, and the 20° gloss in accordance with JIS Z 8741 is 80 or less.
摘要翻译：一种热转印接收片，包括：在片状基底的至少一侧上顺序地形成含有中空颗粒的中间层和图像接收层; 其中，中空粒子的平均粒径为0.2〜30μm，体积中空率为40〜95％，加压开始10秒后确定图像接收层的表面的印刷平滑度（Rp值）使用微照相印刷机的印刷压力为0.1MPa时为1.5μm以下，根据JIS Z 8741的20°光泽度为80以下。

49. 发明申请

US20050280130A1 Printed wiring board and production method for printed wiring board 有权
标题翻译：印刷电路板和印刷电路板的生产方法
公开(公告)号：US20050280130A1
公开(公告)日：2005-12-22
申请号：US11200077
申请日：2005-08-10
申请人： Toru Nakai
发明人： Toru Nakai
IPC分类号： C23C18/54 , H01L21/48 , H01L21/60 , H01L23/498 , H01L23/538 , H05K1/11 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/38 , H05K3/46 , H01L23/02
CPC分类号： H05K1/115 , C23C18/54 , H01L21/486 , H01L23/498 , H01L23/49816 , H01L23/49822 , H01L23/538 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16237 , H01L2224/45144 , H01L2224/81026 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/112 , H05K3/244 , H05K3/28 , H05K3/3463 , H05K3/383 , H05K3/4602 , H05K3/4644 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
摘要翻译：提供了包括频率特性优异的焊盘的印刷线路板。为此，通过在导体电路158或通孔160上设置单个锡层74来形成每个焊盘73。因此，与其上形成有两个金属层的现有技术的印刷线路板相比，可以增加信号传播速率。此外，由于缺乏镍层，可以降低制造成本，并且可以提高电特性。

50. 发明授权

US06242546B1 Process for producing vinyl polymers 失效
标题翻译：制备乙烯基聚合物的方法
公开(公告)号：US06242546B1
公开(公告)日：2001-06-05
申请号：US09026745
申请日：1998-02-20
申请人： Toru Nakai , Takesi Asada
发明人： Toru Nakai , Takesi Asada
IPC分类号： C08F238
CPC分类号： C08F4/32 , C08F2/38
摘要： The present invention provides a process for producing a vinyl polymer characterized in that, in a radical polymerization of a vinyl monomer, a substituted hydroxylamine represented by a general formula: in which R1 and R2 represent hydrogen, a (substituted) aliphatic hydrocarbon group having one or more carbon atom(s) or an aromatic hydrocarbon group) and/or general formula: (in which R3 and R4 represent a (substituted) aliphatic hydrocarbon group having one or more carbon atom(s) is added. A radically polymerized vinyl polymer having a high molecular weight and a restrained molecular weight distribution can be obtained by the process of the present invention, even under a polymerization condition at a high temperature. The present invention provides, therefore, a process enabling to produce vinyl polymers which promise to have practical properties such as appearance, mechanical properties and heat resistance useful as materials for various moldings and coatings. Thus, the industrial and technical value of the present invention is extremely high.
摘要翻译：本发明提供一种乙烯基聚合物的制造方法，其特征在于，在乙烯基单体的自由基聚合中，由以下通式表示的取代羟胺：其中R 1和R 2表示氢，具有一个（取代的）脂族烃基或更多的碳原子或芳族烃基）和/或通式（其中R 3和R 4表示具有一个或多个碳原子的（取代的）脂族烃基）。自由基聚合的乙烯基聚合物即使在高温聚合条件下，也可以通过本发明的方法获得具有高分子量和约束分子量分布的方法，因此本发明提供一种能够生产具有希望具有的乙烯基聚合物的方法实用性能如外观，机械性能和耐热性可用作各种模塑和涂料的材料本发明的技术价值非常高。

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