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1. 发明申请

US20120005888A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20120005888A1
公开(公告)日：2012-01-12
申请号：US13240626
申请日：2011-09-22
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K3/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
摘要翻译：一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料，在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案使得在基板的表面上形成导体电路。

2. 发明授权

US08197659B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US08197659B2
公开(公告)日：2012-06-12
申请号：US13240626
申请日：2011-09-22
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/06 , C25D5/08 , C25D5/22 , H05K3/02 , H05K3/06 , H05K3/42
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
摘要翻译：一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料，在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案使得在基板的表面上形成导体电路。

3. 发明申请

US20090107847A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20090107847A1
公开(公告)日：2009-04-30
申请号：US12342866
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.
摘要翻译：电镀方法包括在镀浴中提供物品，在电镀槽中用绝缘构件覆盖制品的表面，以及在使绝缘构件和制品相对于彼此移动中的同时对制品进行电解电镀。

4. 发明申请

US20090107711A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20090107711A1
公开(公告)日：2009-04-30
申请号：US12342772
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K1/11 , H05K1/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.
摘要翻译：多层印刷电路板具有绝缘层，设置在绝缘层的第一侧上的第一导体层，设置在与第一侧相反的绝缘层的第二侧上的第二导体层，以及多个填充的通孔，第一导体层和第二导体层。填充的通孔分别具有上表面，并且每个上表面被制成使得每个上表面的最低点和最高点之间的差小于或等于约7μm。

5. 发明授权

US07481909B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US07481909B2
公开(公告)日：2009-01-27
申请号：US11232906
申请日：2005-09-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D17/02 , B05C3/02 , C25D7/12
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.
摘要翻译：电镀装置包括镀浴，设置在电镀槽中的部件和移动装置。该构件构造成覆盖待镀表面。移动装置构造成使构件或表面相对移动以改变由构件覆盖的表面的区域。

6. 发明申请

US20060065534A1 Plating apparatus, plating method and multilayer printed circuit board 有权
公开(公告)号：US20060065534A1
公开(公告)日：2006-03-30
申请号：US11232906
申请日：2005-09-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.

7. 发明授权

US07897027B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US07897027B2
公开(公告)日：2011-03-01
申请号：US12342866
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/22 , C25D21/10 , C25D7/12
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.
摘要翻译：电镀方法包括在镀浴中提供物品，在电镀槽中用绝缘构件覆盖制品的表面，以及在使绝缘构件和制品相对于彼此移动中的同时对制品进行电解电镀。

8. 发明授权

US08383956B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US08383956B2
公开(公告)日：2013-02-26
申请号：US12342772
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K1/11
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.
摘要翻译：多层印刷电路板具有绝缘层，设置在绝缘层的第一侧上的第一导体层，设置在与第一侧相反的绝缘层的第二侧上的第二导体层，以及多个填充的通孔，第一导体层和第二导体层。填充的通孔分别具有上表面，并且每个上表面被制成使得每个上表面的最低点和最高点之间的差小于或等于约7μm。

9. 发明授权

US08679576B2 Plating apparatus and method of plating 有权
标题翻译：电镀装置及电镀方法
公开(公告)号：US08679576B2
公开(公告)日：2014-03-25
申请号：US12186919
申请日：2008-08-06
申请人： Toru Nakai , Satoru Kawai
发明人： Toru Nakai , Satoru Kawai
IPC分类号： B05D1/12
CPC分类号： H05K3/423 , C25D5/02 , C25D5/16 , C25D5/22 , C25D7/06 , C25D17/005 , H05K3/421 , H05K3/429 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2203/0143 , H05K2203/0257 , H05K2203/1545
摘要： A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.
摘要翻译：一种电镀装置和方法，用于在具有至少一个非通孔或通孔的印刷电路板的非通孔开口或通孔开口中执行电镀以形成通孔导体或通孔导体。电镀方法在印刷电路板的表面上与具有非通孔或通孔的印刷电路板接触，其中电镀液包括电镀成分和板金属，同时与柔性接触体的至少一部分接触。

10. 发明申请

US20140106961A1 PHOTOCATALYTIC COATING FILM AND METHOD FOR PRODUCING SAME 有权
标题翻译：光电涂层膜及其制造方法
公开(公告)号：US20140106961A1
公开(公告)日：2014-04-17
申请号：US14124292
申请日：2012-06-06
申请人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
发明人： Toru Nakai , Yoshinori Funaki , Toshikazu Nakamura
IPC分类号： B01J31/38 , B01J23/745
CPC分类号： B01J31/38 , B01J21/063 , B01J23/745 , B01J35/004 , B01J35/06 , B01J37/0215 , B01J37/0219 , G02B1/18 , G02B27/0006
摘要： Provided is a photocatalytic coating film that can develop excellent photocatalytic activity and exhibit superior adhesion to an adherend surface.The photocatalytic coating film is obtained by applying and drying a photocatalytic coating composition containing at least rod-like or needle-like titanium oxide particles and a binder component so that the photocatalytic coating film contains the titanium oxide particles in a content of 0.5 g/m2 or more. The photocatalytic coating film contains the titanium oxide particle in a content per unit volume (1 m2 by 1 μm thick) of less than 3.0 g. The titanium oxide particles preferably have an aspect ratio of 1.5 or more, the aspect ratio specified as the ratio of a long side length to a short side length of particle. The compositional ratio (by weight) of the titanium oxide particles to the binder component in the photocatalytic coating film is preferably from 1:6 to 30:1.
摘要翻译：提供了可以显现出优异的光催化活性并且表现出对被粘物表面的优异粘附性的光催化涂膜。通过涂布和干燥含有至少棒状或针状二氧化钛颗粒和粘合剂成分的光催化涂料组合物，使得光催化涂膜含有0.5g / m 2的氧化钛颗粒，得到光催化涂膜或者更多。光催化涂膜含有小于3.0g的每单位体积（1m 2×1μm）的氧化钛粒子。优选氧化钛粒子的纵横比为1.5以上，纵横比规定为长边长与粒子的短边长的比例。光催化性涂膜中的氧化钛粒子与粘合剂成分的组成比（重量比）优选为1:6〜30:1。

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