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1. 发明申请

US20110300307A1 METHOD FOR MANUFACTURING WIRING BOARD 审中-公开
标题翻译：制造接线板的方法
公开(公告)号：US20110300307A1
公开(公告)日：2011-12-08
申请号：US13150744
申请日：2011-06-01
申请人： Toru NAKAI , Tetsuo Amano , Atsushi Kamano , Yoshinori Takasaki
发明人： Toru NAKAI , Tetsuo Amano , Atsushi Kamano , Yoshinori Takasaki
IPC分类号： B05D5/12 , B05D3/06
CPC分类号： H05K3/0035 , B23K26/40 , B23K2101/42 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0373 , H05K2201/0209
摘要： A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.
摘要翻译：一种布线基板的制造方法，其特征在于，在绝缘层上形成导电图案，在导电图案上形成含有树脂和二氧化硅型填料的树脂绝缘层，照射具有吸收率的导体图案在30〜60％的近似范围内，使得到达导电图案的开口部分通过树脂绝缘层形成。树脂绝缘层中的二氧化硅型填料的量约为2〜60重量％。％。

2. 发明申请

US20120067632A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20120067632A1
公开(公告)日：2012-03-22
申请号：US13175381
申请日：2011-07-01
申请人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
发明人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC分类号： H05K1/02 , H05K3/10
CPC分类号： H05K3/027 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2203/0557 , H05K2203/107
摘要： A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
摘要翻译：一种印刷布线板的制造方法，其特征在于，在绝缘性树脂层上形成包含树脂和无机填料的绝缘性树脂层，形成具有导体的导体层，并且在导体上照射激光束使得导体被切断或者导体的宽度变窄，并且在绝缘树脂层上形成导电图案。无机填料的量为30wt。绝缘树脂层的％以上。

3. 发明授权

US08756803B2 Method for manufacturing printed wiring board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US08756803B2
公开(公告)日：2014-06-24
申请号：US13175381
申请日：2011-07-01
申请人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
发明人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC分类号： H05K3/02
CPC分类号： H05K3/027 , H05K3/4602 , H05K3/4652 , H05K2201/0209 , H05K2203/0557 , H05K2203/107
摘要： A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
摘要翻译：一种印刷布线板的制造方法，其特征在于，在绝缘性树脂层上形成包含树脂和无机填料的绝缘性树脂层，形成具有导体的导体层，并且在导体上照射激光束使得导体被切断或者导体的宽度变窄，并且在绝缘树脂层上形成导电图案。无机填料的量为30wt。绝缘树脂层的％以上。

4. 发明授权

US08581104B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08581104B2
公开(公告)日：2013-11-12
申请号：US12981709
申请日：2010-12-30
申请人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
发明人： Toru Nakai , Tetsuo Amano , Yoshinori Takasaki
IPC分类号： H05K1/03
CPC分类号： H05K3/108 , H05K1/0373 , H05K3/4673 , H05K2201/0209 , H05K2203/107
摘要： A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
摘要翻译：布线基板包括含有树脂的绝缘层和具有粗糙表面的二氧化硅型填料，以及形成在绝缘层的粗糙化表面上的导电层，并且具有第一导电部分和与第二导电部分相邻的第二导电部分第一导电部分。绝缘层的粗糙表面在第一导电部分下方具有粗糙度，第二导电部分下方的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度，以及第一导电部分和第二导电部分之间的粗糙度部分被设定为小于第一导电部分下的粗糙度和第二导电部分下方的粗糙度中的至少一个。

5. 发明授权

US08411576B2 Route control system and route control method in a switching apparatus 有权
标题翻译：交换设备中的路由控制系统和路由控制方法
公开(公告)号：US08411576B2
公开(公告)日：2013-04-02
申请号：US09931922
申请日：2001-08-20
申请人： Yoshinori Takasaki
发明人： Yoshinori Takasaki
IPC分类号： G01R31/08
CPC分类号： H04Q11/0478 , H04L2012/562 , H04L2012/5625
摘要： A route monitor control system includes a plurality of OAM cell handlers (OCHs); a plurality of virtual path handlers (VPHs); a plurality of virtual channel handlers (VCHs); trunks; and a control unit. The control unit issues an OAM (operation and maintenance) cell send instruction to a specific one of the plurality of OAM cell handlers, and carries out a loop back control to at least one of the virtual path handler, the virtual channel handler, and the trunk, which are associated with the specific OAM cell handler, as an object unit in response to the OAM cell send instruction. Also, when the specific OAM cell handler sends out an OAM cell from the specific OAM cell handler to the object unit in response to the OAM cell send instruction, the control unit determines a fault position based on returning or non-returning of the OAM cell from the object unit to the specific OAM cell handler.
摘要翻译：路线监视器控制系统包括多个OAM单元处理程序（OCHs）; 多个虚拟路径处理器（VPH）; 多个虚拟信道处理器（VCH）; 树干和控制单元。控制单元向多个OAM小区处理程序中的特定一个发送OAM（操作和维护）小区发送指令，并且对虚拟路径处理程序，虚拟通道处理程序和作为响应于OAM小区发送指令的对象单元，它们与特定OAM信元处理器相关联。此外，当特定的OAM小区处理器响应于OAM小区发送指令，从特定OAM小区处理器向对象单元发送OAM小区时，控制单元基于OAM小区的返回或不返回来确定故障位置从对象单元到特定的OAM单元处理程序。

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