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    • 43. 发明授权
    • Optically pumped semiconductor laser and method for producing the same
    • 光泵浦半导体激光器及其制造方法
    • US07023894B2
    • 2006-04-04
    • US10679153
    • 2003-10-10
    • Tony Albrecht
    • Tony Albrecht
    • H01S3/091H01S5/00
    • H01S3/091H01S3/092H01S3/0941H01S5/00H01S5/026H01S5/042H01S5/183H01S5/187H01S5/34H01S5/40
    • An optically pumped semiconductor laser device having a substrate (12) having a first main area (14) and a second main area (16), a pump laser (30) and a vertically emitting laser (40) optically pumped by the pump laser (30) being arranged on the first main area (14). The first main area (14) of the substrate (12) is patterned and has first regions (20) situated at a higher level and also second regions (18) situated at a lower level. The pump laser (30) is arranged on a region (20) situated at a higher level of the substrate (12), and the vertically emitting laser (40) is arranged above intermediate layers (50, 30′) on a region (18) situated at a lower level of the substrate (12). The height difference (Δ) between the first (20) and second (18) regions of the substrate (12) and the layer thickness of the intermediate layers (50, 30′) is chosen in such a way that the pump laser (30) and the vertically emitting laser (40) are situated at the same level. A substrate which is patterned in this way enables semiconductor layers of the pump laser and of the vertically emitting laser to be applied together in a single epitaxy step.
    • 一种具有第一主区域(14)和第二主区域(16)的基板(12)的光泵浦半导体激光装置,由泵浦激光器光泵浦的泵浦激光器(30)和垂直发射激光器(40) 30)布置在第一主区域(14)上。 衬底(12)的第一主区域(14)被图案化,并且具有位于更高级别的第一区域(20)以及位于较低级别的第二区域(18)。 泵浦激光器(30)布置在位于基板(12)的较高级的区域(20)上,并且垂直发射激光器(40)布置在区域(18)上的中间层(50,30')之上 )位于基底(12)的较低水平处。 选择基板(12)的第一(20)和第二(18)区域之间的高度差(Delta)和中间层(50,30')的层厚度,使得泵浦激光器 )和垂直发射激光器(40)位于同一水平。 以这种方式图案化的衬底使得泵浦激光器和垂直发射激光器的半导体层能够在单个外延步骤中一起施加。
    • 47. 发明申请
    • Radiation-Emitting Semiconductor Chip
    • 辐射发射半导体芯片
    • US20110272728A1
    • 2011-11-10
    • US12991864
    • 2009-04-17
    • Patrick RodeLutz HoeppelKarl EnglTony Albrecht
    • Patrick RodeLutz HoeppelKarl EnglTony Albrecht
    • H01L33/36
    • H01L25/167H01L33/0079H01L33/382H01L2924/0002H01L2924/00
    • A radiation-emitting semiconductor chip (1) is provided, which comprises a carrier (5), a semiconductor body (2) with a semiconductor layer sequence, a first contact (35) and a second contact (36). The semiconductor layer sequence comprises an active region (20) provided for generating radiation, which is arranged between a first semiconductor layer (21) and a second semiconductor layer (22). The carrier (5) comprises a major surface (51) facing the semiconductor body (2). The first semiconductor layer (21) is arranged on the side of the active region (20) facing the major surface (51) of the carrier (5) and is electrically contactable by means of the first contact (35). The second semiconductor layer (22) is electrically contactable by means of the second contact (36). A protection diode (4) is formed in a current path extending between the first contact (35) and the second contact (36) through the carrier (5).
    • 提供了一种辐射发射半导体芯片(1),其包括载体(5),具有半导体层序列的半导体本体(2),第一触点(35)和第二触点(36)。 半导体层序列包括设置在第一半导体层(21)和第二半导体层(22)之间的用于产生辐射的有源区(20)。 载体(5)包括面向半导体本体(2)的主表面(51)。 第一半导体层(21)布置在与载体(5)的主表面(51)相对的有源区域(20)的侧面上,并且可通过第一触点(35)电接触。 第二半导体层(22)可通过第二接触件(36)电接触。 保护二极管(4)形成在通过载体(5)在第一接触件(35)和第二接触件(36)之间延伸的电流通路中。