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    • 42. 发明授权
    • Semiconductor device and layout design method for the same
    • 半导体器件和布局设计方法相同
    • US08392856B2
    • 2013-03-05
    • US13013442
    • 2011-01-25
    • Akio MisakaYasuko TabataHideyuki AraiTakayuki Yamada
    • Akio MisakaYasuko TabataHideyuki AraiTakayuki Yamada
    • G06F17/50
    • H01L23/528G06F17/50G06F17/5072G06F2217/12H01L23/522H01L2924/0002Y02P90/265H01L2924/00
    • A semiconductor device includes: a plurality of line features including at least one real feature which includes a gate electrode portion, and at least one dummy feature. Two of multiple ones of the dummy feature, and at least one of the line features interposed between the two dummy features and including the at least one real feature form parallel running line features which are evenly spaced. The parallel running line features have an identical width, and line end portions of the parallel running line features are substantially flush. Line end portion uniformization dummy features are formed on extensions of the line end portions of the parallel running line features. The line end portion uniformization dummy features include a plurality of linear features each having a same width as each of the line features and spaced at intervals equal to an interval between each adjacent pair of the line features.
    • 半导体器件包括:多个线特征,包括至少一个实际特征,其包括栅电极部分和至少一个虚拟特征。 两个虚拟特征中的两个,并且插入在两个虚拟特征之间并且包括至少一个真实特征的线特征中的至少一个形成均匀间隔的并行运行线特征。 平行运行线特征具有相同的宽度,并行运行线特征的线端部分基本齐平。 线端部均匀化虚拟特征形成在平行运行线特征的线端部的延伸部上。 线端部均匀化虚拟特征包括多个线性特征,每个线性特征具有与每个线特征相同的宽度,并以等于每对相邻线特征之间的间隔间隔。
    • 46. 发明授权
    • Semiconductor memory device and method for fabricating same
    • 半导体存储器件及其制造方法
    • US07795662B2
    • 2010-09-14
    • US11822921
    • 2007-07-11
    • Hideyuki AraiTakashi Nakabayashi
    • Hideyuki AraiTakashi Nakabayashi
    • H01L27/108
    • H01L28/91H01L27/10811H01L27/10852H01L27/10888
    • A semiconductor memory device has a first interlayer insulating film formed on a semiconductor substrate and having a capacitor opening portion provided in the film, and a capacitance element formed over the bottom and sides of the capacitor opening portion and composed of a lower electrode, a capacitance insulating film, and an upper electrode. A bit-line contact plug is formed through the first interlayer insulating film. At least parts of respective upper edges of the lower electrode, the capacitance insulating film, and the upper electrode at a side facing the bit-line contact plug are located below the surface of the first interlayer insulating film, the lower electrode, the capacitance insulating film, and the upper electrode being located over the sides of the capacitor opening portion. The upper electrode is formed over only the bottom and sides of the capacitor opening portion.
    • 半导体存储器件具有形成在半导体衬底上并具有设置在膜中的电容器开口部分的第一层间绝缘膜,以及形成在电容器开口部分的底部和侧面上并由下部电极构成的电容元件, 绝缘膜和上电极。 通过第一层间绝缘膜形成位线接触插头。 下电极,电容绝缘膜和位于位线接触插塞的一侧的上电极的至少一部分位于第一层间绝缘膜的表面下方,下电极,电容绝缘层 膜,并且上电极位于电容器开口部分的侧面上。 上电极仅形成在电容器开口部的底部和侧面上。
    • 47. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07737480B2
    • 2010-06-15
    • US11826089
    • 2007-07-12
    • Ryo NakagawaTakashi NakabayashiHideyuki Arai
    • Ryo NakagawaTakashi NakabayashiHideyuki Arai
    • H01L31/062
    • H01L27/10888H01L27/0207H01L27/10811
    • A semiconductor memory device includes: a transistor formed in a substrate; a capacitor formed above one of source/drain regions of the transistor; a bit line formed above the substrate and extending in the gate length direction of the transistor; a first conductive plug connecting one of the source/drain regions and the capacitor; a second conductive plug connected to the other source/drain region that is not connected to the first conductive plug; and a third conductive plug formed on the second conductive plug and connected to the bit line. The central axis of the third conductive plug is displaced from the central axis of the second conductive plug in the gate width direction of the transistor.
    • 半导体存储器件包括:形成在衬底中的晶体管; 形成在所述晶体管的源/漏区之一上的电容器; 形成在衬底上并沿晶体管的栅极长度方向延伸的位线; 连接源极/漏极区域和电容器之一的第一导电插头; 连接到未连接到第一导电插头的另一个源极/漏极区域的第二导电插头; 以及形成在所述第二导电插头上并连接到所述位线的第三导电插塞。 第三导电插塞的中心轴线在晶体管的栅极宽度方向上从第二导电插头的中心轴线移位。